Antistatic plastic and method of forming the same

Patent metadata

Field	Value
Publication number	US-2024209196-A1
Application number	US-202318171404-A
Country	US
Kind code	A1
Filing date	Feb 20, 2023
Priority date	Dec 21, 2022
Publication date	Jun 27, 2024
Grant date	—

Abstract

A method of forming an antistatic plastic includes providing a mixture containing 10 parts by weight of crystalline silicon particles, 1 to 30 parts by weight of an encapsulant, and 0.5 to 25 parts by weight of a backsheet material. The mixture is compounded to form an antistatic plastic, wherein the encapsulant is different from the backsheet material.

First claim

1 . A method of forming an antistatic plastic, comprising:
providing a mixture containing 10 parts by weight of crystalline silicon particles, 1 to 30 parts by weight of an encapsulant, and 0.5 to 25 parts by weight of a backsheet material; compounding the mixture to form an antistatic plastic; and thermally pressing the antistatic plastic to form a plate, and the plate has a surface resistivity of 10 6 ohm/sq to 10 14 ohm/sq, wherein the encapsulant is different from the backsheet material.

2 . The method as claimed in claim 1 , wherein the step of providing the mixture comprises:
recycling a silicon wafer-based photovoltaic module containing a glass cover, a silicon wafer, an encapsulant layer, and a backsheet; removing the glass cover from the silicon wafer-based photovoltaic module; and crushing the silicon wafer, the encapsulant layer, and the backsheet to form the mixture.

3 . The method as claimed in claim 1 , wherein the crystalline silicon particles have a particle size of 0.0001 mm to 1 mm.

4 . The method as claimed in claim 1 , wherein the encapsulant comprises ethylene vinyl acetate copolymer, thermoplastic polyolefin, polyvinyl butyral, or a combination thereof.

5 . The method as claimed in claim 1 , wherein the backsheet material comprises polyethylene terephthalate, polyvinyl fluoride, polyvinylidene fluoride, polyamide, ethylene vinyl acetate copolymer, tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride terpolymer, ethylene chlorotrifluoroethylene copolymer, polyethylene or a combination thereof.

6 . The method as claimed in claim 1 , wherein the step of compounding the mixture further comprises:
adding 1 to 100 parts by weight of an engineering plastic, 0.1 to 30 parts by weight of an additive agent, or a combination thereof to the mixture, wherein the engineering plastic is different from the encapsulant, and the engineering plastic is different from the backsheet material.

7 . The method as claimed in claim 6 , wherein the engineering plastic comprises polycarbonate, polypropylene, polyethylene terephthalate, polybutylene terephthalate, nylon, acrylonitrile-butadiene-styrene copolymer, polyethylene, polyimide, polyether ether ketone, polyoxymethylene, polymethyl methacrylate, thermoplastic rubber elastomer, or a combination thereof.

8 . The method as claimed in claim 6 , wherein the additive agent comprises conductive additive agent, modifier, lubricant, antioxidant, thermal stabilizer, reinforcing agent, or a combination thereof.

9 . The method as claimed in claim 8 , wherein the conductive additive agent comprises metal powder, metal fiber, conductive carbon black, conductive carbon fiber, graphene, carbon nanotube, or a combination thereof.

10 . (canceled)

11 . An antistatic plastic, comprising:
10 parts by weight of crystalline silicon particles; 1 to 30 parts by weight of an encapsulant; and 0.5 to 25 parts by weight of a backsheet material, wherein the encapsulant is different from the backsheet material, wherein the antistatic plastic is in the form of a plate, and the plate has a surface resistivity of 10 6 ohm/sq to 10 14 ohm/sq.

12 . The antistatic plastic as claimed in claim 11 , wherein the crystalline silicon particles have a particle size of 0.0001 mm to 1 mm.

13 . The antistatic plastic as claimed in claim 11 , wherein the encapsulant comprises ethylene vinyl acetate copolymer, thermoplastic polyolefin, polyvinyl butyral, or a combination thereof.

14 . The antistatic plastic as claimed in claim 11 , wherein the backsheet material comprises polyethylene terephthalate, polyvinyl fluoride, polyvinylidene fluoride, polyamide, ethylene vinyl acetate copolymer, tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride terpolymer, ethylene chlorotrifluoroethylene copolymer, polyethylene, or a combination thereof.

15 . The antistatic plastic as claimed in claim 11 , further comprising 1 to 100 parts by weight of an engineering plastic, 0.1 to 30 parts by weight of an additive agent, or a combination thereof, wherein the engineering plastic is different from the encapsulant, and the engineering plastic is different from the backsheet material.

16 . The antistatic plastic as claimed in claim 15 , wherein the engineering plastic comprises polycarbonate, polypropylene, polyethylene terephthalate, polybutylene terephthalate, nylon, acrylonitrile-butadiene-styrene copolymer, polyethylene, polyimide, polyether ether ketone, polyoxymethylene, polymethyl methacrylate, thermoplastic rubber elastomer, or a combination thereof.

17 . The antistatic plastic as claimed in claim 15 , wherein the additive agent comprises conductive additive agent, modifier, lubricant, antioxidant, thermal stabilizer, reinforcing agent, or a combination thereof.

18 . The antistatic plastic as claimed in claim 17 , wherein the conductive additive agent comprises metal powder, metal fiber, conductive carbon black, conductive carbon fiber, graphene, carbon nanotube, or a combination thereof.

19 . (canceled)

Assignees

• Ind Tech Res Inst

Inventors

• Hsu Chin-Shang
• Liu Pang-Hung
• Lee Nien-Tsu
• Lu Chien-Wei

Classifications

• C08K2003/0806

  Silver · CPC title

• C08L2201/04

  Antistatic · CPC title

• C08L69/00

  Compositions of polycarbonates; Compositions of derivatives of polycarbonates · CPC title

• C08L23/0853 Primary

  Ethylene vinyl acetate copolymers · CPC title

• B29B17/02

  Separating plastics from other materials · CPC title