Systems and methods for active and passive cooling of electrical components

Patent metadata

Field	Value
Publication number	US-2024107721-A1
Application number	US-202318162430-A
Country	US
Kind code	A1
Filing date	Jan 31, 2023
Priority date	Sep 28, 2022
Publication date	Mar 28, 2024
Grant date	—

Abstract

A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.

First claim

What is claimed is:

1 . A power module, comprising:
one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.

2 . The power module of claim 1 , wherein the passive heat dissipation element is shaped to be enclosure-free.

3 . The power module of claim 1 , wherein each surface of the passive heat dissipation element terminates in free space.

4 . The power module of claim 1 , wherein the one or more power switches are mechanically connected to at least one of the active heat dissipation element or the passive heat dissipation element via a clamp force.

5 . The power module of claim 1 , wherein the passive heat dissipation element comprises a thermo-conductive plate.

6 . The power module of claim 1 , wherein the passive heat dissipation element comprises a first end and a second end, and wherein the first end and the second end are in thermal contact with the active heat dissipation element.

7 . The power module of claim 1 , wherein passive heat dissipation element comprises a third planar surface on a same plane as the first planar surface, wherein the second planar surface is on a different plane as the first planar surface and connects the first planar surface to the third planar surface.

8 . The power module of claim 7 , further comprising a first curved surface connecting the first planar surface to the second planar surface and a second curved surface connecting the third planar surface to the second planar surface.

9 . The power module of claim 7 , wherein the second planar surface is in direct contact with the active heat dissipation element.

10 . The power module of claim 7 , wherein the second planar surface is between a first power switch of the one or more power switches and a second power switch of the one or more power switches.

11 . The power module of claim 1 , further comprising an inlet and an outlet wherein the active heat dissipation element comprises an enclosure shaped for fluid passage, the enclosure further shaped to receive fluid from the inlet and to expel fluid via the outlet.

12 . The power module of claim 1 , wherein the power module is configured for fluid flow only via the active heat dissipation element.

13 . A method for dissipating heat, the method comprising:
generating heat at a power switch; dissipating at least a portion of the heat generated at the power switch to a passive heat dissipation element in contact facing a first surface of the power switch, wherein each surface of the passive heat dissipation element terminates in free space; and dissipating at least a portion of the heat dissipated to the passive heat dissipation element to an active heat dissipation element in contact with and facing a second surface of the power switch via thermal contact between the passive heat dissipation element and the active heat dissipation element, wherein the active heat dissipation element comprises a fluid passage.

14 . The method of claim 13 , wherein the passive heat dissipation element is shaped to be enclosure-free.

15 . The method of claim 13 , further comprising dissipating at least a portion of the heat dissipated to the active heat dissipation element to a fluid in the fluid passage.

16 . The method of claim 13 , wherein the at least the portion of the heat dissipated from the passive heat dissipation element to the active heat dissipation element is dissipated via one or more contact points thermally connecting the passive heat dissipation element and the active heat dissipation element.

17 . A power module, comprising:
a heat generating electrical component; and a passive heat dissipation element in contact with and facing a first surface of the heat generating electrical component, the passive heat dissipation element comprising:
a clamp structure;
a contact interface;
a planar surface facing the heat generating electrical component;
a first curved surface connecting the planar surface to the clamp structure; and
a second curved surface connecting the planar surface to the contact interface, wherein at least one of the clamp structure or the contact interface is in direct contact with an active heat dissipation element.

18 . The power module of claim 17 , wherein the passive heat dissipation element is shaped to be enclosure-free.

19 . The power module of claim 17 , wherein the active heat dissipation element is an active heat sink having a fluid passage.

20 . The power module of claim 17 , wherein each surface of the passive heat dissipation element terminates in free space.

Assignees

• Delphi Tech Ip Ltd

Inventors

• Gertiser Kevin M
• Fruth Chris

Classifications

• H05K2201/10166

  Transistor · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K7/20927

  Liquid coolant without phase change · CPC title

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H05K7/20854

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title