Bonded wafer and method for producing bonded wafer
US-2024379899-A1 · Nov 14, 2024 · US
US2024234633A9 · US · A9
| Field | Value |
|---|---|
| Publication number | US-2024234633-A9 |
| Application number | US-202318491036-A |
| Country | US |
| Kind code | A9 |
| Filing date | Oct 20, 2023 |
| Priority date | Oct 21, 2022 |
| Publication date | Jul 11, 2024 |
| Grant date | — |
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A light-emitting device includes an epitaxial structure having a first surface and a second surface that is opposite to the first surface. The epitaxial structure includes, along a first direction from the first surface to the surface, a first-type semiconductor layer, an active layer, and a second-type semiconductor layer including a capping layer. The capping layer includes at least Ni number of sub-layers arranged in the first direction, where N1≥2. Each of the sub-layers of the capping layer contains a material represented by Aly1Ga1-y1InP, where 0<y1≤1. The capping layer has an Al content which increases and then remains constant along the first direction. A light-emitting apparatus includes the light-emitting device is also provided.
Opening claim text (preview).
What is claimed is: 1 . A light-emitting device, comprising: an epitaxial structure having a first surface and a second surface that is opposite to the first surface, and, along a first direction from said first surface to said surface, including: a first-type semiconductor layer, an active layer, and a second-type semiconductor layer including a capping layer that includes at least N1 number of sub-layers arranged in said first direction, where N1≥2, and that has an Al content which increases and then remains constant along said first direction, each of said sub-layers containing a material represented by Al y1 Ga 1-y1 InP, where 0<y1≤1. 2 . The light-emitting device according to claim 1 , wherein the Al content increases either gradually or stepwise along said first direction. 3 . The light-emitting device according to claim 1 , wherein in Al y1 Ga 1-y1 InP, 0.2<y1≤1. 4 . The light-emitting device according to claim 1 , wherein a last sub-layer of said sub-layers of said capping layer in said first direction contains AlInP. 5 . The light-emitting device according to claim 1 , wherein said second-type semiconductor layer further includes a spacer layer located between said active layer and said capping layer, said spacer layer containing a material represented by Al x1 Ga 1-x1 InP, where 0.2≤x1<1. 6 . The light-emitting device according to claim 5 , wherein in said second-type semiconductor layer, 0.2≤x1<y1≤1. 7 . The light-emitting device according to claim 5 , wherein said spacer layer includes at least M1 number of sub-layers, where M1≥2. 8 . The light-emitting device according to claim 5 , wherein said spacer layer has an Al content which increases gradually along said first direction. 9 . The light-emitting device according to claim 8 , wherein the Al content of said spacer layer increases either gradually or stepwise along said first direction. 10 . The light-emitting device according to claim 5 , wherein said spacer layer has a doping concentration that is lower than 1E17/cm 3 , and has a thickness less than 300 nm. 11 . The light-emitting device according to claim 1 , wherein said capping layer is doped with a p-type dopant with a doping concentration ranging from 2E17/cm 3 to 5E18/cm 3 . 12 . The light-emitting device according to claim 1 , wherein said capping layer is doped with an n-type dopant with a doping concentration ranging from 2E17/cm 3 to 5E18/cm 3 . 13 . The light-emitting device according to claim 1 , wherein said first-type semiconductor layer includes a spacer layer and a capping layer disposed along a second direction from said second surface to said first surface. 14 . The light-emitting device according to claim 13 , wherein said capping layer of said first-type semiconductor layer includes at least N2 number of sub-layers, where N2≥2, and has an Al content which increases and then remains constant along said second direction, each of said sub-layers of said capping layer of said first-type semiconductor layer containing a material represented by Al y2 Ga 1-y2 InP. 15 . The light-emitting device according to claim 14 , wherein a last sub-layer of said sub-layers of said capping layer of said first-type semiconductor layer in said second direction contains AlInP, and in said capping layer, 0.2<y2≤1. 16 . The light-emitting device according to claim 14 , wherein the Al content of said capping layer of said first-type semiconductor layer increases either gradually or stepwise along said second direction. 17 . The light-emitting device according to claim 13 , wherein said spacer layer of said first-type semiconductor layer contains a material represented by Al x2 Ga 1-x2 InP, where 0.2≤x2<1. 18 . The light-emitting device according to claim 13 , wherein said spacer layer of said first-type semiconductor layer includes at least M2 number of sub-layers, where M2≥2. 19 . The light-emitting device according to claim 17 , wherein said spacer layer of said first-type semiconductor layer has an Al content which increases either gradually or stepwise along said second direction. 20 . A light-emitting apparatus comprising the light-emitting device according to claim 1 .
within the light-emitting regions, e.g. having quantum confinement structures · CPC title
Encapsulations · CPC title
having quantum effect structures or superlattices, e.g. tunnel junctions · CPC title
comprising only Group III-V materials, e.g. GaP · CPC title
containing nitrogen, e.g. GaN · CPC title
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