Sockets having fine pitch 3d features

Patent metadata

Field	Value
Publication number	US-2024283197-A1
Application number	US-202318112583-A
Country	US
Kind code	A1
Filing date	Feb 22, 2023
Priority date	Feb 22, 2023
Publication date	Aug 22, 2024
Grant date	—

Abstract

An apparatus and method for fine tuning impedance in a pin arrangement of a socket are described. The socket has a socket body that contains a plurality of coupling bridges. Each coupling bridge contains: a surrounding portion that at least partially surrounds a via, and a stub portion extending from the ring-shaped portion. Pins inserted in a plurality of vias are arranged in pin pairs configured to support Double Data Rate (DDR) data signals. Each first pin of at least some of the pin pairs electromagnetically coupled to a second pin of these pin pairs using one of the coupling bridges.

First claim

What is claimed is:

1 . An apparatus for a socket, the apparatus comprising:
a socket body: a plurality of pins attached to the socket body, wherein the plurality of pins includes a first pin and a second pin adjacent to the first pin; and a metallic structure conductively coupled to the first pin and extending towards the second pin.

2 . The apparatus of claim 1 , wherein the metallic structure includes:
a ring-shaped portion that at least partially surrounds the first pin, and a stub portion extending from the ring-shaped portion, the stub portion configured to electromagnetically couple the first pin to the second pin.

3 . The apparatus of claim 2 , wherein the stub portion includes:
a stub that electromagnetically couples the first pin to the second pin, and an extension portion that connects the ring-shaped portion and the stub.

4 . The apparatus of claim 3 , wherein:
the stub portion extends from substantially a center of the ring-shaped portion, the stub is substantially rectangular, has a width that is at least similar or identical to that of the ring-shaped portion, and extends in a direction of extension of the coupling portion from the ring-shaped portion, and the extension portion is a thinner connector compared to the coupler.

5 . The apparatus of claim 4 , wherein the stub electromagnetically couples the first pin to a ring-shaped portion of a coupling bridge of the second pin, the ring-shaped portion of the second pin at least partially surrounding the second pin.

6 . The apparatus of claim 3 , wherein:
the stub portion extends from substantially a corner of the ring-shaped portion and forms a substantial “T” shape or “L” shape, and the stub is substantially rectangular, has a width that is at least similar to that of the ring-shaped portion, and extends in a direction perpendicular to a direction of extension of the stub portion from the ring-shaped portion.

7 . The apparatus of claim 3 , wherein:
the stub portion extends from the ring-shaped portion to form a substantial “T” shape or “L” shape, and the stub is substantially rectangular, extends in a direction perpendicular to a direction of extension of the stub portion from the ring-shaped portion, and has an insulating film disposed thereon that contacts the second pin.

8 . The apparatus of claim 3 , wherein:
one end of each of the first pin and second pin is configured to connect to an electronic substrate, the stub portion further comprises a tail that extends from the stub, and the stub is soldered to the one end of the first pin.

9 . The apparatus of claim 1 , wherein:
a printed circuit board (PCB) forms the socket body, the metallic structure is formed from conductive traces on multiple layers of the PCB, the conductive trace of each layer connected at multiple locations to the conductive trace of an adjacent layer through vias, and ends of the pins extend from the PCB.

10 . The apparatus of claim 1 , wherein:
the socket body is formed from a printed circuit board (PCB) and a liquid crystal polymer (LCP)-based housing, the PCB is disposed on at least a portion of the LCP-based housing, and the metallic structure is formed from conductive traces on multiple layers of the PCB, the conductive trace of each layer connected at multiple locations to the conductive trace of an adjacent layer through vias.

11 . The apparatus of claim 10 , wherein:
the PCB is disposed over only the portion of the LCP-based housing, and for pins that extend through the PCB and the portion of the LCP-based housing: one end of the pins extends from the PCB and another end of the pins extends from the portion of the LCP-based housing.

12 . A system for transmitting signals between electronic devices, the system comprising:
a socket comprising:
a socket body that contains a plurality of coupling bridges formed therein, each coupling bridge having a first portion and a second portion extending from the first portion; and
a pin arrangement attached to the socket body, the pin arrangement including a first set of pin pairs and a second set of pin pairs, pins of each pin pair of the first set of pin pairs electromagnetically coupled together by the second portion of a different coupling bridge, pins of each pin pair of the second set of pin pairs isolated from each other.

13 . The system of claim 12 , wherein for each pin pair of the first set of pin pairs:
the first portion of the coupling bridge of the first pin is connected to and at least partially surrounds a first pin of the pin pair, and the second portion of the coupling bridge of the first pin comprises:
a stub that electromagnetically couples the first pin to a second pin of the pin pair, and
an extension portion that connects the first portion and the stub.

14 . The system of claim 13 , wherein:
the second portion extends from substantially a center of the first portion, and the stub extends in a direction of extension of the second portion from the first portion and couples the first pin to a first portion of a coupling bridge of the second pin.

15 . The system of claim 13 , wherein:
the second portion of the coupling bridge of the first pin extends from substantially a corner of the first portion and forms a substantial “T” shape or “L” shape, and the stub extends in a direction perpendicular to a direction of extension of the second portion from the first portion.

16 . The system of claim 13 , wherein:
the second portion of the coupling bridge of the first pin extends from the first portion to form a substantial “T” shape or “L” shape, and the stub extends in a direction perpendicular to a direction of extension of the second portion from the first portion and has an insulating film disposed thereon that contacts the second pin.

17 . The system of claim 12 , wherein:
a printed circuit board (PCB) forms the socket body, the coupling bridge is formed from conductive traces on multiple layers of the PCB, the conductive trace of each layer connected at multiple locations to the conductive trace of an adjacent layer through vias, and ends of the pins of each pin pair of the first set of pin pairs and each pin pair of the second set of pin pairs extend from the PCB.

18 . The system of claim 12 , wherein:
the socket body is formed from a printed circuit board (PCB) and a liquid crystal polymer (LCP)-based housing, the PCB is disposed on at least a portion of the LCP-based housing, and the coupling bridge is formed from conductive traces on multiple layers of the PCB, the conductive trace of each layer connected at multiple locations to the conductive trace of an adjacent layer through vias.

19 . A method of fabricating a socket, the method comprising:
providing a socket body that contains a plurality of coupling bridges therein, each coupling bridge containing:
a surrounding portion that at least partially surrounds a via, and
a stub portion extending from the surrounding portion; and
inserting pins into a plurality of vias, the pins arranged in pin pairs configured to support Double Data Rate (DDR) data signals, each first pin of at least some of the pin pairs electromagnetically coupled to a second pin of the at least some of the pin pairs using one of the coupling bridges.

20 . The method of claim 19 , wherein for each coupling bridge one of:
the stub portion extends from substantially a center of the surrounding portion, a stub extends in a direction of extension of the stub portion from the

Assignees

• Intel Corp

Inventors

• Mondal Saikat
• Tran Donald T
• Zhang Zhichao
• Nekkanty Srikant

Classifications

• H01R13/6474 Primary

  by variation of conductive properties, e.g. by dimension variations · CPC title

• H01R13/6461 Primary

  Means for preventing cross-talk · CPC title