Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
Photosensitive Resin Composition And Cured Product Therefrom
US2024168380A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024168380-A1 |
| Application number | US-202318384908-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 30, 2023 |
| Priority date | Oct 31, 2022 |
| Publication date | May 23, 2024 |
| Grant date | — |
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- Title
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Abstract
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The present invention relates to a photosensitive resin composition containing a cationic curable resin (A), a photocationic polymerization initiator (B), and a quencher (C), wherein the cationic curable resin (A) contains a polyfunctional epoxy resin (a-1) having a softening point of 50° C. or higher and/or an acid-modified product (a-2) of a polyfunctional epoxy resin having a softening point of 50° C. or higher in an amount of 60 mass % or more, and the quencher (C) is a compound represented by Formula (I) below: wherein R 1 to R 3 each independently represent an alkyl group or a phenyl group. R 1 to R 3 may be preferably phenyl groups. A dry film resist formed from the photosensitive resin composition and a cured product of the photosensitive resin composition are also disclosed.
First claim
Opening claim text (preview).
1 . A photosensitive resin composition, comprising: a cationic curable resin (A), a photocationic polymerization initiator (B), and a quencher (C), wherein the cationic curable resin (A) contains a polyfunctional epoxy resin (a-1) having a softening point of 50° C. or higher and/or an acid-modified product (a-2) of a polyfunctional epoxy resin having a softening point of 50° C. or higher in an amount of 60 mass % or more, and the quencher (C) contains a compound represented by Formula (1) below: wherein R 1 to R 3 each independently represent an alkyl group or a phenyl group. 2 . The photosensitive resin composition according to claim 1 , wherein R 1 to R 3 are phenyl groups. 3 . A dry film resist formed from the photosensitive resin composition according to claim 1 . 4 . A dry film resist formed from the photosensitive resin composition according to claim 2 . 5 . A cured product of the photosensitive resin composition according to claim 1 . 6 . A cured product of the photosensitive resin composition according to claim 2 .
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Classifications
- G03F7/0045Primary
with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title
- G03F7/004Primary
Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title
Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title
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- What does patent US2024168380A1 cover?
- The present invention relates to a photosensitive resin composition containing a cationic curable resin (A), a photocationic polymerization initiator (B), and a quencher (C), wherein the cationic curable resin (A) contains a polyfunctional epoxy resin (a-1) having a softening point of 50° C. or higher and/or an acid-modified product (a-2) of a polyfunctional epoxy resin having a softening point…
- Who is the assignee on this patent?
- Nippon Kayaku Kk
- What technology area does this patent fall under?
- Primary CPC classification G03F7/0045. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu May 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).