Package carrier board integrated with magnetic element structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2024215174-A1
Application number	US-202318184005-A
Country	US
Kind code	A1
Filing date	Mar 15, 2023
Priority date	Dec 23, 2022
Publication date	Jun 27, 2024
Grant date	—

Abstract

The invention provides a package carrier board and a manufacturing method thereof. The packaging carrier board includes a core layer, a magnetic element structure and a conductive connecting element. The core layer has a first surface and a second surface opposite to each other. The magnetic element structure includes a plurality of patterned magnetic conductive metal layers and a plurality of patterned conductive coil layers. The patterned magnetic conductive metal layers are stacked and embedded in the core layer, and each have at least one magnetic conductive metal, and part of these magnetic conductive metals form an array block. The patterned conductive coil layers are embedded in the core layer, and part of the patterned conductive coil layers are located on both sides of the array block. The conductive connecting element is arranged through the core layer and conducts the first surface and the second surface of the core layer.

First claim

What is claimed is:

1 . A package carrier board integrated with a magnetic element structure, comprising:
a core layer, which has an opposite first surface and a second surface, and each of the first surface and the second surface has a patterned conductive circuit layer; a magnetic element structure, comprising:
a plurality of patterned magnetic conductive metal layers, which are stacked at intervals and embedded in the core layer, and each has at least one magnetic conductive metal, wherein part of the magnetic conductive metals constitutes an array block;
a plurality of patterned conductive coil layers, which are embedded in the core layer,
wherein part of the patterned conductive coil layer is framed to surround the array block; and a conductive connecting element, which is disposed through the core layer and electrically connects the first surface of the core layer and the patterned conductive circuit layer of the second surface.

2 . The package carrier board integrated with a magnetic element structure of claim 1 , wherein each patterned magnetic conductive metal layer has a plurality of magnetic conductive metal elements in block shape, strip shape, or fin shape.

3 . The package carrier board integrated with a magnetic element structure of claim 1 , wherein the patterned magnetic conductive metal layer is made of iron (Fe), nickel (Ni), cobalt (Co), zinc (Zn), an alloy containing at least two of them or more, or in an alloy doped with manganese (Mn), molybdenum (Mo), boron (B), copper (Cu) or vanadium (V).

4 . The package carrier board integrated with a magnetic element structure of claim 1 , wherein the core layer is a plurality of insulating layers that are stacked, and its material includes organic photosensitive dielectric materials, organic non-photosensitive dielectric materials and/or inorganic oxide materials.

5 . The package carrier board integrated with a magnetic element structure of claim 1 , wherein the patterned conductive coil layers are helical coil-shaped inductive wiring, solenoid coil-shaped inductive wiring, or toroidal coil-shaped inductive wiring.

6 . The package carrier board integrated with a magnetic element structure of claim 1 , wherein the patterned conductive coil layer is made of copper, copper alloy, nickel, or silver.

7 . The package carrier board integrated with a magnetic element structure of claim 1 , further comprising:
a plurality of rigid support layers, which is embedded in the core layer and adjacent to the patterned conductive coil layers.

8 . The package carrier board integrated with a magnetic element structure of claim 7 , wherein each rigid support layer has a plurality of support members in block shape, strip shape, or fin shape.

9 . The package carrier board integrated with a magnetic element structure of claim 7 , wherein the material of the rigid support layer is copper (Cu), stainless steel, ceramics, plastic steel, iron (Fe), nickel (Ni), cobalt (Co), zinc (Zn), containing two or more alloys, or alloys doped with manganese (Mn), molybdenum (Mo), boron (B), copper (Cu), or vanadium (V).

10 . The package carrier board integrated with a magnetic element structure of claim 7 , further comprising:
a first circuit build-up layer structure, which is disposed on the first surface of the core layer and has a plurality of first insulating layers and a plurality of first conductive circuit layers, wherein the first conductive circuit layers are stacked and covered in the first insulating layer; and a second circuit build-up layer structure, which is disposed on the second surface of the core layer and has a plurality of second insulating layers and a plurality of second conductive circuit layers, wherein the second conductive circuit layers are stacked and covered in the second insulating layer.

11 . The package carrier board integrated with a magnetic element structure of claim 10 , wherein another magnetic element structure is embedded in the first circuit build-up layer structure and/or the second circuit build-up layer structure.

12 . The package carrier board integrated with a magnetic element structure of claim 1 , further comprising:
a first circuit build-up layer structure, which is disposed on the first surface of the core layer and has a plurality of first insulating layers and a plurality of first conductive circuit layers, wherein the first conductive circuit layers are stacked and covered in the first insulating layer; and a second circuit build-up layer structure, which is disposed on the second surface of the core layer and has a plurality of second insulating layers and a plurality of second conductive circuit layers, wherein the second conductive circuit layers are stacked and covered in the second insulating layer.

13 . The package carrier board integrated with a magnetic element structure of claim 12 , wherein another magnetic element structure is embedded in the first circuit build-up layer structure and/or the second circuit build-up layer structure.

14 . A manufacturing method of a package carrier board integrated with a magnetic element structure, comprising:
forming a patterned magnetic conductive metal layer and a patterned conductive coil layer respectively by electroplating on the upper surface of an insulating layer, wherein the patterned conductive coil layer is adjacent to the patterned magnetic conductive metal layer; forming another insulating layer to cover the patterned magnetic conductive metal layer and the patterned conductive coil layer, and repeating the above steps, wherein the insulating layers constitute a core layer, the patterned magnetic conductive metal layers and the patterned conductive coil layers department constitutes a magnetic element structure; forming a plurality of conductive connecting elements on the core layer to electrically connect a first surface and a second surface of the core layer; and forming a patterned conductive circuit layer on the first surface and the second surface, respectively, of the core layer to electrically connect the conductive connecting element.

15 . The manufacturing method of a package carrier board integrated with a magnetic element structure of claim 14 , further comprising:
forming a first circuit build-up layer structure on the first surface of the core layer; and forming a second circuit build-up layer structure on the second surface of the core layer.

16 . The manufacturing method of a package carrier board integrated with a magnetic element structure of claim 15 , wherein the formation of the first circuit build-up layer structure and the second circuit build-up layer structure adopts Semi-additive Process.

17 . The manufacturing method of a package carrier board integrated with a magnetic element structure of claim 14 , wherein the step of forming the conductive connecting element, comprising:
forming an electroplated via in the core layer; and filling a plugging resin in the electroplated via.

18 . The manufacturing method of a package carrier board integrated with a magnetic element structure of claim 14 , wherein the step of forming the conductive connecting element, comprising:
forming a through hole in the core layer; and forming a conductive pillar in the through hole by electroplating.

19 . The manufacturing method of a package carrier board integrated with a magnetic element structure of claim 14 , further comprises electroplating a rigid support layer to the upper surface of the insulating layer.

20 . The man

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Hsu Shih-Ping

Classifications

• H01F17/0013

  with stacked layers · CPC title

• H01F17/0033

  with the coil helically wound around a magnetic core · CPC title

• H01F41/046 Primary

  structurally combined with ferromagnetic material · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• H05K3/423

  characterised by electroplating method · CPC title