Optical communication device

Patent metadata

Field	Value
Publication number	US-2024222929-A1
Application number	US-202318496613-A
Country	US
Kind code	A1
Filing date	Oct 27, 2023
Priority date	Jan 3, 2023
Publication date	Jul 4, 2024
Grant date	—

Abstract

Provided is an optical communication device according to an embodiment of the inventive including a carrier substrate, a printed circuit board provided on one side of the carrier substrate in a first direction, electro-absorption modulator-integrated laser chips provided on the other side of the carrier substrate, an interposer provided on the electro-absorption modulator-integrated laser chips and the printed circuit board, and capacitors, which are provided on the interposer and each of which is shorter than each of the electro-absorption modulator-integrated laser chips and is thicker than the electro-absorption modulator-integrated laser chip.

First claim

What is claimed is:

1 . An optical communication device comprising:
a carrier substrate; a printed circuit board provided on one side of the carrier substrate in a first direction; electro-absorption modulator-integrated laser chips provided on the other side of the carrier substrate; an interposer provided on the electro-absorption modulator-integrated laser chips and the printed circuit board; and capacitors provided on the interposer, the capacitors shorter than the electro-absorption modulator-integrated laser chips and thicker than the electro-absorption modulator-integrated laser chips.

2 . The optical communication device of claim 1 , wherein the electro-absorption modulator-integrated laser chips are aligned with the capacitors in a second direction crossing the first direction.

3 . The optical communication device of claim 2 , wherein each of the electro-absorption modulator-integrated laser chips and the capacitors has a width of 100 μm to 400 μm in the second direction.

4 . The optical communication device of claim 3 , wherein the width of each of the electro-absorption modulator-integrated laser chips is 200 μm.

5 . The optical communication device of claim 4 , wherein the electro-absorption modulator-integrated laser chips are arranged to have a pitch that is 2 to 2.5 times the width of each of the electro-absorption modulator-integrated laser chips.

6 . The optical communication device of claim 5 , wherein the pitch between the electro-absorption modulator-integrated laser chips is 400 μm to 500 μm.

7 . The optical communication device of claim 5 , wherein a distance between the electro-absorption modulator-integrated laser chips is 200 μm to 300 μm.

8 . The optical communication device of claim 1 , wherein each of the electro-absorption modulator-integrated laser chips comprises:
an element substrate; an optical waveguide provided on the element substrate and extending in one direction; a laser source provided on one side of the element substrate and connected to the optical waveguide; and a modulator provided on the other side of the element substrate and connected to the optical waveguide.

9 . The optical communication device of claim 8 , wherein each of the electro-absorption modulator-integrated laser chips further comprises a detector provided to be adjacent to the laser source and configured to detect laser light in the optical waveguide.

10 . The optical communication device of claim 9 , wherein the interposer comprises:
a first via electrode connected to the laser source; a second via electrode connected to the modulator; a third via electrode connected to the detector; and a fourth via electrode connected to a ground line of the printed circuit board.

11 . The optical communication device of claim 10 , further comprising thin film resistors, each of which is provided between the capacitors and connected to the second via electrode.

12 . The optical communication device of claim 11 , further comprising a bonding wire connected between the thin film resistor and the capacitor.

Assignees

• Electronics & Telecommunications Res Inst

Inventors

• Han Young-Tak
• Yun Seok Jun
• Lee Seo Young
• Park Sang Ho
• Baek Yongsoon
• Shin Jang Uk
• Lee Dong-Hun

Classifications

• H01S5/12

  the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers (comprising a photonic bandgap structure H01S5/11; surface-emitting lasers H01S5/18) · CPC title

• H01S5/06253

  Pulse modulation · CPC title

• H01S5/02345

  Wire-bonding · CPC title

• H04B10/505

  using external modulation · CPC title

• G02B6/4251

  Sealed packages (G02B6/4248 takes precedence) · CPC title