Curable composition and use thereof

US2024124621A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024124621-A1
Application numberUS-202318515628-A
CountryUS
Kind codeA1
Filing dateNov 21, 2023
Priority dateMay 21, 2021
Publication dateApr 18, 2024
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention provides a curable composition comprising (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst, which can thermally be curable at a temperature of lower than 100° C. and can be also thermally curable and radiation curable. The present curable composition exhibits favorable adhesion strength on various substrates when cured.

First claim

Opening claim text (preview).

What is claimed is: 1 . A curable composition comprising: (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst. 2 . The curable composition according to claim 1 , wherein the component (A) is selected from monofunctional (meth)acrylate monomers, polyfunctional (meth)acrylate monomers and oligomers thereof. 3 . The curable composition according to claim 2 , wherein the monofunctional (meth)acrylate monomer is selected from methyl (meth)acrylate, (meth)acrylic acid, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth) acrylate, cyclohexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth) acrylate, tricyclodecanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, phenyl (meth)acrylate, tolyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, 2-phenoxyethyh acrylate, 2-aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, and combinations thereof. 4 . The curable composition according to claim 2 , wherein the polyfunctional (meth)acrylate monomer is selected from ethoxylated trimethylolpropane triacrylate, trimethylol propane tri(meth)acrylate, dipentaerythritol pentaacrylate, pentaerythritol triacrylate, 1,6-hexanedioldiacrylate, neopentyl glycol diacrylate, pentaerythritol tetraacrylate, 1,4-butanediol diacrylate, trimethylolpropane tri(meth)acrylate, tri(propylene glycol) diacrylate, neopentyl glycol propoxylate diacrylate, diethylene glycol dimethacrylate, bisphenol A diglycidyl ether di(meth)acrylate, dicyclopentadiene dimethanol di(meth)acrylate, tricyclodecanedimethanol diacrylate, and combinations thereof. 5 . The curable composition according to claim 1 , wherein the component (B) is selected from diphenyl iodonium phosphate, diphenyl iodonium borate, and the combination thereof; preferably selected from (4-methylphenyl)-[4-(2-methylpropyl)phenyl]iodonium hexafluorophosphate, (4-methylphenyl)-phenyliodonium hexafluorophosphate, bis(4-tert-butylphenyl)iodonium hexafluorophosphate, bis(4-methylphenyl)iodonium hexafluorophosphate, (4-ethylphenyl)-[4-(2-methylpropyl)phenyl]iodoniumhexafluorophosphate, bis(t-butylphenyl)iodonium hexafluorophosphate, bis(3,4-dimethylphenyl)iodonium hexafluorophosphate, (4-isopropylphenyl)(p-tolyl)iodonium tetrakis(perfluorophenyl)borate, (4-methylphenyl)-(2-propan-2-ylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranuide, bis(2-methylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranuide, (4-methylphenyl)-[4-(2-methylpropyl)phenyl]iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranuide, bis(4-dodecylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranuide, bis(2-dodecylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranuide, (2-methylphenyl)-(2-propan-2-ylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranuide, bis(2-tert-butylphenyl)iodonium tetrakis(2,3,4,5,6-pentafluorophenyl)boranuide, 1,4-di(3-phenylpropyl)-2,3-diperfluorophenyl-1,4-diiodobutadiene, butyl(triphenyl)boranuide (4-cyclohexylphenyl)-(4-methylphenyl)iodonium, (4-hexylphenyl)-phenyliodonium tetraphenylboranuide, (4-cyclohexylphenyl)-phenyliodonium tetraphenylboranuide, and combinations thereof. 6 . The curable composition according to claim 1 , wherein the component (C) is selected from amine adduct latent amine catalyst, preferably obtained by the reaction products of an amine compound with an epoxy compound, an isocyanate compound and/or a urea compound; core-shell type latent amine catalyst; master batch type latent amine catalyst; and combinations thereof. 7 . The curable composition according to claim 1 , wherein the composition further comprises (D) at least one additive selected from curing reaction inhibitors, pigments, dyes, fluorescent dyes, heat resistant additives, flame retardants, plasticizers, adhesion-imparting agents, fillers, and combinations thereof. 8 . The curable composition according to claim 1 , wherein the composition is thermally curable. 9 . The curable composition according to claim 1 , wherein the composition further comprises (E) at least one photo radical polymerization initiator. 10 . The curable composition according to claim 9 , wherein the photo radical polymerization initiator is α-cleavage photo radical polymerization initiator, hydrogen abstracting photo radical polymerization initiator and combinations thereof, preferably selected from benzyl dimethyl ketal, benzoin ethers, hydroxy alkyl phenyl ketones, benzoyl cyclohexanol, dialkoxy acetophenones, 1-hydroxycyclohexyl phenyl ketone, trimethylbenzoyl phosphine oxides, methyl thio phenyl morpholino ketones and morpholino phenyl amino ketones, benzophenones, thioxanthones, benzyls, camphorquinones, ketocoumarins; and combinations thereof. 11 . The curable composition according to claim 9 , wherein the composition is thermally curable and radiation curable. 12 . The curable composition according to claim 1 , wherein the component (A) is present in an amount of from 50% to 95% by weight based on the total weight of the composition. 13 . The curable composition according to claim 1 , wherein the component (B) is present in an amount of from larger than 0% to less than 3% by weight based on the total weight of the composition. 14 . The curable composition according to claim 1 , wherein the component (C) is present in an amount of from 3% to 47% by weight based on the total weight of the composition. 15 . The curable composition according to claim 1 , wherein the component (D) is present in an amount of from larger than 0% to 10% by weight based on the total weight of the composition. 16 . The curable composition according to claim 1 , wherein the component (E) is present in an amount of from 0% to 10% by weight based on the total weight of the composition. 17 . Cured product of a curable composition according to claim 1 . 18 . An article comprising: a first substrate, a cured product according to claim 17 , and a second substrate bonded to the first substrate through the cured product. 19 . An electronic device comprising the article according to claim 18 .

Assignees

Inventors

Classifications

  • C08F20/06Primary

    Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof · CPC title

  • Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers · CPC title

  • Polymers · CPC title

  • of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate · CPC title

  • containing also halogens · CPC title

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What does patent US2024124621A1 cover?
The present invention provides a curable composition comprising (A) at least one (meth)acrylate; (B) at least one diaryliodonium salt; and (C) at least one latent amine catalyst, which can thermally be curable at a temperature of lower than 100° C. and can be also thermally curable and radiation curable. The present curable composition exhibits favorable adhesion strength on various substrates …
Who is the assignee on this patent?
Henkel Ag & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification C08F20/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Apr 18 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).