Electrical and/or electronic device

Patent metadata

Field	Value
Publication number	US-2024186210-A1
Application number	US-202318526098-A
Country	US
Kind code	A1
Filing date	Dec 1, 2023
Priority date	Dec 6, 2022
Publication date	Jun 6, 2024
Grant date	—

Abstract

For an electrical and/or electronic device, comprising at least one cooling device having a top side, an electrical and/or electronic assembly arranged on the top side of the cooling device having a contact surface, wherein the contact surface faces the top side of the cooling device and is attached to the top side of the cooling device by means of an intermediate layer arranged between the cooling device and the contact surface of the electrical and/or electronic assembly, it is proposed that a coating extending flat is arranged on the top side of the cooling device, wherein the coating on the top side of the cooling device comprises at least one recess, in which the top side of the cooling device is not coated, wherein the contact surface of the electrical and/or electronic assembly in the recess is in contact with the cooling device and attached to the cooling device.

First claim

1 . An electrical and/or electronic device ( 1 ) comprising:
at least one cooling device ( 10 ) having a top side ( 11 ), an electrical and/or electronic assembly ( 40 ) arranged on the top ( 11 ) of the cooling device ( 10 ) having a contact surface ( 41 ), wherein the contact surface ( 41 ) faces the top side ( 11 ) of the cooling device ( 10 ) and is attached to the top side ( 11 ) of the cooling device ( 10 ) by means of an intermediate layer ( 30 ) arranged between the cooling device ( 10 ) and the contact surface ( 41 ) of the electrical and/or electronic assembly ( 40 ),
wherein on the top side ( 11 ) of the cooling device ( 10 ), a laminarly extending coating ( 20 ) is arranged on the top side ( 11 ) of the cooling device ( 10 ), wherein the coating ( 20 ) on the top side ( 11 ) of the cooling device ( 10 ) comprises at least one recess ( 21 ), in which the top side ( 11 ) of the cooling device ( 10 ) is not coated, wherein the contact surface ( 41 ) of the electrical and/or electronic assembly ( 40 ) in the recess ( 21 ) is in contact with the cooling device ( 10 ) and attached to the cooling device ( 10 ).

2 . The electrical and/or electronic device according to claim 1 , wherein the contact surface ( 41 ) of the electrical and/or electronic assembly ( 40 ) in the recess ( 21 ) of the coating ( 20 ) is soldered to the top side ( 11 ) of the cooling device ( 10 ), wherein the intermediate layer ( 30 ) is configured as a solder layer.

3 . The electrical and/or electronic device according to claim 1 , wherein the cooling device ( 10 ) is formed from copper.

4 . The electrical and/or electronic device according to claim 1 , wherein the coating ( 20 ) is formed from nickel.

5 . The electrical and/or electronic device according to claim 1 , wherein the recess ( 21 ) has a larger surface extent than the contact surface ( 41 ).

6 . The electrical and/or electronic device according to claim 1 , wherein the contact surface ( 41 ) is arranged entirely within the recess ( 21 ) of the coating ( 20 ) on the top side ( 11 ) of the cooling device ( 10 ).

7 . The electrical and/or electronic device according to claim 1 , wherein the intermediate layer ( 30 ) is arranged entirely within the recess ( 21 ) of the coating ( 20 ) on the top side ( 11 ) of the cooling device ( 10 ).

8 . A method for manufacturing an electrical and/or electronic assembly, wherein the method comprises the following steps:
providing a cooling device ( 10 ) having a top side ( 11 ) coating the top side ( 11 ) of the cooling device ( 10 ) with a coating ( 20 ), wherein the coating ( 20 ) is carried out while leaving a recess ( 21 ) on the top side ( 11 ) of the cooling device ( 10 ), wherein the top side ( 11 ) of the cooling device ( 10 ) is not coated in the recess ( 21 ), providing an electrical and/or electronic assembly ( 40 ) having a contact surface ( 41 ), arranging and attaching the contact surface ( 41 ) of the electrical and/or electronic assembly ( 40 ) in the recess ( 21 ) on the top side ( 11 ) of the cooling device ( 10 ) by means of an intermediate layer ( 30 ).

9 . A method for manufacturing an electrical and/or electronic assembly according to claim 8 , wherein the top side ( 11 ) of the cooling device ( 10 ) is masked prior to coating.

10 . The method for manufacturing an electrical and/or electronic assembly according to claim 9 , wherein masking of the top side ( 11 ) of the cooling device ( 10 ) occurs by clamping on a full-surface mask and/or by clamping on an edge-limiting mask and/or by masking.

Assignees

• Bosch Gmbh Robert

Inventors

• Stehlik Daniel
• Ruedenauer Valentin

Classifications

• H10W40/22 Primary

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/258 Primary

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H10W40/20

  Arrangements for cooling · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title