Three-dimensional printing

US2024246147A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024246147-A1
Application numberUS-202418628434-A
CountryUS
Kind codeA1
Filing dateApr 5, 2024
Priority dateOct 29, 2018
Publication dateJul 25, 2024
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. This patterns an area that is to contain voids. The intermediate structure is heated to form a 3D structure including a void-containing breakable connection.

First claim

Opening claim text (preview).

1 .- 7 . (canceled) 8 . A method for three-dimensional printing, comprising: patterning build material layers of a particulate build material including metal particles to form an intermediate structure, the patterning including: selectively applying a first amount of a binding agent to define: a build material support structure and a patterned intermediate part; and selectively applying the binding agent to define a patterned breakable connection between at least a portion of the build material support structure and at least a portion of the patterned intermediate part, wherein a second amount of the binding agent in the patterned breakable connection is greater than the first amount; and heating the intermediate structure to form i) a 3D object from the patterned intermediate part, ii) a 3D support structure from the build material support structure, and iii) a void-containing breakable connection from the patterned breakable connection at an area of the intermediate structure patterned with the binding agent in the second amount. 9 . The method as defined in claim 8 wherein: each of the build material layers has a thickness ranging from about 30 μm to about 120 μm; the first amount ranges from about 0.12 grams per square meter (gsm) per 1 μm of build material layer thickness to about 0.26 gsm per 1 μm of build material layer thickness; and the second amount ranges from about 0.3 gsm per 1 μm of build material layer thickness to about 0.6 gsm per 1 μm of build material layer thickness. 10 . The method as defined in claim 8 , further comprising removing the 3D support structure from the 3D object by breaking the void-containing breakable connection. 11 .- 15 . (canceled) 16 . The method as defined in claim 8 wherein the void-containing breakable connection includes voids, and wherein an average diameter of the voids is equal to or greater than a thickness of each of the build material layers. 17 . The method as defined in claim 8 wherein the void-containing breakable connection includes sintered metal particles. 18 . The method as defined in claim 8 wherein the binding agent includes a binder and an aqueous vehicle, and wherein the binder is selected from the group consisting of a latex, polyvinyl alcohol, polyvinylpyrrolidone, and combinations thereof. 19 . The method as defined in claim 18 wherein the binding agent further includes a co-solvent, a surfactant, an antimicrobial agent, an anti-kogation agent, or combinations thereof. 20 . The method as defined in claim 8 wherein each of the selectively applying steps is accomplished using a thermal inkjet printhead or a piezoelectric inkjet printhead. 21 . The method as defined in claim 8 wherein the 3D object formed at areas patterned with the first amount of the binder agent is free of voids. 22 . A method for three-dimensional printing, comprising: patterning build material layers of a particulate build material including metal particles to form an intermediate structure, the patterning including: selectively applying a first amount of a binding agent to define: a build material support structure and a patterned intermediate part; and selectively applying both the binding agent and a void-formation agent to define a patterned breakable connection between at least a portion of the build material support structure and at least a portion of the patterned intermediate part, wherein a total amount of the binding agent and the void-formation agent in the patterned breakable connection is greater than the first amount; and heating the intermediate structure to form i) a 3D object from the patterned intermediate part, ii) a 3D support structure from the build material support structure, and iii) a void-containing breakable connection from the patterned breakable connection at an area of the intermediate structure patterned with both the binding agent and the void-formation agent in the total amount. 23 . The method as defined in claim 22 wherein: each of the build material layers has a thickness ranging from about 30 μm to about 120 μm; the first amount ranges from about 0.12 grams per square meter (gsm) per 1 μm of build material layer thickness to about 0.26 gsm per 1 μm of build material layer thickness; and the total amount ranges from about 0.3 gsm per 1 μm of build material layer thickness to about 0.6 gsm per 1 μm of build material layer thickness. 24 . The method as defined in claim 22 , further comprising removing the 3D support structure from the 3D object by breaking the void-containing breakable connection. 25 . The method as defined in claim 22 wherein the void-formation agent includes water. 26 . The method as defined in claim 22 wherein the void-containing breakable connection includes voids, and wherein an average diameter of the voids is equal to or greater than a thickness of each of the build material layers. 27 . The method as defined in claim 22 wherein the void-containing breakable connection includes sintered metal particles. 28 . The method as defined in claim 22 wherein the binding agent includes a binder and an aqueous vehicle, and wherein the binder is selected from the group consisting of a latex, polyvinyl alcohol, polyvinylpyrrolidone, and combinations thereof. 29 . The method as defined in claim 28 wherein the binding agent further includes a co-solvent, a surfactant, an antimicrobial agent, an anti-kogation agent, or combinations thereof. 30 . The method as defined in claim 22 wherein each of the selectively applying steps is accomplished using a thermal inkjet printhead or a piezoelectric inkjet printhead. 31 . The method as defined in claim 22 wherein the 3D object formed at areas patterned with the first amount of the binder agent is free of voids.

Assignees

Inventors

Classifications

  • containing organic material comprising solvents, e.g. for slip casting · CPC title

  • characterised by structural features · CPC title

  • Processes of additive manufacturing · CPC title

  • Removal of binder or filler (removal of binder from ceramics C04B35/638) · CPC title

  • Post-treatment, e.g. curing, coating or polishing · CPC title

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What does patent US2024246147A1 cover?
In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one int…
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification B22F10/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jul 25 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).