Dithiapolyether diol, method for producing same, snag plating solution containing dithiapolyether diol, and method for forming plating film with use of snag plating solution

Patent metadata

Field	Value
Publication number	US-2024116861-A1
Application number	US-202017768312-A
Country	US
Kind code	A1
Filing date	Dec 11, 2020
Priority date	Dec 12, 2019
Publication date	Apr 11, 2024
Grant date	—

Abstract

This dithiapolyether diol has a halogen content of less than 10 ppm and a purity of 80% or more and is represented by the following general formula (1) or (2). In the general formula (1) or (2), x and y are arbitrary natural numbers

First claim

1 . Dithiapolyether diol,
wherein a halogen content is 10 ppm or less, a purity is 80% or more, and the dithiapolyether diol is represented by the following general formula (1) or (2), and in the general formula (1) or (2), x and y are arbitrary natural numbers,

2 . The dithiapolyether diol according to claim 1 ,
wherein a color number in Hazen units (APHA) as measured according to JIS K 0071-1 (1998) is 100 or less.

3 . A SnAg plating solution comprising:
the dithiapolyether diol according to claim 1 .

4 - 8 . (canceled)

Assignees

• Mitsubishi Materials Corp

Inventors

• Tatsumi Koji

Classifications

• C07C323/12 Primary

  the carbon skeleton being acyclic and saturated · CPC title

• C25D3/56

  of alloys · CPC title

• C25D3/60 Primary

  containing more than 50% by weight of tin · CPC title

• C07C319/22

  of hydropolysulfides or polysulfides · CPC title

• C25D3/64

  containing more than 50% by weight of silver · CPC title