Circuit board, an image sensor module, a lens driving device, and a camera module including the same

Patent metadata

Field	Value
Publication number	US-2024171839-A1
Application number	US-202418428017-A
Country	US
Kind code	A1
Filing date	Jan 31, 2024
Priority date	Apr 21, 2021
Publication date	May 23, 2024
Grant date	—

Abstract

A circuit board includes an insulating portion and a pattern portion on the insulating portion. The insulating portion includes a first insulating region and a second insulating region outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween. The pattern portion includes a first pattern portion for signal transmission and a second pattern portion including a dummy pattern separated from the first pattern portion. The first pattern portion includes a first terminal portion on the first insulating region, a second terminal portion on the second insulating region, and a connection portion on the separation region and connecting between the first terminal portion and the second terminal portion. The second pattern portion includes a second-first pattern portion on the first insulating region and a second-second pattern portion on the second insulating region and separated from the second-first pattern portion.

First claim

What is claimed is:

1 . A circuit board comprising:
an insulating portion; and a conductive pattern portion disposed on the insulating portion, wherein the insulating portion includes:
a first insulating region; and
a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween,
wherein the conductive pattern portion includes:
a first terminal portion disposed on the first insulating region;
a second terminal portion disposed on the second insulating region; and
a connection portion connecting the first terminal portion and the second terminal portion, and
wherein a thickness of the connection portion is greater than at least one of a thickness of the first terminal portion disposed on the first insulating region and a thickness of the second terminal portion disposed on the second insulating region.

2 . The circuit board of claim 1 , wherein the first insulating region includes a first opening portion passing through upper and lower surfaces of the first insulating region.

3 . The circuit board of claim 1 , wherein the second insulating region includes a second opening portion passing through upper and lower surfaces of the second insulating region.

4 . The circuit board of claim 3 , wherein the second opening portion includes a plurality of the second opening portions, and
wherein the plurality of the second opening portions are spaced apart from each other in a horizontal direction in the second insulating region.

5 . The circuit board of claim 4 , wherein the second insulating region has an inner surface and an outer surface, and
wherein the plurality of second opening portions are not connected to the inner surface and the outer surface of the second insulating region.

6 . The circuit board of claim 3 , wherein the second insulating region includes four side regions, and
wherein the plurality of second opening portions are arranged to be spaced apart from each other in one of the four side regions.

7 . The circuit board of claim 3 , wherein the second opening portion has a square shape.

8 . The circuit board of claim 1 , further comprising:
a dummy pattern portion disposed on the insulating portion and spaced apart from the conductive pattern portion, and wherein the dummy pattern portion includes a first dummy portion disposed on the first insulating region and a second dummy portion disposed on the second insulating region.

9 . The circuit board of claim 8 , wherein an outer surface of the first insulating region is disposed farther outward than an outer surface of the first dummy portion.

10 . The circuit board of claim 8 , wherein an inner surface of the second dummy portion is positioned closer to an outer surface of the second insulating region than an inner surface of the second insulating region.

11 . The circuit board of claim 2 , wherein a separation distance in a horizontal direction between an outer surface of the first insulating region and an inner surface of the second insulating region includes first and second separation distances that are different from each other along a circumferential direction of the outer surface of the first insulating region.

12 . The circuit board of claim 11 , wherein the first insulating region includes first to fourth side regions,
wherein the second insulating region includes fifth to eighth side regions having an inner surface facing each of outer surfaces of the first to fourth side regions, and wherein a separation distance in the horizontal direction between an inner surface of the first side region and an outer surface of the fifth side region includes a first separation distance and a second separation distance smaller than the first separation distance.

13 . The circuit board of claim 12 , wherein a separation distance in the horizontal direction between an inner surface of the second side region and an outer surface of the sixth side region includes different separation distances,
wherein a separation distance in the horizontal direction between an inner surface of the third side region and an outer surface of the seventh side region includes different separation distances, and wherein a horizontal separation distance between an inner surface of the fourth side region and an outer surface of the eighth side region includes different separation distances.

14 . The circuit board of claim 12 , wherein at least one of a concave portion and a convex portion is provided at at least one of outer surfaces of the first to fourth side regions and inner surfaces of the fifth to eighth side regions.

15 . The circuit board of claim 1 , wherein the separation region includes first to fourth corner portions, and
wherein the connection portion includes first to fourth connection portions including bent portions respectively disposed at the first to fourth corner portions.

16 . An image sensor module comprising:
a first substrate; a second substrate disposed on the first substrate; and an image sensor disposed on the second substrate, wherein the first substrate includes:
an insulating portion; and
a conductive pattern portion disposed on the insulating portion,
wherein the insulating portion includes:
a first insulating region; and
a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween,
wherein the conductive pattern portion includes:
a first terminal portion disposed on the first insulating region;
a second terminal portion disposed on the second insulating region; and
a connection portion connecting the first terminal portion and the second terminal portion, and
wherein a thickness of the connection portion is greater than at least one of a thickness of the first terminal portion disposed on the first insulating region and a thickness of the second terminal portion disposed on the second insulating region.

17 . The image sensor module of claim 16 , further comprising a dummy pattern portion disposed on the insulating portion and spaced apart from the conductive pattern portion,
wherein the dummy pattern portion includes a first dummy portion disposed on the first insulating region and a second dummy portion disposed on the second insulating region.

18 . The image sensor module of claim 16 , wherein the second insulating region includes a plurality of opening portions passing through upper and lower surfaces of the second insulating region, and
wherein the plurality of opening portions are spaced apart in a horizontal direction in one of a plurality of side regions of the second insulating region.

19 . The image sensor module of claim 16 , wherein a separation distance in a horizontal direction between an outer surface of the first insulating region and an inner surface of the second insulating region includes first and second separation distances that are different from each other along a circumferential direction of the outer surface of the first insulating region.

20 . The image sensor module of claim 16 , wherein the first insulating region includes first to fourth side regions,
wherein the second insulating region includes fifth to eighth side regions having an inner surface facing each of outer surfaces of the first to fourth side regions, and wherein each of a horizontal separation distance between an inner surface of the first side region and the outer surface of th

Assignees

• Lg Innotek Co Ltd

Inventors

• Kim Hae Sik
• Choi So Hee
• Paik Jee Heum
• Kwon Na Kyung

Classifications

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K2201/0338

  Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title