Inductor structure, magnetically permeable body and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2024194386-A1
Application number	US-202318534196-A
Country	US
Kind code	A1
Filing date	Dec 8, 2023
Priority date	Dec 9, 2022
Publication date	Jun 13, 2024
Grant date	—

Abstract

An inductor structure is provided, in which an inductance coil in the shape of a toroidal coil or a helical coil is arranged in an insulator, and a magnetically permeable body made of a magnetically permeable material is a multi-layer stacked structure and arranged in the inductance coil, where the magnetically permeable body is free from being electrically connected to the inductance coil. Therefore, the magnetically permeable body made of a magnetically permeable material in the form of a multi-layer stacked structure may effectively improve the electrical characteristics of the inductor structure.

First claim

What is claimed is:

1 . A magnetically permeable body, comprising:
an insulating carrier layer; and a first magnetically permeable group and a second magnetically permeable group stacked in layers on the insulating carrier layer, wherein the first magnetically permeable group includes a first seed layer and a first magnetically permeable alloy layer bonded to the first seed layer, the second magnetically permeable group includes a second seed layer and a second magnetically permeable alloy layer bonded to the second seed layer, wherein the first seed layer, the first magnetically permeable alloy layer, the second seed layer and the second magnetically permeable alloy layer are sequentially stacked above the insulating carrier layer, and the first magnetically permeable alloy layer and the second seed layer are positioned between the first seed layer and the second magnetically permeable alloy layer.

2 . The magnetically permeable body of claim 1 , wherein the first magnetically permeable alloy layer and/or the second magnetically permeable alloy layer contains a binary or ternary alloy consisting of iron, nickel, cobalt, manganese and zinc.

3 . The magnetically permeable body of claim 1 , wherein the first seed layer and/or the second seed layer is a non-pure copper seed layer, and the seed layer includes nickel or an alloy thereof, a conductive polymer material, a semiconductive metal oxide, or a semiconductive inorganic oxide.

4 . The magnetically permeable body of claim 3 , wherein the conductive polymer material includes one of polyaniline, polypyrrole, polythiophene, p-phenylene vinylene, and derivative thereof.

5 . The magnetically permeable body of claim 1 , wherein the first magnetically permeable group and the second magnetically permeable group have an insulating isolation layer formed therebetween.

6 . The magnetically permeable body of claim 1 , wherein the first magnetically permeable group, the second magnetically permeable group, a third magnetically permeable group and a fourth magnetically permeable group are sequentially stacked above the insulating carrier layer, and the second magnetically permeable group and the third magnetically permeable group have an insulating isolation layer formed therebetween, wherein the third magnetically permeable group includes a third seed layer and a third magnetically permeable alloy layer bonded to the third seed layer, and the fourth magnetically permeable group includes a fourth seed layer and a fourth magnetically permeable alloy layer bonded to the fourth seed layer.

7 . A method of manufacturing a magnetically permeable body, comprising:
providing an insulating carrier layer; forming a first seed layer of a first magnetically permeable group on the insulating carrier layer, electroplating a first magnetically permeable alloy layer of the first magnetically permeable group on the first seed layer via a patterning process, and removing the first seed layer outside a layout range of the first magnetically permeable alloy layer via an etching process; and forming a second seed layer of a second magnetically permeable group on the first magnetically permeable alloy layer, electroplating a second magnetically permeable alloy layer of the second magnetically permeable group on the second seed layer via a patterning process, and removing the second seed layer outside a layout range of the second magnetically permeable alloy layer via an etching process; wherein the first magnetically permeable group and the second magnetically permeable group are stacked in layers on the insulating carrier layer, the first magnetically permeable group includes the first seed layer and the first magnetically permeable alloy layer bonded to the first seed layer, the second magnetically permeable group includes the second seed layer and the second magnetically permeable alloy layer bonded to the second seed layer, and wherein the first seed layer, the first magnetically permeable alloy layer, the second seed layer and the second magnetically permeable alloy layer are sequentially stacked above the insulating carrier layer, and the first magnetically permeable alloy layer and the second seed layer are between the first seed layer and the second magnetically permeable alloy layer.

8 . The method of claim 7 , wherein the first magnetically permeable alloy layer and/or the second magnetically permeable alloy layer contains a binary or ternary alloy consisting of iron, nickel, cobalt, manganese and zinc.

9 . The method of claim 7 , wherein the first seed layer and/or the second seed layer is a non-pure copper seed layer, and the seed layer includes nickel or an alloy thereof, a conductive polymer material, a semiconductive metal oxide, or a semiconductive inorganic oxide.

10 . The method of claim 9 , wherein the conductive polymer material includes one of polyaniline, polypyrrole, polythiophene, p-phenylene vinylene, and derivative thereof.

11 . The method of claim 7 , wherein the first magnetically permeable group and the second magnetically permeable group have an insulating isolation layer formed therebetween.

12 . The method of claim 7 , wherein the first magnetically permeable group, the second magnetically permeable group, a third magnetically permeable group and a fourth magnetically permeable group are sequentially stacked above the insulating carrier layer, and the second magnetically permeable group and the third magnetically permeable group have an insulating isolation layer formed therebetween, wherein the third magnetically permeable group includes a third seed layer and a third magnetically permeable alloy layer bonded to the third seed layer, and the fourth magnetically permeable group includes a fourth seed layer and a fourth magnetically permeable alloy layer bonded to the fourth seed layer.

13 . An inductor structure, comprising:
an insulator having a first side and a second side opposing the first side; at least one inductance coil embedded in the insulator; a conductive circuit embedded in the insulator and electrically connected to the inductance coil, wherein the conductive circuit includes a plurality of electrode pads disposed on the first side and partially exposed from the first side, and a plurality of welding pads disposed on the second side and partially exposed from the second side; and the magnetically permeable body of claim 1 embedded in the inductance coil in the insulator, wherein the magnetically permeable body is free from being electrically connected to the inductance coil.

14 . The inductor structure of claim 13 , wherein the plurality of electrode pads are electrically bonded to package a capacitive element and/or an active chip.

15 . The inductor structure of claim 13 , wherein a material for forming the insulator is a photosensitive or non-photosensitive insulating material and includes Ajinomoto build-up film, photosensitive resin, polyimide, bismaleimide triazine, flame resistant 5 (FR5) prepreg, molding compound, or epoxy molding compound.

16 . The inductor structure of claim 13 , wherein the magnetically permeable body is vertically divided, horizontally divided, or grid-like divided.

17 . A method of manufacturing an inductor structure, comprising:
providing a carrier board having a metal surface; forming a first circuit structure and a first inductance circuit portion on the carrier board, wherein the first circuit structure has at least one first dielectric layer and a plurality of electrode pads; forming the magnetically permeable body of claim 1 on the first dielectri

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Hsu Shih-Ping
• Chou Pao-Hung

Classifications

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title

• H01F2027/348

  Preventing eddy currents · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F2017/0066

  with a magnetic layer · CPC title

• H01F41/14

  for applying magnetic films to substrates · CPC title