Semiconductor processing system

Patent metadata

Field	Value
Publication number	US-2024213039-A1
Application number	US-202218288163-A
Country	US
Kind code	A1
Filing date	Apr 28, 2022
Priority date	Apr 29, 2021
Publication date	Jun 27, 2024
Grant date	—

Abstract

A system comprising: a semiconductor processing tool ( 102 ) comprising a process chamber ( 108 ); a valve module ( 104 ) configured to receive a fluid from the process chamber ( 108 ) and to selectably direct a flow of said fluid; and a cooling apparatus ( 402 ) configured to supply a flow of a cooling fluid to the process chamber ( 108 ); wherein the valve module ( 104 ) and the cooling apparatus ( 402 ) are arranged in a stacked configuration.

First claim

1 . A system comprising:
a semiconductor processing tool comprising a process chamber; a valve module configured to receive a fluid from the process chamber and to selectably direct a flow of said fluid; and a cooling apparatus configured to supply a flow of a cooling fluid to the process chamber; wherein the valve module and the cooling apparatus are arranged in a stacked configuration.

2 . The system of claim 1 , wherein the valve module is disposed on top of the cooling apparatus.

3 . The system of claim 1 , further comprising a common power source configured to supply electrical power to both the valve module and the cooling apparatus.

4 . The system of claim 1 , further comprising a common pneumatic fluid source configured to supply a pneumatic fluid to both the valve module and the cooling apparatus.

5 . The system of claim 4 , wherein the valve module comprises a valve, and the valve module is configured to actuate the valve using the pneumatic fluid received from the common pneumatic fluid source.

6 . The system of claim 4 , wherein the valve module comprises one or more conduits, and the valve module is configured to purge the one or more conduits using the pneumatic fluid received from the common pneumatic fluid source.

7 . The system of claim 4 , wherein the valve module is configured to perform a leak test using the pneumatic fluid received from the common pneumatic fluid source.

8 . The system of claim 1 , wherein:
the semiconductor processing tool comprises a plurality of process chambers; the valve module is configured to receive a respective fluid from each of the plurality of process chambers and to selectably direct flows of said respective fluids; and the system comprises a plurality of cooling apparatuses, each being configured to supply a respective flow of the cooling fluid to a respective one of the plurality of cooling chambers; wherein the valve module and the plurality of cooling apparatuses are arranged in a stacked configuration.

9 . A method comprising:
providing a semiconductor processing tool comprising a process chamber; fluidly coupling a valve module to the process chamber such that the valve module is arranged to receive a fluid from the process chamber, wherein the valve module is configured to selectably direct a flow of said fluid; fluidly coupling a cooling apparatus to the process chamber such that the cooling apparatus is arranged to supply a flow of a cooling fluid to the process chamber; and arranging the valve module and the cooling apparatus in a stacked configuration.

10 . The method of claim 9 , wherein the arranging comprises positioning the valve module on top of the cooling apparatus.

11 . The method of claim 9 , further comprising electrically coupling a common electrical power source to both the valve module and the cooling apparatus.

12 . The method of claim 9 , further comprising fluidly coupling a common pneumatic fluid source to both the valve module and the cooling apparatus.

13 . The method of claim 12 , wherein the valve module comprises a valve, and the method further comprises actuating the valve using the pneumatic fluid received from the common pneumatic fluid source.

14 . The method of claim 12 , wherein the valve module comprises one or more conduits, and the method further comprises purging the one or more conduits using the pneumatic fluid received from the common pneumatic fluid source.

15 . The method of claim 12 , further comprising performing a leak test using the pneumatic fluid received from the common pneumatic fluid source.

Assignees

• Edwards Ltd

Inventors

• Bailey Christopher Mark
• Norrington Michael John
• Phillip Stephen
• Shaw Helen

Classifications

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0451 Primary

  Apparatus for manufacturing or treating in a plurality of work-stations · CPC title

• H10P72/0431

  Apparatus for thermal treatment · CPC title

• H10P72/00 Primary

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title