Display substrate, preparation method therefor, and display device

Patent metadata

Field	Value
Publication number	US-2024097071-A1
Application number	US-202118262802-A
Country	US
Kind code	A1
Filing date	Jan 25, 2021
Priority date	Jan 25, 2021
Publication date	Mar 21, 2024
Grant date	—

Abstract

Disclosed in the present application are a display substrate, a preparation method therefor, and a display device. The display substrate includes a rigid substrate, and a flexible film layer and a display function layer that are sequentially stacked on the rigid substrate. The rigid substrate is provided with an opening at a bending region to expose the flexible film layer in the bending region. The display substrate further includes a first light absorption portion in a display region and is on the side of the display region close to the bending region. The first light absorption portion is on the side of the rigid substrate facing away from the flexible film layer or is between the rigid substrate and the flexible film layer.

First claim

1 .- 18 . (canceled)

19 . A display substrate, comprising: a display region, a bending region and a bonding region,
wherein the display substrate is bent along the bending region, such that the bending region is bent on a backlight side of the display region of the display substrate; the display substrate comprises a rigid substrate, and a flexible film layer and a display function layer sequentially stacked on the rigid substrate; the rigid substrate has an opening in the bending region to expose the flexible film layer in the bending region; the display substrate further comprises a first light absorption portion in the display region and on one side of the display region close to the bending region; and the first light absorption portion is on one side of the rigid substrate facing away from the flexible film layer or on one side of the rigid substrate facing the flexible film layer.

20 . The display substrate according to claim 19 , further comprising a second light absorption portion in the bonding region and on one side of the bonding region close to the bending region; and
the second light absorption portion is on the side of the rigid substrate facing away from the flexible film layer or on the side of the rigid substrate facing the flexible film layer.

21 . The display substrate according to claim 20 , wherein a material of the first light absorption portion comprises an inorganic material; and/or a material of the second light absorption portion comprises an inorganic material.

22 . The display substrate according to claim 19 , wherein a boundary of one side of the first light absorption portion close to the bending region and a boundary of the side of the display region close to the bending region have a preset distance therebetween.

23 . The display substrate according to claim 19 , wherein a width of a light absorption layer is greater than or equal to 1 mm.

24 . The display substrate according to claim 21 , wherein the inorganic material comprises a semiconductor material, and a band gap Eg of the semiconductor material meets the following conditions:
Eg≤hkc/λ; wherein λ is a wavelength of laser light used when a laser lift-off technology is used to form the opening, h is a Planck constant, k is a constant, and c is a speed of light.

25 . The display substrate according to claim 24 , wherein the semiconductor material comprises a metal oxide semiconductor or a silicon semiconductor.

26 . The display substrate according to claim 25 , wherein the silicon semiconductor comprises polycrystalline silicon or monocrystalline silicon.

27 . The display substrate according to claim 26 , wherein a thickness of the first light absorption portion is 300 angstroms to 3000 angstroms; and
a thickness of the second light absorption portion is 300 angstroms to 3000 angstroms.

28 . The display substrate according to claim 21 , wherein the first light absorption portion is arranged to be the same as the second light absorption portion in layer and material.

29 . The display substrate according to claim 28 , wherein the first light absorption portion and the second light absorption portion are arranged on one side of the rigid substrate facing the flexible film layer.

30 . The display substrate according to claim 19 , wherein the rigid substrate comprises a first sub-rigid substrate and a second sub-rigid substrate, the first sub-rigid substrate is at the display region, and the second sub-rigid substrate is at the bonding region; and the display substrate further comprises:
a first buffer adhesive covering a side wall of the first sub-rigid substrate facing the opening.

31 . The display substrate according to claim 30 , further comprising:
a second buffer adhesive covering a side wall of the second sub-rigid substrate facing the opening.

32 . The display substrate according to claim 19 , wherein the display function layer comprises:
a buffer layer on one side of the flexible film layer away from the rigid substrate; a plurality of first wires on one side of the buffer layer away from the flexible film layer; a first insulating layer on one sides of the first wires away from the flexible film layer; a plurality of second wires on one side of the first insulating layer away from the flexible film layer, wherein each first wire is connected with at least one second wire through a first via hole penetrating through the first insulating layer; a second insulating layer on one sides of the second wires away from the flexible film layer; and a light emitting diode on one side of the second insulating layer away from the flexible film layer, wherein the light emitting diode is connected with the second wires through a second via hole penetrating through the second insulating layer.

33 . A display apparatus, comprising a plurality of display substrates spliced together, wherein each display substrate comprises: a display region, a bending region and a bonding region,
wherein the display substrate is bent along the bending region, such that the bending region is bent on a backlight side of the display region of the display substrate; the display substrate comprises a rigid substrate, and a flexible film layer and a display function layer sequentially stacked on the rigid substrate; the rigid substrate has an opening in the bending region to expose the flexible film layer in the bending region; the display substrate further comprises a first light absorption portion in the display region and on one side of the display region close to the bending region; and the first light absorption portion is on one side of the rigid substrate facing away from the flexible film layer or on one side of the rigid substrate facing the flexible film layer.

34 . A method for preparing a display substrate, wherein the display substrate comprises a display region, a bending region and a bonding region, and the bending region is between the display region and the bonding region; and the method comprises:
forming a flexible film layer on a first surface of a rigid substrate; forming a display function layer on one side of the flexible film layer away from the rigid substrate; removing the rigid substrate in the bending region by adopting a laser lift-off process from one side of a second surface of the rigid substrate; and bending the display substrate in the bending region, such that the display function layer of in bonding region and the display function layer in the display region are on different surfaces of the display substrate; the method further comprises: forming a first light absorption portion on the first surface of the rigid substrate before forming the flexible film layer on the first surface of the rigid substrate; or, forming a first light absorption portion on the second surface of the rigid substrate before forming the flexible film layer on the first surface of the rigid substrate; or, forming a first light absorption portion on the second surface of the rigid substrate after forming the display function layer and before removing the rigid substrate of the bending region by adopting a laser lift-off process; wherein the first light absorbing portion is in the display region and on one side of the display region close to the bending region, and the first light absorption portion is configured to absorb light comprising a waveband of a laser light.

35 . The method according to claim 34 , further comprising:
forming a second light absorption portion on the first surface of the rigid substrate before forming the flexi

Assignees

• Boe Technology Group Co Ltd

Inventors

• Lu Xinhong
• Zhu Xiaoyan
• Qi Qi
• Chen Hao

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/821 Primary

  of the light-emitting regions, e.g. non-planar junctions · CPC title

• H01L33/24 Primary

  Electricity · mapped topic

• H01L25/0753

  Electricity · mapped topic