Apparatuses and memory devices including conductive lines and interconnect structures

Patent metadata

Field	Value
Publication number	US-2024266214-A1
Application number	US-202418641140-A
Country	US
Kind code	A1
Filing date	Apr 19, 2024
Priority date	Aug 16, 2019
Publication date	Aug 8, 2024
Grant date	—

Abstract

An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.

First claim

What is claimed is:

1 . An apparatus comprising:
conductive lines extending in a horizontal direction; and interconnect structures vertically intersecting the conductive lines and extending from upper surfaces of the conductive lines, the upper surfaces of the conductive lines external to the interconnect structures relatively narrower than upper surfaces of the interconnect structures.

2 . The apparatus of claim 1 , wherein the interconnect structures individually exhibit a substantially circular cross-sectional shape.

3 . The apparatus of claim 1 , further comprising liner material adjacent to the conductive lines without being adjacent to central portions of the interconnect structures.

4 . The apparatus of claim 1 , wherein a width of the upper surfaces of each of the conductive lines external to the interconnect structures is between about 5 nm and about 10 nm less than a width of the upper surfaces of the interconnect structures.

5 . The apparatus of claim 1 , wherein the conductive lines and the interconnect structures comprise a substantially continuous portion of a single conductive material.

6 . The apparatus of claim 1 , wherein openings comprising the conductive lines and the interconnect structures lack seed materials.

7 . The apparatus of claim 1 , wherein an aspect ratio of the interconnect structures is between about 3:1 and about 30:1.

8 . The apparatus of claim 1 , further comprising conductive structures in vertical alignment with at least some of the interconnect structures.

9 . A memory device, comprising:
conductive lines extending horizontally through insulative material; and interconnect structures vertically intersecting the conductive lines, upper surfaces of the interconnect structures and the conductive lines substantially coplanar with one another, and an outer diameter of the interconnect structures at an elevation of the upper surfaces of the conductive lines is greater than a width of the conductive lines external to the interconnect structures.

10 . The memory device of claim 9 , wherein the insulative material comprises an etch stop material vertically separating a first insulative material and a second insulative material, the etch stop material below a lowermost boundary of the conductive lines.

11 . The memory device of claim 9 , wherein conductive material of the interconnect structures is in direct physical contact with the insulative material and additional conductive material of the conductive lines.

12 . The memory device of claim 9 , further comprising conductive pads underlying the insulative material, the interconnect structures directly physically contacting the conductive pads and the conductive lines.

13 . The memory device of claim 9 , further comprising a metal nitride material laterally intervening between the insulative material and the conductive lines, the metal nitride material vertically aligned with portions of the interconnect structures.

14 . The memory device of claim 9 , wherein the memory device comprises a 3D NAND Flash memory device comprising at least one memory array and a CMOS under array (CUA) region within a horizontal area of the at least one memory array.

15 . A NAND Flash memory device, comprising:
conductive interconnects vertically extending through insulative material; and trenches horizontally extending between at least some of the conductive interconnects, the trenches comprising conductive material adjacent to the insulative material, upper boundaries of the conductive material substantially coincident with upper boundaries of the conductive interconnects, a width of an uppermost surface of the conductive material external to the conductive interconnects is relatively less than a width of an uppermost surface of the conductive interconnects.

16 . The NAND Flash memory device of claim 15 , wherein an upper portion of the insulative material comprises silicon nitride.

17 . The NAND Flash memory device of claim 15 , further comprising a boron-containing material within the trenches, the boron-containing material adjacent to and at least partially surrounding the conductive material.

18 . The NAND Flash memory device of claim 15 , wherein the conductive material of the trenches directly physically contacts the insulative material and the conductive interconnects.

19 . The NAND Flash memory device of claim 15 , wherein the conductive material comprises one or more of tungsten, tungsten nitride, aluminum, copper, and molybdenum.

20 . The NAND Flash memory device of claim 15 , wherein the trenches exhibit an upper critical dimension of from about 20 nm to about 100 nm.

Assignees

• Lodestar Licensing Group Llc

Inventors

• Zhang Xiaosong
• Hu Yongjun J
• Kewley David A
• Hossain Md Zahid
• Irwin Michael J
• Billingsley Daniel
• Ramarajan Suresh
• Hanson Robert J
• Ong Biow Hiem
• Chow Keen Wah

Classifications

• H10W20/082

  the openings being tapered via holes · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H10W20/033

  in openings in dielectrics · CPC title

• H10W20/4441

  the principal metal being a refractory metal · CPC title

• H10W20/056 Primary

  by filling conductive material into holes, grooves or trenches · CPC title