Modular Liquid Cooling Architecture for Liquid Cooling

Patent metadata

Field	Value
Publication number	US-2024284635-A1
Application number	US-202418636967-A
Country	US
Kind code	A1
Filing date	Apr 16, 2024
Priority date	Nov 22, 2021
Publication date	Aug 22, 2024
Grant date	—

Abstract

A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.

First claim

1 . A method of housing and cooling computer hardware, the method comprising:
housing first computer hardware in an infrastructure module that also houses a (“PLC”); and immersing second computer hardware in evaporable liquid within a two phase immersion cooling system housed by a payload module, the payload module being located outside of the infrastructure module and the immersion cooling system being governed by the PLC.

2 . The method of claim 1 , comprising cooling the first computer hardware with a cooling arrangement included by the infrastructure module, the cooling arrangement of the infrastructure module comprising at least one of a liquid-air heat exchanger and an arrangement of metal plates connected by one or more conduits for carrying liquid.

3 . The method of claim 2 , comprising connecting the cooling arrangement of the infrastructure module and a condenser of the two phase immersion cooling system in parallel to a building liquid supply.

4 . The method of claim 2 , comprising connecting the cooling arrangement of the infrastructure module and the condenser in series to a building liquid supply.

5 . The method of claim 4 , comprising connecting the cooling arrangement of the infrastructure module and the condenser to the building liquid supply such that liquid is supplied by the building liquid supply to the cooling arrangement of the infrastructure module and is returned to the building liquid supply from the condenser.

6 . The method of claim 1 , comprising supplying electrical power to the payload module and the second computer hardware through the infrastructure module.

7 . The method of claim 1 , wherein the payload module is a first payload module, and comprising immersing third computer hardware in evaporable liquid in a tank housed by a second payload module that includes a two phase immersion cooling system, the two phase immersion cooling system of the second payload module being governed by the PLC.

Assignees

• Google Llc

Inventors

• Chiu Jerry
• Iyengar Madhusudan K

Classifications

• H05K7/20818

  within cabinets for removing heat from server blades · CPC title

• H05K7/20318

  Condensers · CPC title

• H05K7/20127

  Natural convection · CPC title

• H05K7/203 Primary

  by immersion · CPC title