Interposer with integrative passive components

Patent metadata

Field	Value
Publication number	US-2024203911-A1
Application number	US-202218067649-A
Country	US
Kind code	A1
Filing date	Dec 16, 2022
Priority date	Dec 16, 2022
Publication date	Jun 20, 2024
Grant date	—

Abstract

An interposer may include one or more passive components integrated within a dielectric substrate and may include one or more three-dimensional (3D) connectors that surround respective portions of the dielectric substrate. Component terminals of the one or more passive components may each be disposed on the same side of the interposer. For example, the interposer may be disposed between a first package and a second package, such that the connectors of the interposer electrically connect the first package to the second package. The component terminals of the one or more passive components may couple the integrated passive components of the interposer to only one package to which the interposer is coupled.

First claim

What is claimed is:

1 . A package module comprising:
an interposer comprising:
a dielectric substrate;
at least one connector disposed on at least one surface of the dielectric substrate;
at least one passive component embedded in the dielectric substrate; and
at least two component terminals disposed at a same side of the dielectric substrate and coupled to the at least one passive component;
a first substrate disposed on the interposer and in electrical contact with the at least one connector of the interposer; and a second substrate on which the interposer is disposed, wherein the second substrate is in electrical contact with the at least one connector of the interposer and with the at least two component terminals of the interposer.

2 . The package module of claim 1 , wherein the at least one connector comprises a first connector disposed on a first surface of the dielectric substrate and a second connector disposed on a second surface of the dielectric substrate that is opposite the second surface, wherein the first connector extends from the first substrate to the second substrate, and the second connector extends from the first substrate to the second substrate.

3 . The package module of claim 2 , wherein each of the at least two component terminals of the interposer is isolated from the first connector and the second connector of the interposer.

4 . The package module of claim 2 , the at least two component terminals of the interposer include a first component terminal and a second component terminal, wherein the first component terminal of the interposer is integrally formed with the first connector of the interposer, and the second component terminal of the interposer is isolated from the second connector of the interposer.

5 . The package module of claim 1 , wherein:
the at least one passive component comprises a first passive component and a second passive component; the at least one connector comprises a first connector, a second connector, and a third connector; and the at least two component terminals comprise first and second component terminals coupled between the first passive component and the second substrate, and third and fourth component terminals coupled between the second passive component and the second substrate.

6 . The package module of claim 5 , wherein:
the first connector is disposed on a first surface of the dielectric substrate; the second connector is disposed on a second surface of the dielectric substrate that is opposite the first surface; and the third connector is wrapped at least partially around the dielectric substrate such that the third connector is in contact with third, fourth, and fifth surfaces of the dielectric substrate, which each extend between the first surface and the second surface.

7 . The package module of claim 6 , wherein:
the first connector extends between a first conductive layer of the first substrate and a first conductive layer of the second substrate, such that the first connector electrically connects the first substrate to the second substrate; the second connector extends between a second conductive layer of the first substrate and a second conductive layer of the second substrate, such that the second connector electrically connects the first substrate to the second substrate; and the third connector extends between a third conductive layer of the first substrate and a third conductive layer of the second substrate, such that the third connector electrically connects the first substrate to the second substrate.

8 . The package module of claim 1 , wherein outermost conductive layers of each of the at least one connector and the at least two component terminals each comprise solder.

9 . The package module of claim 1 , further comprising:
a ball grid array comprising a plurality of elements that includes a plurality of solder balls and the interposer, wherein the ball grid array is disposed between the first substrate and the second substrate.

10 . An interposer comprising:
a dielectric substrate; at least one connector disposed on at least one surface of the dielectric substrate; at least one passive component embedded in the dielectric substrate; and at least two component terminals disposed at a same side of the dielectric substrate and coupled to the at least one passive component.

11 . The interposer of claim 10 , wherein the at least one connector comprises a first connector disposed on a first surface of the dielectric substrate and a second connector disposed on a second surface of the dielectric substrate that is opposite the second surface.

12 . The interposer of claim 11 , wherein each of the at least two component terminals is isolated from the first connector and the second connector.

13 . The interposer of claim 11 , wherein the at least two component terminals of the interposer include a first component terminal and a second component terminal, the first component terminal is integrally formed with the first connector, and the second component terminal is isolated from the second connector.

14 . The interposer of claim 10 , wherein:
the at least one passive component comprises a first passive component and a second passive component; the at least one connector comprises a first connector, a second connector, and a third connector; the at least two component terminals comprise first, second, third, and fourth component terminals, each disposed at the same side of the dielectric substrate; and the first and second component terminals coupled to the first passive component, and the third and fourth component terminals are coupled to the second passive component.

15 . The interposer of claim 14 , wherein:
the first connector is disposed on a first surface of the dielectric substrate; the second connector is disposed on a second surface of the dielectric substrate that is opposite the first surface; and the third connector is wrapped at least partially around the dielectric substrate such that the third connector is in contact with third, fourth, and fifth surfaces of the dielectric substrate, which each extend between the first surface and the second surface.

16 . The interposer of claim 10 , wherein outermost conductive layers of each of the at least one connector and the at least two component terminals each comprise solder.

17 . A package module comprising:
an interposer comprising:
a dielectric substrate;
a first connector disposed on a first surface of the dielectric substrate;
a second connector disposed on a second surface of the dielectric substrate, wherein the second surface of the dielectric substrate is opposite the first surface of the dielectric substrate;
at least one passive component embedded in the dielectric substrate;
a first component terminal disposed on a third surface of the dielectric substrate and coupled to the at least one passive component; and
a second component terminal disposed on the third surface of the dielectric substrate and coupled to the at least one passive component; and
a first package substrate in electrical contact with the first and second connectors of the interposer.

18 . The package module of claim 17 , further comprising:
mold material in which the interposer is embedded; and an integrated circuit die disposed over the mold material, wherein the first package substrate is coupled to the integrated circuit die via the first and second connectors of the interposer.

19 . The package module of claim 17 , further compris

Assignees

• Nxp Usa Inc

Inventors

• Gong Zhiwei
• Acar Mustafa
• Zhou Tingdong
• Wenzel Robert Joseph

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W44/241

  for passive devices or passive elements · CPC title

• H10W74/129

  forming a chip-scale package [CSP] · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title