Joint portion evaluating method and joint portion evaluating device

Patent metadata

Field	Value
Publication number	US-2024118234-A1
Application number	US-202218275906-A
Country	US
Kind code	A1
Filing date	Feb 9, 2022
Priority date	Feb 12, 2021
Publication date	Apr 11, 2024
Grant date	—

Abstract

A joint portion evaluating method for measuring and evaluating a joint state of a joint portion at which a first joint body and a second joint body are joined together, the joint portion evaluating method including the steps of: acquiring as a reference value a capacitance value of the joint portion in a reference measurement state serving as a reference for measurement conditions; changing a measurement state from the reference measurement state and acquiring as a measured value a capacitance value of the joint portion in a changed measurement state arising after the change of the measurement state; deriving as a measurement evaluation value a value obtained by referencing the measured value with the reference value; and performing an evaluation based on the derived measurement evaluation value.

First claim

1 . A joint portion evaluating method for measuring and evaluating a joint state of a joint portion at which a first joint body and a second joint body are joined together, the joint portion evaluating method comprising:
acquiring as a reference value a capacitance value of the joint portion in a reference measurement state serving as a reference for measurement conditions; changing a measurement state from the reference measurement state, and acquiring as a measured value a capacitance value of the joint portion in a changed measurement state arising after the changing of the measurement state; deriving as a measurement evaluation value a value obtained by referencing the measured value with the reference value; and performing an evaluation based on the measurement evaluation value derived.

2 . The joint portion evaluating method according to claim 1 , wherein the joint portion is an adhesive-bonded portion at which the first joint body and the second joint body are bonded together via an adhesive.

3 . The joint portion evaluating method according to claim 1 , wherein the joint portion is a fusion-bonded portion at which the first joint body and the second joint body are fusion-bonded together.

4 . The joint portion evaluating method according to claim 1 , wherein
the reference measurement state includes a reference temperature serving as a reference at the joint portion, and, the acquiring of the measured value includes changing a temperature of the joint portion from the reference temperature, and acquiring as the measured value a capacitance value of the joint portion at a changed temperature serving as the changed measurement state arising after the change of the temperature.

5 . The joint portion evaluating method according to claim 4 , wherein the reference temperature is a room temperature.

6 . The joint portion evaluating method according to claim 4 , wherein the changed temperature is higher than the reference temperature.

7 . The joint portion evaluating method according to claim 1 , wherein
the capacitance value of the joint portion is acquired by applying an alternating current signal having a predetermined measurement frequency, and the measurement frequency is 100 Hz or higher and 100 MHz or lower.

8 . The joint portion evaluating method according to claim 1 , wherein
the reference measurement state includes a reference measurement frequency serving as a reference for the alternating current signal to be applied when the capacitance value of the joint portion is acquired, and, the acquiring of the measured value includes changing a frequency from the reference measurement frequency, and acquiring as the measured value the capacitance value of the joint portion at a changed frequency serving as the changed measurement state arising after the changing of the frequency.

9 . The joint portion evaluating method according to claim 8 , wherein
the reference measurement frequency is 1 kHz or higher and 100 kHz or lower, and the changed frequency is 10 MHz or higher and 100 MHz or lower.

10 . The joint portion evaluating method according to claim 8 , wherein
when the measurement evaluation value based on the reference temperature serving as a reference for the joint portion and the measurement evaluation value based on the reference measurement frequency are acquired in the acquiring of the measured value, the performing of the evaluation includes acquiring a correlation between the measurement evaluation value based on the reference temperature and the measurement evaluation value based on the reference measurement frequency, and performing an evaluation based on the correlation.

11 . The joint portion evaluating method according to claim 1 , further comprising:
acquiring a sound reference value as the reference value of the joint portion being sound; acquiring a sound measured value as the measured value of the joint portion being sound; and deriving as a sound evaluation value a value obtained by referencing the sound measured value with the sound reference value, wherein the performing of the evaluation includes performing the evaluation based on a difference between the sound evaluation value and the measurement evaluation value.

12 . The joint portion evaluating method according to claim 11 , wherein
the performing of the evaluation includes, when the difference between the sound evaluation value and the measurement evaluation value is within a predetermined sound range, rating the joint portion sound.

13 . A joint portion evaluating device that measures and evaluates a joint state of a joint portion at which a first joint body and a second joint body are joined together, the joint portion evaluating device comprising:
a pair of electrodes disposed to form a capacitor at the joint portion; and a control unit that measures a capacitance value of the joint portion and evaluates the joint portion based on the capacitance value measured, wherein the control unit performs:
acquiring as a reference value a capacitance value of the joint portion in a reference measurement state serving as a reference for measurement conditions;
changing a measurement state from the reference measurement state, and
acquiring as a measured value a capacitance value of the joint portion in the changed measurement state arising after the changing of the measurement state;
deriving as a measurement evaluation value a value obtained by referencing the measured value with the reference value; and
performing an evaluation based on the measurement evaluation value derived.

14 . The joint portion evaluating device according to claim 13 , wherein
the first joint body and the second joint body form a laminate of composite material layers including a carbon fiber and a resin, the pair of electrodes includes a predetermined composite material layer of the first joint body on one side of the joint portion and a predetermined composite material layer of the second joint body on another side of the joint portion.

15 . The joint portion evaluating device according to claim 13 , further comprising:
an alternating current power source that applies an alternating current signal to the pair of electrodes, wherein the alternating current power source superimposes a direct current signal on the alternating current signal to acquire a capacitance value of the joint portion.

Assignees

• Mitsubishi Heavy Ind Ltd
• Univ Akita

Inventors

• Muraoka Mikio
• Kamihara Nobuyuki
• Takagi Kiyoka
• Kamo Sota
• Ishikawa Naomoto
• Horizono Hideki
• Takayanagi Toshiyuki

Classifications

• G01N27/24 Primary

  Investigating the presence of flaws · CPC title

• G01N27/22 Primary

  by investigating capacitance · CPC title