Sensor arrangement with heat insulation

Patent metadata

Field	Value
Publication number	US-2024186678-A1
Application number	US-202318531013-A
Country	US
Kind code	A1
Filing date	Dec 6, 2023
Priority date	Dec 6, 2022
Publication date	Jun 6, 2024
Grant date	—

Abstract

A sensor arrangement which is configured for measuring a filling level, a limit level and/or a pressure and has an antenna for transmitting and/or receiving a measurement signal, a waveguide with a first waveguide section for connection to the antenna and a second waveguide section, configured for transmitting the measurement signal, and a heat insulating element. The heat insulating element is arranged between the first and second waveguide sections and is arranged to at least partially prevent heat conduction between the first and second waveguide sections. The invention further relates to a heat insulating element for a sensor arrangement, the use of a heat insulating element for heat insulation of electronics of a level, limit level and/or pressure measuring device and the use of a sensor arrangement in a process plant.

First claim

1 . A sensor arrangement configured to measure a filling level, a limit level, and/or a pressure, comprising:
an antenna configured to transmit and/or receive a measurement signal; a waveguide having a first waveguide section for connection to the antenna and a second waveguide section and configured to transmit the measurement signal; and a heat insulator arranged between the first waveguide section and the second waveguide section and configured to at least partially prevent heat conduction between the first waveguide section and the second waveguide section.

2 . The sensor arrangement according to claim 1 ,
wherein the antenna is a horn antenna or a parabolic antenna.

3 . The sensor arrangement according to claim 1 ,
wherein the heat insulator is tubular in shape.

4 . The sensor arrangement according to claim 1 ,
wherein the heat insulator has an inner wall which is at least partially metallized.

5 . The sensor arrangement according to claim 1 ,
wherein the heat insulator consists of a heat-insulating material.

6 . The sensor arrangement according to claim 5 ,
where the heat-insulating material is a plastic or ceramic.

7 . The sensor arrangement according to claim 6 ,
wherein the plastic is polyether ether ketone (PEEK), or wherein the ceramic is a silicate ceramic or a zirconium oxide ceramic.

8 . The sensor arrangement according to claim 1 ,
wherein the heat insulator includes a first insulator configured to receive the first waveguide section and a second insulator configured to receive the second waveguide section and is configured to allow a temperature of the sensor arrangement to drop along a length of the heat insulator between the first insulator and the second insulator.

9 . The sensor arrangement according to claim 4 ,
wherein the heat insulator is further configured to transmit the measurement signal within the heat insulator with the inner wall between the first waveguide section and the second waveguide section of the waveguide.

10 . The sensor arrangement according to claim 1 ,
wherein the heat insulator further comprises a connecter configured to secure the heat insulator to the first waveguide section and/or the second waveguide section.

11 . The sensor arrangement according to claim 10 ,
wherein the connecter is a spring connection or a snap connection.

12 . The sensor arrangement according to claim 8 ,
wherein an inner wall of the heat insulator corresponds to an inner wall of the waveguide when the first waveguide section is connected to the first insulator and/or when the second waveguide section is connected to the second insulator.

13 . The sensor arrangement according to claim 1 , further comprising:
measurement electronics with a radar chip connected to the second waveguide section of the waveguide and configured to generate a measurement signal and/or to evaluate a measurement signal from the antenna.

14 . A heat insulator for a sensor having an antenna and a waveguide, the heat insulator comprising:
a first insulator configured to receive a first waveguide section of the waveguide; and a second insulator configured to receive a second waveguide section of the waveguide, wherein the heat insulator is arranged to at least partially prevent heat conduction between the first waveguide section and the second waveguide section.

15 . The sensor arrangement according to claim 2 ,
wherein the heat insulator is tubular in shape.

16 . The sensor arrangement according to claim 2 ,
wherein the heat insulator has an inner wall which is at least partially metallized.

17 . The sensor arrangement according to claim 3 ,
wherein the heat insulator has an inner wall which is at least partially metallized.

18 . The sensor arrangement according to claim 2 ,
wherein the heat insulator consists of a heat-insulating material.

19 . The sensor arrangement according to claim 3 ,
wherein the heat insulator consists of a heat-insulating material.

20 . The sensor arrangement according to claim 4 ,
wherein the heat insulator consists of a heat-insulating material.

Assignees

• Grieshaber Vega Kg

Inventors

• Ilg Thomas
• Bader Tobias

Classifications

• G01L5/0028

  Force sensors associated with force applying means (G01L5/0052, G01L5/0057, G01L5/0061 take precedence) · CPC title

• G01L1/25

  using wave or particle radiation, e.g. X-rays {, microwaves}, neutrons (G01L1/24 takes precedence) · CPC title

• G01F23/284 Primary

  Electromagnetic waves · CPC title

• F28D21/00

  Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00 · CPC title

• H01Q1/22 Primary

  by structural association with other equipment or articles · CPC title