(meth)acrylate-based two-part adhesive composition

Patent metadata

Field	Value
Publication number	US-2024240062-A1
Application number	US-202418622466-A
Country	US
Kind code	A1
Filing date	Mar 29, 2024
Priority date	Sep 29, 2021
Publication date	Jul 18, 2024
Grant date	—

Abstract

The present invention provides a (meth)acrylate-based two-part adhesive composition, comprising: a first part comprising: at least one amine-aldehyde condensation compound, and a second part comprising: at least one organic transitional metal compound and at least one phosphorus-containing compound, wherein the first part and/or the second part further comprise at least one (meth)acrylate monomer containing at least one hydroxyl group per molecule. The present invention also provides a method for bonding a first substrate to a second substrate with the (meth)acrylate-based two-part adhesive composition, and an article bonded by the (meth)acrylate-based two-part adhesive composition, or obtained by the method.

First claim

What is claimed is:

1 . A (meth)acrylate-based two-part adhesive composition, comprising:
a first part comprising: at least one amine-aldehyde condensation compound, and a second part comprising: at least one organic transitional metal compound and at least one phosphorus-containing compound, wherein the first part and/or the second part further comprise at least one (meth)acrylate monomer containing at least one hydroxyl group per molecule.

2 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the amine-aldehyde condensation compound is a butyraldehyde-aniline condensation compound.

3 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the organic transitional metal compound is selected from vanadium and cuprous complexes.

4 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the phosphorus-containing compound is selected from the group consisting of an organic phosphorus-containing compound and an inorganic phosphorus-containing compound.

5 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the (meth)acrylate monomer containing at least one hydroxyl group per molecule is a monofunctional (meth)acrylate monomer selected from the group consisting of hydroxyethyl methacrylate and hydroxypropyl methacrylate.

6 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the amine-aldehyde condensation compound is present in an amount of 0.3 to 3.5 wt. % based on the total weight of the first part.

7 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the organic transitional metal compound is present in an amount of 0.03 to 0.4 wt. % based on the total weight of the second part.

8 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the phosphorus-containing compound is present in an amount of 0.2 to 4 wt. % based on the total weight of the second part.

9 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the first part and/or the second part further comprise at least one (meth)acrylic resin, at least one toughening agent and/or at least one inhibitor.

10 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the composition is free from peroxide and/or amine.

11 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , wherein the ratio by weight of the first part: the second part is 5:1 to 1:5.

12 . The (meth)acrylate-based two-part adhesive composition according to claim 1 , comprising:
a first part, based on the total weight of the first part, comprising: from 30.0 to 90.0 wt % of at least one (meth)acrylate monomer containing at least one hydroxyl group per molecule, from 5 to 40.0 wt % of at least one (meth)acrylic resin, from 5 to 30.0 wt % of at least one toughening agent, from 0.05 to 0.5 wt % of at least one inhibitor, and from 0.3 to 3.5 wt % of at least one amine-aldehyde condensation compound; and a second part, based on the total weight of the second part, comprising: from 30.0 to 90.0 wt % of at least one (meth)acrylate monomer containing at least one hydroxyl group per molecule, from 5 to 40.0 wt % of at least one (meth)acrylic resin, from 5 to 30.0 wt % of at least one toughening agent, from 0.05 to 0.5 wt % of at least one inhibitor, from 0.03 to 0.4 wt % of at least one organic transitional metal compound, and from 0.2 to 4 wt % of at least one phosphorus-containing compound.

13 . A method for bonding a first substrate to a second substrate, comprising:
mixing the two parts of the (meth)acrylate-based two-part adhesive composition according to claim 1 ; applying the mixed adhesive composition to at least one of the substrate surfaces to be bonded; joining the substrates to be bonded in a way that the adhesive composition is between the substrates; and curing the adhesive composition.

14 . The method according to claim 13 , wherein the first substrate and the second substrate are identical or different materials selected from the group consisting of metals, plastics, ceramic, glass and cellulosic materials.

15 . An article bonded by the (meth)acrylate-based two-part adhesive composition according to claim 1 .

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Sun Chongyang
• Song Chongjian
• Wang Zuohe

Classifications

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title

• C09J11/06

  organic · CPC title

• C09J5/06

  involving heating of the applied adhesive · CPC title

• C09J4/00

  Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} · CPC title

• C09J2301/304

  the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C · CPC title