Thermally conductive composite sheet and method for mounting heat-generating electronic component

Patent metadata

Field	Value
Publication number	US-2024199934-A1
Application number	US-202218285913-A
Country	US
Kind code	A1
Filing date	Feb 22, 2022
Priority date	Apr 19, 2021
Publication date	Jun 20, 2024
Grant date	—

Abstract

A thermally conductive composite sheet, includes: a thermally conductive sheet containing an organopolysiloxane elastomer and a thermally conductive filler, and having an Asker C hardness of 30 or less, surface tack force of 30 gf or more, a thickness of 0.3 mm or more, and a thermal conductivity of 0.8 W/mK or more; and an insulative resin film having a thickness of 10 μm or more and 50 μm or less and an elastic modulus of 1 GPa or more, wherein the insulative resin film is laminated on one side of the thermally conductive sheet. The thermally conductive composite sheet has high surface slidability so that a heat-generating electronic component can be easily mounted thereon, and also has excellent thermal conductivity.

First claim

1 - 8 . (canceled)

9 . A thermally conductive composite sheet, comprising:
a thermally conductive sheet containing an organopolysiloxane elastomer and a thermally conductive filler, and having an Asker C hardness of 30 or less, surface tack force of 30 gf (0.294 N) or more, a thickness of 0.3 mm or more, and a thermal conductivity of 0.8 W/mK or more; and an insulative resin film having a thickness of 10 μm or more and 50 μm or less and an elastic modulus of 1 GPa or more, wherein the insulative resin film is laminated on one side of the thermally conductive sheet.

10 . The thermally conductive composite sheet according to claim 9 ,
wherein the insulative resin film is a polyester resin film.

11 . The thermally conductive composite sheet according to claim 9 ,
wherein the thermally conductive sheet has a thermal conductivity of 3.0 W/mK or more.

12 . The thermally conductive composite sheet according to claim 9 ,
wherein the thermally conductive sheet is a cured product of a thermally conductive silicone composition containing following components (A) to (D): (A) 100 parts by mass of an organopolysiloxane having two or more alkenyl groups in one molecule; (B) an organohydrogen polysiloxane having two or more hydrogen atoms directly bonded to silicon atoms in such an amount that a molar number of the hydrogen atom directly bonded to the silicon atom is 0.1 to 5.0 times a molar number of the alkenyl group derived from the component (A); (C) 1,200 to 6,500 parts by mass of the thermally conductive filler; and (D) 0.1 to 2,000 ppm of a platinum group metal-based curing catalyst relative to the component (A) in terms of mass of a platinum group metal element.

13 . The thermally conductive composite sheet according to claim 10 ,
wherein the thermally conductive sheet is a cured product of a thermally conductive silicone composition containing following components (A) to (D): (A) 100 parts by mass of an organopolysiloxane having two or more alkenyl groups in one molecule; (B) an organohydrogen polysiloxane having two or more hydrogen atoms directly bonded to silicon atoms in such an amount that a molar number of the hydrogen atom directly bonded to the silicon atom is 0.1 to 5.0 times a molar number of the alkenyl group derived from the component (A); (C) 1,200 to 6,500 parts by mass of the thermally conductive filler; and (D) 0.1 to 2,000 ppm of a platinum group metal-based curing catalyst relative to the component (A) in terms of mass of a platinum group metal element.

14 . The thermally conductive composite sheet according to claim 11 ,
wherein the thermally conductive sheet is a cured product of a thermally conductive silicone composition containing following components (A) to (D): (A) 100 parts by mass of an organopolysiloxane having two or more alkenyl groups in one molecule; (B) an organohydrogen polysiloxane having two or more hydrogen atoms directly bonded to silicon atoms in such an amount that a molar number of the hydrogen atom directly bonded to the silicon atom is 0.1 to 5.0 times a molar number of the alkenyl group derived from the component (A); (C) 1,200 to 6,500 parts by mass of the thermally conductive filler; and (D) 0.1 to 2,000 ppm of a platinum group metal-based curing catalyst relative to the component (A) in terms of mass of a platinum group metal element.

15 . The thermally conductive composite sheet according to claim 12 ,
wherein the thermally conductive filler of the component (C) comprises following three components: (C-i) 500 to 1,500 parts by mass of irregular-shaped alumina with an average particle diameter of 10 to 30 μm; (C-ii) 150 to 4,000 parts by mass of spherical alumina with an average particle diameter of 30 to 85 μm; and (C-iii) 500 to 2,000 parts by mass of an insulative inorganic filler with an average particle diameter of 0.1 to 6 μm.

16 . The thermally conductive composite sheet according to claim 13 ,
wherein the thermally conductive filler of the component (C) comprises following three components: (C-i) 500 to 1,500 parts by mass of irregular-shaped alumina with an average particle diameter of 10 to 30 μm; (C-ii) 150 to 4,000 parts by mass of spherical alumina with an average particle diameter of 30 to 85 μm; and (C-iii) 500 to 2,000 parts by mass of an insulative inorganic filler with an average particle diameter of 0.1 to 6 μm.

17 . The thermally conductive composite sheet according to claim 14 ,
wherein the thermally conductive filler of the component (C) comprises following three components: (C-i) 500 to 1,500 parts by mass of irregular-shaped alumina with an average particle diameter of 10 to 30 μm; (C-ii) 150 to 4,000 parts by mass of spherical alumina with an average particle diameter of 30 to 85 μm; and (C-iii) 500 to 2,000 parts by mass of an insulative inorganic filler with an average particle diameter of 0.1 to 6 μm.

18 . The thermally conductive composite sheet according to claim 12 ,
wherein the component (C) is a treated filler with one or more of following (F) surface treatment agents selected from a group consisting of: (F-1) an alkoxysilane compound represented by a following general formula (1),
R 1 a R 2 b Si(OR 3 ) 4−a−b   (1)

wherein R 1 independently represents an alkyl group having 6 to 15 carbon atoms, R 2 independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms, R 3 independently represents an alkyl group having 1 to 6 carbon atoms, “a” represents an integer of 1 to 3, and “b” represents an integer of 0 to 2, provided that “a+b” is an integer of 1 to 3; and (F-2) a dimethyl polysiloxane with one molecular chain end blocked with a trialkoxysilyl group represented by a following general formula (2),

wherein R 4 independently represents an alkyl group having 1 to 6 carbon atoms, and “c” represents an integer of 5 to 100.

19 . The thermally conductive composite sheet according to claim 13 ,
wherein the component (C) is a treated filler with one or more of following (F) surface treatment agents selected from a group consisting of: (F-1) an alkoxysilane compound represented by a following general formula (1),
R 1 a R 2 b Si(OR 3 ) 4−a−b   (1)

wherein R 1 independently represents an alkyl group having 6 to 15 carbon atoms, R 2 independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms, R 3 independently represents an alkyl group having 1 to 6 carbon atoms, “a” represents an integer of 1 to 3, and “b” represents an integer of 0 to 2, provided that “a+b” is an integer of 1 to 3; and (F-2) a dimethyl polysiloxane with one molecular chain end blocked with a trialkoxysilyl group represented by a following general formula (2),

wherein R 4 independently represents an alkyl group having 1 to 6 carbon atoms, and “c” represents an integer of 5 to 100.

20 . The thermally conductive composite sheet according to claim 14 ,
wherein the component (C) is a treated filler with one or more of following (F) surface treatment agents selected from a group consisting of: (F-1) an alkoxysilane compound represented by a following general formula (1),
R 1 a R 2 b Si(OR 3 ) 4−a−b   (1)

wherein R 1 independently represents an alkyl group having 6 to 15 carbon atoms, R 2 independently represents a monovalent hydrocarbon group having 1 to 12 carbon atoms, R 3 independently represents an alkyl group having 1 to 6 carbon atoms, “a” represe

Assignees

• Shinetsu Chemical Co

Inventors

• Ishihara Yasuhisa
• Endo Akihiro
• Yoda Masahiro

Classifications

• B32B2457/00

  Electrical equipment · CPC title

• B32B2307/7376

  Thickness · CPC title

• B32B2307/536

  Hardness · CPC title

• B32B2307/302

  Conductive · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title