Covers for electronic devices

Patent metadata

Field	Value
Publication number	US-2024158943-A1
Application number	US-202118282661-A
Country	US
Kind code	A1
Filing date	Mar 19, 2021
Priority date	Mar 19, 2021
Publication date	May 16, 2024
Grant date	—

Abstract

The present disclosure is drawn to covers for electronic devices. In one example, a substrate can include a metal alloy. An acid anodizing layer can be formed on the substrate. A dye application can be applied on the acid anodizing layer. A first nickel-free sealing layer can be formed on the dye application. An alkaline anodizing layer can be formed on the first sealing layer. A second nickel-free sealing layer can be formed on the alkaline anodizing layer.

First claim

What is claimed is:

1 . A cover for an electronic device comprising:
a substrate including a metal alloy; an acid anodizing layer on the substrate; a dye application on the acid anodizing layer; a first nickel-free sealing layer on the dye application; an alkaline anodizing layer on the first sealing layer; and a second nickel-free sealing layer on the alkaline anodizing layer.

2 . The cover of claim 1 , wherein the metal alloy is an aluminum alloy, a magnesium alloy, or hybrid where a first portion of the substrate is composed of an aluminum alloy and a second portion is composed of a magnesium alloy.

3 . The cover of claim 1 , further comprising a milled edge is formed along a corner of the substrate to expose a portion of the substrate after the first nickel-free sealing layer is formed and before the alkaline anodizing layer is formed, wherein the alkaline anodizing layer covers the milled edge.

4 . The cover of claim 3 , wherein the milled edge is a chamfered edge formed by computer numeric control, diamond cutting, or laser engraving.

5 . The cover of claim 1 , wherein the alkaline anodizing layer is formed using about 3 wt % to about 10 wt % of borax and about 2 vit % to about 8 wt % of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/or a complexing agent.

6 . The cover of claim 1 , wherein the first sealing layer and the second sealing layer includes aluminum fluoride, cerium fluoride, cerium acetate, chromium(III) hydroxide, and/or aluminum acetate.

7 . The cover of claim 1 , wherein the dye application includes a dye selected from methylene blue, basic fuchsin, crystal violet, eosin, acid fuchsin, congo red, gentian violet, methyl violet, brilliant crystal glue, romanowsky dye, anthraquinone dyes; acridine orange, quinone-imine dyes, xanthene dyes, 2-amino-4-(azoyl)-azo-thiazole, or a combination thereof.

8 . The cover of claim 1 , wherein the substrate is degreased before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate.

9 . The cover of claim 1 , wherein the substrate is neutralized before the acid anodizing layer is formed using a neutralization compound including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.

10 . An electronic device comprising:
an electronic component; and a cover enclosing a portion or all of the electronic component, the cover comprising:
a substrate including a metal alloy;
an acid anodizing layer on the substrate;
a dye application on the acid anodizing layer;
a first nickel-free sealing layer on the dye application;
an alkaline anodizing layer on the first sealing layer; and
a second nickel-free sealing layer on the alkaline anodizing layer.

11 . The electronic device of claim 10 , wherein the electronic device is a laptop, a desktop computer, a keyboard, a mouse, a smart phone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a combination thereof, and wherein a milled edge is located at an edge of a touchpad, an edge of a fingerprint scanner, or an edge of a logo.

12 . A method of making a cover for an electronic device comprising:
forming an enclosure with a substrate; applying an acid anodizing layer on the substrate; applying a dye application on the acid anodizing layer; applying a first nickel-free sealing layer on the dye application; applying an alkaline anodizing layer on the first sealing layer; and applying a second nickel-free sealing layer on the alkaline anodizing layer.

13 . The method of claim 12 , further comprising milling an edge along a corner of the substrate to expose a portion of the substrate after the first nickel-free sealing layer is applied and before the alkaline anodizing layer is applied, wherein the alkaline anodizing layer covers the milled edge.

14 . The method of claim 12 , further comprising degreasing the substrate before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate.

15 . The method of claim 12 , further comprising neutralizing the substrate before the acid anodizing layer is formed using a neutralization compound including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.

Assignees

• Hewlett Packard Development Co

Inventors

• Guo Qingyong
• Yeh Ya-Ting
• Chang Chi Hao
• Wu Kuan-Ting

Classifications

• C25D11/12 Primary

  Anodising more than once, e.g. in different baths · CPC title

• C25D11/16

  Pretreatment {, e.g. desmutting} · CPC title

• C25D11/243

  using organic dyestuffs · CPC title

• C25D11/246

  for sealing layers · CPC title

• C25D11/06 Primary

  characterised by the electrolytes used · CPC title