Light-emitting module, method of manufacturing wiring substrate, and method of manufacturing light-emitting module

Patent metadata

Field	Value
Publication number	US-2024098901-A1
Application number	US-202318465803-A
Country	US
Kind code	A1
Filing date	Sep 12, 2023
Priority date	Sep 16, 2022
Publication date	Mar 21, 2024
Grant date	—

Abstract

A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, an electrode portion, and an insulating portion, and defines one or more first through holes. The mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface. The first region and the second region are separated from each other by the third region. A boundary of each of the first through holes is defined in the first region. The wiring region of each of the light-emitting devices is bonded to the electrode portion of the wiring substrate.

First claim

What is claimed is:

1 . A light-emitting module comprising:
one or more light-emitting devices each including a plurality of light-emitting elements, and a package including an upper surface provided with the plurality of light-emitting elements and a lower surface having a wiring region; and a wiring substrate including a metal portion, an electrode portion, and an insulating portion insulating the metal portion from the electrode portion, the wiring substrate defining one or more first through holes and including a mounting surface on which the one or more light-emitting devices are mounted, wherein the mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface, the first region and the second region are separated from each other by the third region on the mounting surface, a boundary of each of the one or more first through holes is defined in the first region on the mounting surface, and the wiring region of each of the one or more light-emitting devices is bonded to the electrode portion of the wiring substrate.

2 . The light-emitting module according to claim 1 , wherein
each of the one or more first through holes is configured to receive a fixing member to fix the wiring substrate to an additional member.

3 . The light-emitting module according to claim 2 , wherein
the wiring substrate further defines one or more second through holes used for positioning the wiring substrate with respect to the additional member when fixing the wiring substrate to the additional member, and a boundary of the one or more second through holes is defined in the third region on the mounting surface.

4 . The light-emitting module according to claim 1 , wherein
the metal portion of the wiring substrate includes a first upper surface constituting the first region, and a second upper surface and a third upper surface each located at a position lower than the first upper surface, the electrode portion of the wiring substrate includes a first electrode portion arranged over the second upper surface of the metal portion and a second electrode portion arranged over the third upper surface of the metal portion, the insulating portion of the wiring substrate includes a first insulating portion arranged over the second upper surface of the metal portion and insulating the first electrode portion and the metal portion from each other, and a second insulating portion arranged over the third upper surface of the metal portion and insulating the second electrode portion and the metal portion from each other, and the wiring region of each of the one or more light-emitting devices includes a first wiring portion bonded to one of the first electrode portion and the second electrode portion of the wiring substrate and a second wiring portion bonded to the other of the first electrode portion and the second electrode portion of the wiring substrate.

5 . The light-emitting module according to claim 4 , wherein
the one or more light-emitting devices include a first light-emitting device and a second light-emitting device, the first light-emitting device and the second light-emitting device are electrically connected in series, each of the first electrode portion and the second electrode portion of the wiring substrate includes a first electrode region bonded to the first light-emitting device and a second electrode region bonded to the second light-emitting device, the first electrode region of the first electrode portion is bonded to the first wiring portion of the first light-emitting device, the second electrode region of the first electrode portion is bonded to the second wiring portion of the second light-emitting device, and the second electrode portion of the wiring substrate is present midway in a current path from the first wiring portion of the first light-emitting device to the second wiring portion of the second light-emitting device.

6 . The light-emitting module according to claim 5 , wherein
the first electrode region of the second electrode portion is bonded to the second wiring portion of the first light-emitting device, the second electrode region of the second electrode portion is bonded to the first wiring portion of the second light-emitting device, in the wiring substrate, the first electrode region and the second electrode region of the first electrode portion are not electrically connected to each other, and the first electrode region and the second electrode region of the second electrode portion are electrically connected to each other, and the first electrode region and the second electrode region of the first electrode portion are electrically connected to each other via the first light-emitting device and the second light-emitting device mounted on the wiring substrate.

7 . The light-emitting module according to claim 4 , wherein
the insulating portion includes a first insulating member arranged on the second upper surface and the third upper surface of the metal portion, and a second insulating member arranged over the first insulating member and defining the third region.

8 . The light-emitting module according to claim 4 , wherein
in the metal portion, the first upper surface is arranged between the second upper surface and the third upper surface in a top view, and the second upper surface and the third upper surface are separated from each other.

9 . The light-emitting module according to claim 1 , wherein
the package of each of the one or more light-emitting devices further includes a heat dissipation region in a lower surface of the package, the heat dissipation region being bonded to the metal portion of the wiring substrate.

10 . The light-emitting module according to claim 1 , further comprising:
a heat sink on which the wiring substrate is disposed; and one or more fixing members that are respectively inserted into the one or more first through holes to fix the wiring substrate to the heat sink.

11 . A method of manufacturing a wiring substrate including a metal portion, an electrode portion, and an insulating portion, the method comprising:
preparing a metal member including a first portion having a first surface and a second portion having a second surface located at a lower position than the first surface, the metal member defining a through hole with a boundary of the through hole being defined by the first surface in a top view; providing a first insulating member and an electrode member over the second surface so that the metal member and the electrode member are separated from each other in the top view; and providing a second insulating member between the metal member and the electrode member.

12 . The method of manufacturing the wiring substrate, according to claim 11 , wherein
the preparing of the metal member includes preparing the metal member further including a third portion having a third surface located at a lower position than the first surface, the first surface being arranged between the second surface and the third surface in the top view, and the providing of the first insulating member and the electrode member includes providing the first insulating member and the electrode member over the second surface and over the third surface.

13 . A method of manufacturing a light-emitting module, the method comprising:
providing the wiring substrate manufactured by the method of manufacturing the wiring substrate according to claim 11 ; preparing a light-em

Assignees

• Nichia Corp

Inventors

• TAKASE Shota
• Uemura Masanori
• Sakamoto Masakazu
• Noda Yosuke

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/858

  Means for heat extraction or cooling · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H05K1/021

  Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title