Bonding method, bonding structure, and battery

US2024088529A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024088529-A1
Application numberUS-202318244669-A
CountryUS
Kind codeA1
Filing dateSep 11, 2023
Priority dateSep 14, 2022
Publication dateMar 14, 2024
Grant date

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for bonding a current collector to an electrode body is provided. The electrode body includes electrode plate end portions arranged over each other in a thickness direction. The method includes forming a covering by integrally covering the electrode plate end portions with resin at a bonding position of the current collector, and bonding a bonding portion of the current collector, by performing solid-phase bonding, to edges of the electrode plate end portions integrated by the formed covering.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for bonding a current collector to an electrode body, the electrode body including electrode plate end portions arranged over each other in a thickness direction, the method comprising: forming a covering by integrally covering the electrode plate end portions with resin at a bonding position of the current collector; and bonding a bonding portion of the current collector, by performing solid-phase bonding, to edges of the electrode plate end portions integrated by the formed covering. 2 . The method according to claim 1 , further comprising: exposing the edges of the electrode plate end portions from the covering by partially removing the resin. 3 . The method according to claim 2 , further comprising: bending the edges of the electrode plate end portions exposed from the covering. 4 . The method according to claim 1 , wherein the solid-phase bonding is performed through complex vibration bonding or electromagnetic pressure welding. 5 . The method according to claim 1 , wherein the resin includes a photocurable resin. 6 . A bonding structure bonding a current collector to an electrode body including electrode plate end portions arranged over each other in a thickness direction, the bonding structure comprising: a resin covering integrally covering the electrode plate end portions at a bonding position of the current collector; and a bonding portion of the current collector bonded to edges of the electrode plate end portions exposed from the covering. 7 . The bonding structure according to claim 6 , wherein the edges of the electrode plate end portions are bonded to the bonding portion in a bent state. 8 . A battery, comprising: the bonding structure according to claim 6 .

Assignees

Inventors

Classifications

  • H01M50/536Primary

    characterised by the method of fixing the leads to the electrodes, e.g. by welding · CPC title

  • making use of vibrations, e.g. ultrasonic welding · CPC title

  • Energy storage using batteries · CPC title

  • characterised by the material of the leads or tabs · CPC title

  • characterised by the shape of the leads or tabs · CPC title

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Frequently asked questions

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What does patent US2024088529A1 cover?
A method for bonding a current collector to an electrode body is provided. The electrode body includes electrode plate end portions arranged over each other in a thickness direction. The method includes forming a covering by integrally covering the electrode plate end portions with resin at a bonding position of the current collector, and bonding a bonding portion of the current collector, by p…
Who is the assignee on this patent?
Primearth Ev Energy Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01M50/536. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Mar 14 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).