Circuit module

Patent metadata

Field	Value
Publication number	US-2024237211-A9
Application number	US-202318483929-A
Country	US
Kind code	A9
Filing date	Oct 10, 2023
Priority date	Oct 19, 2022
Publication date	Jul 11, 2024
Grant date	—

Abstract

An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.

First claim

What is claimed is:

1 . A circuit module comprising:
an upper circuit board; a lower circuit board; a first conductor member; a second conductor member; and a first component, wherein the upper circuit board includes an upper circuit board body, the lower circuit board includes a lower circuit board body, a lower circuit board first mounting electrode, and one or more lower circuit board second mounting electrodes, the upper circuit board body has a first upper main surface and a first lower main surface, the lower circuit board body has a second upper main surface and a second lower main surface, the lower circuit board first mounting electrode and the one or more lower circuit board second mounting electrodes are disposed on the second upper main surface, the first component is mounted on the one or more lower circuit board second mounting electrodes, the first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on left of the first component, and the second conductor member is disposed in a space between the upper circuit board and the lower circuit board or on the first lower main surface, is connected to an upper end of the first conductor member, and overlaps at least a part of the first component as viewed in a downward direction.

2 . The circuit module according to claim 1 , further comprising a third conductor member,
wherein the lower circuit board includes a lower circuit board third mounting electrode, the lower circuit board third mounting electrode is disposed on the second upper main surface, the third conductor member is mounted on the lower circuit board third mounting electrode, the third conductor member is disposed on right of the first component, and the second conductor member is connected to an upper end of the third conductor member.

3 . The circuit module according to claim 1 , wherein the second conductor member is disposed on the first lower main surface.

4 . The circuit module according to claim 1 , further comprising a fourth conductor member,
wherein the lower circuit board further includes a lower circuit board fourth mounting electrode and an interlayer connection conductor, the interlayer connection conductor electrically connects the lower circuit board first mounting electrode and the lower circuit board fourth mounting electrode by penetrating the lower circuit board body along an up-down axis, and the fourth conductor member is mounted on the lower circuit board fourth mounting electrode.

5 . The circuit module according to claim 4 , further comprising a fifth conductor member,
wherein the upper circuit board further includes an upper circuit board first mounting electrode, the lower circuit board further includes a lower circuit board fifth mounting electrode, the upper circuit board first mounting electrode is disposed on the first lower main surface, the lower circuit board fifth mounting electrode is disposed on the second upper main surface, the fifth conductor member is mounted on the upper circuit board first mounting electrode and the lower circuit board fifth mounting electrode, and an area of the fourth conductor member as viewed in the downward direction is larger than an area of the fifth conductor member as viewed in the downward direction.

6 . The circuit module according to claim 1 , wherein the second conductor member is in contact with the first component.

7 . The circuit module according to claim 1 , wherein a thermal conductivity of the second conductor member is higher than a thermal conductivity of the upper circuit board body.

8 . The circuit module according to claim 1 , further comprising a fifth conductor member,
wherein the upper circuit board further includes an upper circuit board first mounting electrode, the lower circuit board further includes a lower circuit board fifth mounting electrode, the upper circuit board first mounting electrode is disposed on the first lower main surface, the lower circuit board fifth mounting electrode is disposed on the second upper main surface, and the fifth conductor member is mounted on the upper circuit board first mounting electrode and the lower circuit board fifth mounting electrode.

9 . The circuit module according to claim 8 , wherein an area of the first conductor member as viewed in the downward direction is larger than an area of the fifth conductor member as viewed in the downward direction.

10 . The circuit module according to claim 1 , further comprising a thermal interface material layer,
wherein the thermal interface material layer is disposed between the first component and the second conductor member and is in contact with the first component and the second conductor member.

11 . The circuit module according to claim 2 , wherein the second conductor member is disposed on the first lower main surface.

12 . The circuit module according to claim 2 , further comprising a fourth conductor member,
wherein the lower circuit board further includes a lower circuit board fourth mounting electrode and an interlayer connection conductor, the interlayer connection conductor electrically connects the lower circuit board first mounting electrode and the lower circuit board fourth mounting electrode by penetrating the lower circuit board body along an up-down axis, and the fourth conductor member is mounted on the lower circuit board fourth mounting electrode.

13 . The circuit module according to claim 2 , wherein the second conductor member is in contact with the first component.

14 . The circuit module according to claim 2 , wherein a thermal conductivity of the second conductor member is higher than a thermal conductivity of the upper circuit board body.

15 . The circuit module according to claim 2 , further comprising a fifth conductor member,
wherein the upper circuit board further includes an upper circuit board first mounting electrode, the lower circuit board further includes a lower circuit board fifth mounting electrode, the upper circuit board first mounting electrode is disposed on the first lower main surface, the lower circuit board fifth mounting electrode is disposed on the second upper main surface, and the fifth conductor member is mounted on the upper circuit board first mounting electrode and the lower circuit board fifth mounting electrode.

16 . The circuit module according to claim 2 , further comprising a thermal interface material layer,
wherein the thermal interface material layer is disposed between the first component and the second conductor member and is in contact with the first component and the second conductor member.

Assignees

• Murata Manufacturing Co

Inventors

• Otsubo Yoshihito
• Nakagoshi Hideo
• Yoshimori Hiroki

Classifications

• H05K2201/0379

  Stacked conductors · CPC title

• H05K2201/10507

  Involving several components · CPC title

• H05K2201/10977

  Encapsulated connections · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K1/144 Primary

  Stacked arrangements of planar printed circuit boards · CPC title