Etched Coupling Structures for Bonded Photonic Dies

Patent metadata

Field	Value
Publication number	US-2024280767-A1
Application number	US-202418440193-A
Country	US
Kind code	A1
Filing date	Feb 13, 2024
Priority date	Feb 17, 2023
Publication date	Aug 22, 2024
Grant date	—

Abstract

An integrated photonic system including multiple photonic dies that are laterally aligned using contact between pairs of vertical surfaces. The vertical surfaces can be manufactured by defining, via photolithography processes for example, the shape of the vertical surfaces. Thereafter, the vertical surfaces can be aligned and engaged, thereby optically and mechanically intercoupling the multiple photonic dies.

First claim

What is claimed is:

1 . An integrated photonic system, comprising:
a first photonic die; and a second photonic die defining a cavity extending at least partially therethrough, wherein: the first photonic die extends at least partially into the cavity and is bonded to the second photonic die along a vertical direction; and one or more vertical surfaces of first photonic die contact one or more vertical surfaces of the second photonic die to form multiple noncontiguous contact points between the first photonic die and the second photonic die, thereby laterally aligning the first photonic die and the second photonic die.

2 . The integrated photonic system of claim 1 , wherein:
a portion of a first side of the first photonic die is shaped to define a first cavity; a portion of a first side of the second photonic die is shaped to define a first protrusion; and the first photonic die is positioned such that the first protrusion is positioned at least partially inside the first cavity to contact the first side of the second photonic die.

3 . The integrated photonic system of claim 2 , wherein:
the first protrusion has a curved cross-sectional shape; and the first cavity has a rectangular cross-sectional shape.

4 . The integrated photonic system of claim 2 , wherein:
the first protrusion has a curved cross-sectional shape; and the first cavity has a triangular cross-sectional shape.

5 . The integrated photonic system of claim 2 , wherein:
the first protrusion has a curved cross-sectional shape; and the first cavity has a curved cross-sectional shape.

6 . The integrated photonic system of claim 2 , wherein:
an additional portion of the first side of the photonic die is shaped to define a second cavity; an additional portion of the first side of the second photonic die is shaped to define a second protrusion; and the first photonic die is positioned such that the second protrusion is positioned at least partially inside the second cavity to contact the first side of the second photonic die.

7 . The integrated photonic system of claim 6 , wherein:
the second protrusion contacts the first side of the second photonic die at two non-contiguous points of contact.

8 . The integrated photonic system of claim 1 , wherein:
a portion of a first side of the first photonic die is shaped to define a first protrusion; a portion of a first side of the second photonic die is shaped to define a first cavity; and the first photonic die is positioned such that the first protrusion is positioned at least partially inside the first cavity to contact the first side of the first photonic die.

9 . The integrated photonic system of claim 8 , wherein:
an additional portion of the first side of the photonic die is shaped to define a second cavity; an additional portion of the first side of the second photonic die is shaped to define a second protrusion; and the first photonic die is positioned such that the second protrusion is positioned at least partially inside the second cavity to contact the first side of the second photonic die.

10 . The integrated photonic system of claim 8 , wherein:
the first protrusion has a curved cross-sectional shape; and the first cavity has a rectangular cross-sectional shape.

11 . The integrated photonic system of claim 8 , wherein:
the first protrusion has a curved cross-sectional shape; and the first cavity has a triangular cross-sectional shape.

12 . The integrated photonic system of claim 8 , wherein:
the first protrusion has a curved cross-sectional shape; and the first cavity has a curved cross-sectional shape.

13 . An integrated photonic system, comprising:
a first photonic die; and a second photonic die defining a cavity extending at least partially therethrough, wherein: the first photonic die extends at least partially into the cavity and is bonded to the second photonic die along a vertical direction; a first pair of vertical engagement surfaces provides at least one noncontiguous contact point between the first photonic die and the second photonic die; the first pair of vertical engagement surfaces are formed in a pair of adjacent sides of the first photonic die and the second photonic die; a first side of the pair of adjacent sides is shaped to define a first protrusion; a second side of the pair of adjacent sides is shaped to define a first cavity; and the first protrusion extends at least partially into the first cavity to contact the second side at one or more noncontiguous contact points.

14 . The integrated photonic system of claim 13 , wherein:
a surface of the first cavity forms a facet for a first set of waveguides; a surface of the first protrusion forms a facet for a second set of waveguides.

15 . The integrated photonic system of claim 14 , wherein:
the first protrusion has a rectangular cross-sectional shape; and the first cavity has a rectangular cross-sectional shape.

16 . The integrated photonic system of claim 14 , wherein:
the first protrusion contacts the second side of a plurality of noncontiguous contact points.

17 . The integrated photonic system of claim 14 , wherein:
the first side of the pair of adjacent sides is shaped to define a second protrusion; the second side of the pair of adjacent sides is shaped to define a second cavity; and the second protrusion extends at least partially into the second cavity to contact the second side at one or more additional noncontiguous contact points.

18 . An integrated photonic system, comprising:
a first photonic die; and a second photonic die defining a cavity extending at least partially therethrough, wherein: a wedge-shaped portion of the first photonic die extends at least partially into the cavity and is bonded to the second photonic die along a vertical direction; the wedge-shaped portion of the first photonic die comprises a first side and a second side opposite the first side; the first side of the wedge-shaped portion acts a facet for one or more waveguides of the first photonic die; the second side of the wedge-shaped portion acts a facet for one or more waveguides of the first photonic die; a first side of the second photonic die is shaped to define a first set of protrusions contacting the first side of the wedge-shaped portion; and a second side of the second photonic die is shaped to define a second set of protrusions contacting the second side of the wedge-shaped portion.

19 . The integrated photonic system of claim 18 , wherein:
each of the first set of protrusions acts a facet for one or more waveguides of the second photonic die.

20 . The integrated photonic system of claim 19 , wherein:
each of the second set of protrusions acts a facet for one or more waveguides of the second photonic die.

Assignees

• Apple Inc

Inventors

• Witmer Jeremy D
• Hill Jeffrey T
• Wu Yipin
• Wang Zhechao

Classifications

• G02B6/13 Primary

  Integrated optical circuits characterised by the manufacturing method · CPC title

• G02B6/423 Primary

  using guiding surfaces for the alignment · CPC title