Powder, article, and method of manufacturing article

Patent metadata

Field	Value
Publication number	US-2024293865-A1
Application number	US-202418582863-A
Country	US
Kind code	A1
Filing date	Feb 21, 2024
Priority date	Mar 3, 2023
Publication date	Sep 5, 2024
Grant date	—

Abstract

Provided is a powder for shaping through irradiation with an energy beam, the powder including: a sublimable substance; and a sublimation suppression material, wherein the sublimation suppression material is an inorganic compound, and wherein particles of the sublimation suppression material adhere to part of surfaces of particles of the sublimable substance.

First claim

What is claimed is:

1 . A powder for shaping through irradiation with an energy beam, the powder comprising:
a sublimable substance; and a sublimation suppression material, wherein the sublimation suppression material is an inorganic compound, and wherein particles of the sublimation suppression material adhere to part of surfaces of particles of the sublimable substance.

2 . The powder according to claim 1 , wherein the particles of the sublimation suppression material adhere to 5% or more and 95% or less of the surfaces of the particles of the sublimable substance.

3 . The powder according to claim 1 , wherein a particle diameter of each of the particles of the sublimation suppression material is 1/10 or less of a particle diameter of each of the particles of the sublimable substance.

4 . The powder according to claim 1 , wherein an average particle diameter of the particles of the sublimation suppression material is 10 nm or more and 300 nm or less.

5 . The powder according to claim 1 , wherein an average particle diameter of the particles of the sublimable substance is 5 μm or more and 50 μm or less.

6 . The powder according to claim 1 , wherein, when a sublimation point of the sublimable substance is represented by Ts, one of a boiling point or a sublimation point of the sublimation suppression material is Ts/2 or more.

7 . The powder according to claim 1 , wherein the sublimation suppression material is one of an inorganic oxide, an inorganic nitride, or an inorganic carbide.

8 . The powder according to claim 1 , wherein the sublimation suppression material is at least one kind selected from SiO 2 , Al 2 O 3 , ZrO 2 , Y 2 O 3 , and MgO.

9 . The powder according to claim 1 , wherein a ratio of the sublimable substance is 98.5 mol % or more and 99.9 mol % or less, and a ratio of the sublimation suppression material is 0.1 mol % or more and 1.5 mol % or less, with respect to a total of the sublimable substance and the sublimation suppression material.

10 . The powder according to claim 1 , wherein the powder has a particle diameter distribution in which a plurality of peaks each having a frequency of 3% or more are present in a range of a particle diameter of from 0.5 μm to 200.0 μm.

11 . The powder according to claim 10 , wherein, when a first particle diameter of particles with a first peak of the plurality of peaks is represented by D(A) μm and a second particle diameter of particles with a second peak of the plurality of peaks is represented by D(B) μm, the powder satisfying the following formula (1):

0
.
1

≤

D
⁡
(
B
)

/

D
⁡
(
A
)

≤
0.8

(
1
)

12 . The powder according to claim 10 , wherein, when a first particle diameter of particles with a first peak of the plurality of peaks is represented by D(A) μm, a second particle diameter of particles with a second peak of the plurality of peaks is represented by D(B) μm, and D(A) is larger than D(B), and
wherein, when an integrated frequency ratio of the particles having a larger particle diameter than a particle diameter V between D(A) and D(B) is represented by F(A) and an integrated frequency ratio of the particles having a smaller particle diameter than the particle diameter V is represented by F(B), F(A) is larger than F(B).

13 . The powder according to claim 12 , wherein the integrated frequency ratio F(A) is 60% or more and 95% or less.

14 . The powder according to claim 1 , further comprising a eutectic formation material for forming a eutectic with the sublimable substance.

15 . The powder according to claim 14 , wherein a ratio “x” [mol %] of the eutectic formation material with respect to a total of the eutectic formation material and the sublimable substance satisfies one of the following formula (2) or (3):

Xe
/
4

≤
x
<

3
⁢
Xe
/
4

(
2
)

(

3
⁢
Xe

+
100

)

/
4

<
x
≤

(

Xe
+
300

)

/
4

(
3
)

in each of the formulae (2) and (3), Xe [mol %] represents a ratio of the eutectic formation material in a eutectic composition of the sublimable substance and the eutectic formation material.

16 . The powder according to claim 14 , wherein the sublimable substance is silicon carbide.

17 . The powder according to claim 14 , wherein the eutectic formation material is a metal boride.

18 . The powder according to claim 14 , wherein the eutectic formation material is at least one kind selected from HfB 2 , ZrB 2 , TiB 2 , TaB 2 , NbB 2 , CrB 2 , CrB, VB 2 , LaB 6 , B 4 C, W 2 B 5 , and WB 2 .

19 . The powder according to claim 14 , wherein particles of the eutectic formation material are different from the particles of the sublimable substance.

20 . The powder according to claim 14 , wherein a particle diameter of each of particles of the eutectic formation material is smaller than a particle diameter of eac

Assignees

• Canon Kk

Inventors

• Amano Shota
• Courquin Rika
• Shimano Tsutomu
• Okinaka Motoki
• Arai Yutaka

Classifications

• B22F2304/10

  Micron size particles, i.e. above 1 micrometer up to 500 micrometer · CPC title

• B22F2304/054

  Particle size between 1 and 100 nm · CPC title

• B22F2302/25

  Oxide · CPC title

• B22F2302/105

  Silicium carbide (SiC) · CPC title

• B22F2302/05

  Boride · CPC title