Sensing assembly

Patent metadata

Field	Value
Publication number	US-2024272015-A1
Application number	US-202218569784-A
Country	US
Kind code	A1
Filing date	Jun 14, 2022
Priority date	Jun 14, 2021
Publication date	Aug 15, 2024
Grant date	—

Abstract

The present disclosure provides a core temperature sensing assembly for measuring a core temperature of an object when positioned on a surface of the object. The sensing assembly uses a heat flux sensor in the form of a thermoelectric generator. The thermoelectric generator is provided as part of an integrated circuit. Alternatively or additionally, the sensing assembly uses the thermoelectric generator to actively heat or cool the object. Alternatively or additionally, the sensing assembly comprises a second heat flux sensor in the form of a thermoelectric generator, the first and second heat flux sensors having different thermal resistances determined by the configuration of the thermocouples.

First claim

1 . A core temperature sensing assembly to determine a core temperature of an object when positioned on a surface of the object, comprising:
a first sensor device for placement at a first surface location, the first sensor device comprising:
a first heat flux sensor configured to measure heat flux at the first surface location and output a first heat flux signal relating to the measured heat flux; and
a first temperature sensor configured to measure a temperature at the first surface location and output a first temperature signal relating to the measured temperature,
wherein the first heat flux sensor is a first thermoelectric generator (TEG); and
wherein the core temperature sensing assembly comprises a first integrated circuit comprising the first TEG.

2 . The core temperature sensing assembly of claim 1 , wherein the first integrated circuit further comprises the first temperature sensor.

3 . The core temperature sensing assembly of claim 2 ,
wherein the first integrated circuit comprises a substrate and the first TEG comprises at least one thermocouple provided in or on the substrate; and wherein the first temperature sensor is located proximate to or in contact with the at least one thermocouple of the first TEG.

4 . The core temperature sensing assembly of claim 3 , wherein the first temperature sensor is located on or adjacent to one of: a backside of the substrate, and a frontside of a capping layer provided over the at least one thermocouple.

5 . The core temperature sensing assembly of claim 1 , further comprising a second sensor device for placement at a second surface location, the second sensor device comprising:
a second heat flux sensor configured to measure heat flux at the second surface location and output a second heat flux signal relating to the measured heat flux; and a second temperature sensor configured to measure temperature at the second surface location and output a second temperature signal relating to the measured temperature, wherein the second heat flux sensor is a second thermoelectric generator (TEG).

6 . The core temperature sensing assembly of claim 5 further comprising second integrated circuit comprising the second TEG.

7 . The core temperature sensing assembly of claim 6 , wherein either (i) the first integrated circuit and the second integrated circuit are a single integrated circuit; or (ii) the first integrated circuit and the second integrated circuit are separate integrated circuits.

8 . The core temperature sensing assembly of claim 6 , wherein the second integrated circuit further comprises the second temperature sensor.

9 . The core temperature sensing assembly of claim 8 ,
wherein the second integrated circuit comprises a substrate and the second TEG comprises at least one thermocouple provided in or on the substrate; and wherein the second temperature sensor is located proximate to or in contact with the at least one thermocouple of the second TEG, wherein the first temperature sensor is located on or adjacent to one of: a backside of the substrate, and a frontside of a capping layer provided over the at least one thermocouple.

10 . The core temperature sensing assembly of claim 5 ,
wherein the first TEG has a first thermal resistance and the second TEG has a second thermal resistance; and wherein the first and second thermal resistances are different.

11 . The core temperature sensing assembly of claim 10 , wherein the first TEG has a first thermocouple configuration and the second TEG has a second thermocouple configuration, wherein the first thermocouple configuration and the second thermocouple configuration are different so as to provide the different first thermal resistance and second thermal resistance, optionally wherein the first thermocouple configuration and the second thermocouple configuration are determined by a number of thermocouples, the area of a substrate covered by the thermocouples, the thermal resistance of the materials used in the thermocouples, the height of the thermocouples, or any combination thereof.

12 . The core temperature sensing assembly of claim 10 , wherein one of the first or second TEG further comprises an insulating layer so as modify the thermal resistance.

13 . The core temperature sensing assembly of claim 1 , wherein the sensing assembly is further configured to cause the first TEG of the first sensor device to actively heat or cool the first surface location.

14 . (canceled)

15 . (canceled)

16 . A core temperature sensing system, comprising
a core temperature sensing assembly comprising:
a first sensor device for placement at a first surface location, the first sensor device comprising:
a first heat flux sensor configured to measure heat flux at the first surface location and output a first heat flux signal relating to the measured heat flux; and
a first temperature sensor configured to measure a temperature at the first surface location and output a first temperature signal relating to the measured temperature,
wherein the first heat flux sensor is a first thermoelectric generator (TEG); and
wherein the sensing assembly comprises a first integrated circuit comprising the first TEG; and

a controller configured to:
receive the first heat flux signal from the first heat flux sensor;
receive the first temperature signal from the first temperature sensor; and
calculate a core temperature based on the measured heat flux from the first heat flux signal and the measured temperature from the first temperature signal.

17 . (canceled)

18 . A method for determining a core temperature of an object, comprising:
receiving a first heat flux signal from a first heat flux sensor of a first sensor device relating to a measured first heat flux and receiving a first temperature signal from a first temperature sensor of the first sensor device relating to a measured first temperature, the first heat flux sensor being a first TEG and the first sensor device comprising a first integrated circuit comprising the first TEG; and calculating a core temperature based on the measured heat flux from the first heat flux signal and the measured temperature from the first temperature signal, optionally further comprising: receiving a second heat flux signal from a second heat flux sensor of a second sensor device relating to a second measured temperature and receiving a second temperature signal from a second temperature sensor of the second sensor device relating to a second measured heat flux, the second heat flux sensor being a second TEG and the second sensor device comprising a second integrated circuit comprising the first TEG; and calculating a core temperature based on the measured heat flux from the first heat flux signal, the measured temperature from the first temperature signal, the measured heat flux from the second heat flux signal and the measured temperature from the second temperature signal.

19 . (canceled)

20 . One or more non-transitory computer readable media having a computer program stored thereon, the computer program comprising computer program code which is configured, when said computer program is run on one or more physical computing devices, to cause said one or more physical computing devices to implement the method of claim 18 .

21 . The core temperature sensing system of claim 16 ,
wherein the core temperature sensing assembly further comprises a second sensor device for placement at a second surface location, the second sensor device comprising:

Assignees

• Analog Devices International Unlimited Co

Inventors

• Cornett Jane
• Yuan Yi
• Chen Baoxing
• Curtin Ciaran

Classifications

• G01K1/026

  arrangements for monitoring a plurality of temperatures, e.g. by multiplexing · CPC title

• G01K17/00

  Measuring quantity of heat (measuring temperature by calorimetry G01K3/00 - G01K11/00; specially adapted for measuring thermal properties of materials, e.g. specific heat, heat of combustion G01N) · CPC title

• G01K7/427

  Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation · CPC title

• G01K7/028

  using microstructures, e.g. made of silicon · CPC title

• A61B5/6833

  Adhesive patches · CPC title