Thermally conductive resin composition and cured product

Patent metadata

Field	Value
Publication number	US-2024270934-A1
Application number	US-202218563712-A
Country	US
Kind code	A1
Filing date	May 2, 2022
Priority date	Jun 11, 2021
Publication date	Aug 15, 2024
Grant date	—

Abstract

An object of the present invention is to provide a thermally conductive resin composition with which a cured product excellent in tensile strength and extensibility while maintaining thermal conductivity can be obtained. The present invention is to provide a thermally conductive resin composition including components (A) to (E) below. Component (A): Urethane (meth)acrylate having a (meth)acryloyl group at one end and having a polyether skeleton, Component (B): Monofunctional (meth)acrylic monomer having a polyether skeleton and not having a urethane skeleton, Component (C): Radical polymerization initiator, Component (D): Plasticizer, Component (E): Thermally conductive powder.

First claim

1 . A thermally conductive resin composition comprising components (A) to (E) below:
component (A): urethane (meth)acrylate having a (meth)acryloyl group at one end and having a polyether skeleton; component (B): a monofunctional (meth)acrylic monomer having a polyether skeleton and not having a urethane skeleton; component (C): a radical polymerization initiator; component (D): a plasticizer; and component (E): a thermally conductive powder.

2 . A thermally conductive resin composition comprising an agent A and an agent B below:
agent A: a composition containing components (A) to (E) below, component (A): urethane (meth)acrylate having a (meth)acryloyl group at one end and having a polyether skeleton, component (B): a monofunctional (meth)acrylic monomer having a polyether skeleton and not having a urethane skeleton, component (C): a radical polymerization initiator, component (D): a plasticizer, and component (E): a thermally conductive powder; and agent B: a composition containing at least a curing accelerator.

3 . The thermally conductive resin composition according to claim 1 , wherein the component (A) is contained in an amount of 20 to 90 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).

4 . The thermally conductive resin composition according to claim 1 , wherein the component (D) is contained in an amount of 10 to 200 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).

5 . The thermally conductive resin composition according to claim 1 , wherein the component (D) is a polyether-based plasticizer.

6 . A thermally conductive resin composition comprising components (A″), (B″), (C), and (E) below, wherein a tensile strength of a cured product is 0.40 MPa or more, and
an elongation percentage of a cured product is 60% to 1500%:
component (A″): urethane (meth)acrylate;
component (B″): a monofunctional (meth)acrylic monomer not having a urethane skeleton;
component (C): a radical polymerization initiator; and
component (E): a thermally conductive powder.

7 . The thermally conductive resin composition according to claim 1 ,
wherein the component (E) comprises: (E1) a thermally conductive powder having an average particle diameter of 0.01 μm or larger and smaller than 2.0 μm; (E2) a thermally conductive powder having an average particle diameter of 2.0 μm or larger and smaller than 20 μm; and (E3) a thermally conductive powder having an average particle diameter of 20 μm or larger and smaller than 150 μm.

8 . The thermally conductive resin composition according to claim 7 , wherein the component (E) has a mass ratio (E1)/(E3) of 0.08 to 1.00 and a mass ratio (E2)/(E3) of 0.15 to 1.50.

9 . The thermally conductive resin composition according to claim 1 , wherein an elongation percentage of a cured product is 60% to 1500%.

10 . A cured product obtained from the thermally conductive resin composition according to claim 1 .

11 . An electronic component that dissipates heat through the thermally conductive resin composition according to claim 1 .

Assignees

• Three Bond Co Ltd

Inventors

• Kuwahara Yusuke

Classifications

• H10W40/25

  characterised by their materials · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• C08F290/067 Primary

  Polyurethanes; Polyureas · CPC title

• C08K2201/003

  Additives being defined by their diameter · CPC title

• C08K2201/001

  Conductive additives · CPC title