Vapor chamber and method of producing the same

Patent metadata

Field	Value
Publication number	US-2024210119-A1
Application number	US-202418597845-A
Country	US
Kind code	A1
Filing date	Mar 6, 2024
Priority date	Sep 7, 2021
Publication date	Jun 27, 2024
Grant date	—

Abstract

Disclosed herein are a vapor chamber and a method of producing the same. The vapor chamber includes a chamber body plate having one surface placed in close contact with a heating surface of a heating element and the other surface that is open, and having a refrigerant filling space filled with a refrigerant therein and defined to have a predetermined thickness, a chamber cover plate bonded to shield the other open surface of the chamber body plate, and a wick formed in the refrigerant filling space, which is a space between the chamber body plate and the chamber cover plate, and having at least multiple pores through which the refrigerant filled in the refrigerant filling space flows. The wick has the multiple pores formed through an electroless Ni plating process with aluminum powder filled in the refrigerant filling space, providing an advantage of simple manufacturing and excellent heat conduction performance.

First claim

1 . A vapor chamber comprising:
a chamber body plate having one surface placed in close contact with a heating surface of a heating element and the other surface that is open, the chamber body plate having a refrigerant filling space filled with a refrigerant therein and defined to have a predetermined thickness; a chamber cover plate bonded to shield the other open surface of the chamber body plate; and a wick formed in the refrigerant filling space, which is a space between the chamber body plate and the chamber cover plate, the wick having at least multiple pores through which the refrigerant filled in the refrigerant filling space flows, wherein the wick comprises a Ni plating layer formed on an outer surface of aluminum powder bonded in particle units.

2 . The vapor chamber according to claim 1 , wherein the chamber body plate and the chamber cover plate are made of aluminum, which is the same material as the wick before an electroless Ni plating process.

3 . The vapor chamber according to claim 2 , wherein the chamber body plate and the wick or the chamber cover plate and the wick are bonded with a predetermined bonding force through the electroless Ni plating process.

4 . The vapor chamber according to claim 2 , wherein the wick further comprises a Cu plating layer formed on an outer surface of the Ni plating layer.

5 . The vapor chamber according to claim 4 , wherein a predetermined bonding force between an inner surface of the chamber body plate and the wick is further increased by addition of a wet Cu plating process to form the Cu plating layer.

6 . The vapor chamber according to claim 5 , wherein the multiple pores formed in the wick are sized such that the refrigerant flows through capillarity by the Cu plating layer formed through the wet Cu plating process.

7 . A method of producing vapor chambers, comprising:
a material preparation process of preparing each raw material for a chamber body plate, a chamber cover plate, and a wick, the chamber body plate having a refrigerant filling space filled with a refrigerant therein, the chamber cover plate configured to shield an open surface to define the refrigerant filling space together with the chamber body plate, the wick being formed in the refrigerant filling space; and an electroless Ni plating process of performing electroless Ni plating after a predetermined amount of aluminum powder, which is the raw material of the wick, is placed in a region corresponding to the refrigerant filling space defined by the chamber body plate or the chamber cover plate prepared through the material preparation process.

8 . The method according to claim 7 , further comprising a wet Cu plating process of additionally performing Cu plating on the wick formed through the electroless Ni plating process.

9 . The method according to claim 7 , wherein the material preparation process precedes a zincate treatment process after forming empty space an corresponding to the refrigerant filling space by etching at least one of the chamber body plate and the chamber cover plate prepared in the form of an aluminum plate so that the wick is formed in the refrigerant filling space.

10 . The method according to claim 7 , wherein the electroless Ni plating process is a process of forming the multiple pores while bonding the aluminum powder, and of simultaneously bonding the wick to an inner surface of the chamber body plate or the chamber cover plate made of aluminum, which is the same material as the wick, with a predetermined bonding force.

11 . The method according to claim 8 , wherein the wet Cu plating process is a process of plating a copper layer on a surface of the wick formed through the electroless Ni plating process to form the multiple pores sized such that the refrigerant filled in the refrigerant filling space flows by capillarity.

12 . The method according to claim 8 , wherein the wet Cu plating process is a process of further increasing a predetermined bonding force of the wick to the chamber body plate or of the wick to the chamber cover plate made through the electroless Ni plating process.

13 . The method according to claim 8 , wherein after the electroless Ni plating process and the wet Cu plating process are performed separately on the chamber body plate and the chamber cover plate, an additional bonding process is performed of welding the chamber body plate and the chamber cover plate so that the wick is in surface contact with the chamber body plate and the chamber cover plate.

Assignees

• Kmw Inc

Inventors

• Lee Kang Hyun
• Kim Hyung Seok
• Im Hyung Gun

Classifications

• F28F2255/18

  sintered · CPC title

• C23C18/1635 Primary

  Composition of the substrate · CPC title

• C23C18/1648

  Porous product · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C23C18/54

  Contact plating, i.e. electroless electrochemical plating · CPC title