Display device

Patent metadata

Field	Value
Publication number	US-2024288724-A1
Application number	US-202118573922-A
Country	US
Kind code	A1
Filing date	Nov 4, 2021
Priority date	Jun 23, 2021
Publication date	Aug 29, 2024
Grant date	—

Abstract

Disclosed is a display device. The display device according to an aspect of the present disclosure may include: a display panel; a frame which is located in a rearward direction of the display panel, and to which the display panel is coupled; a first board including an IC chip and coupled to a rear of the frame; and a shield plate spaced apart from the first board, covering the first board, and coupled to the frame, wherein the shield plate comprises a recessed portion which protrudes toward the first board and which is in contact with the IC chip.

First claim

1 . A display device comprising:
a display panel; a frame which is located in a rearward direction of the display panel, and to which the display panel is coupled; a first board including an IC chip and coupled to a rear of the frame; and a shield plate spaced apart from the first board, covering the first board, and coupled to the frame, wherein the shield plate comprises a recessed portion which protrudes toward the first board and which is in contact with the IC chip.

2 . The display device of claim 1 , further comprising:
a substrate located between the display panel and the frame and including a plurality of light sources to provide light to the display panel; and a connector connected to the substrate and located between the first board and the substrate through an opening of the frame.

3 . The display device of claim 2 , wherein the connector overlaps at least a portion of the IC chip.

4 . The display device of claim 3 , further comprising a chip supporter located between the frame and the first board, and supporting the IC chip,
wherein the chip supporter comprises: a plate located between the frame and the first board; and a step which forms a rising step from the plate toward the IC chip, wherein the step contacts a rear surface of the first board on which the IC chip is mounted.

5 . The display device of claim 4 , wherein the chip supporter further comprises a hole formed to penetrate the plate,
wherein the hole is located adjacent to the step, and faces a rear surface of the IC chip.

6 . The display device of claim 1 , further comprising:
a second board located adjacent to the first board and fixed to the frame; and a back cover covering the first board and the second board and fixed to the frame, wherein the back cover comprises a heat dissipation plate which is located between the second board and the back cover, which is fixed to the back cover, and which is spaced apart from the second board.

7 . The display device of claim 6 , wherein the heat dissipation plate comprises:
a first heat dissipation plate fixed to the back cover; and a second heat dissipation plate which is larger than an area of the first heat dissipation plate and which covers the first heat dissipation plate.

8 . The display device of claim 7 , wherein the first heat dissipation plate comprises metal,
wherein the second heat dissipation plate comprises graphene resin.

9 . The display device of claim 8 , wherein the heat dissipation plate further comprises a third heat dissipation plate which is larger than an area of the second heat dissipation plate, and which covers the second heat dissipation plate.

10 . The display device of claim 9 , wherein the third heat dissipation plate comprises metal.

11 . The display device of claim 10 , wherein the back cover comprises:
a first ventilation hole which is located adjacent to an upper side of the first board, and which is formed long along the upper side of the first board; and a second ventilation hole which is located adjacent to a lower side of the first board, and which is formed long along the lower side of the first board.

12 . The display device of claim 10 , wherein the back cover comprises:
a third ventilation hole which is located adjacent to an upper side of the second board, and which is formed long along the upper side of the second board; and a fourth ventilation hole which is located adjacent to a lower side of the second board, and which is formed long along the lower side of the second board.

Assignees

• Lg Electronics Inc

Inventors

• Kong Junhee
• CHO Dongwoo
• Yoo Byungchun
• Jeon Sungho

Classifications

• G02F1/133382

  Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell · CPC title

• G02F1/133334

  Electromagnetic shields · CPC title

• G02F1/133612

  Electrical details · CPC title

• G02F1/133605

  including specially adapted reflectors · CPC title

• G06F1/20

  Cooling means · CPC title