Stacked chip layout and method of making the same
US-2015061110-A1 · Mar 5, 2015 · US
US2024103562A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024103562-A1 |
| Application number | US-202318521301-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 28, 2023 |
| Priority date | Dec 18, 2020 |
| Publication date | Mar 28, 2024 |
| Grant date | — |
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Examples described herein generally relate to clock tree routing in a chip stack. In an example, a multi-chip device includes a chip stack. The chip stack includes chips. The chip stack includes a clock tree. In-chip routing of the clock tree is contained within one logical chip of the chip stack. The chip stack includes leaf nodes disposed in respective chips. Each leaf node of the leaf nodes is electrically connected to the clock tree through a respective leaf-level connection bridge. The respective leaf-level connection bridge extends in an out-of-chip direction through a plurality of the chips.
Opening claim text (preview).
What is claimed is: 1 . An integrated circuit (IC) device comprising: a chip stack comprising a plurality of IC chips, the plurality of IC chips comprising: a first IC chip comprising first leaf nodes; a second IC chip comprising second leaf nodes; and a first clock tree comprising first in-chip routing within the first IC chip and coupled to the first leaf nodes, wherein a first out-of-chip leaf-level connection bridge couples one of the first leaf nodes with one of the se…
Electricity · mapped topic
Electricity · mapped topic
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