Method for producing substrate having pattern and resin composition for hydrofluoric acid etching
US-2015361257-A1 · Dec 17, 2015 · US
US2024085788A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024085788-A1 |
| Application number | US-202318450452-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 16, 2023 |
| Priority date | Aug 19, 2022 |
| Publication date | Mar 14, 2024 |
| Grant date | — |
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An object of the present disclosure is to improve display reliability and lifetime as well as vivid colors. When there remain residues in the washing part due to incomplete removal during the developing step, it can cause dark spots or pixel off due to the residues, and thus residue-free pixels can be formed by optimizing the temperature and time for developing. Additionally, when the amount of outgas in the panel after post-baking is 15 ppm or more, it may cause a reduction in luminance and lifetime due to pixel shrinkage. Therefore, in order to minimize the amount of outgas after completion of the post-baking process, the generation of outgas in the panel state can be minimized by generating sufficient fume in the post-baking step, in addition to forming clean pixels in the developing step.
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What is claimed is: 1 . A method for preparing a pixel defining layer comprising application and coating; pre-baking; exposure to light; developing; and post-baking of a photosensitive composition, wherein the developing step is performed at a temperature of 19° C. to 27° C. for 30 to 90 seconds; the thickness after the developing step is 1.70 μm to 1.90 μm; there is no residual film on the pixel after the developing step; and the amount of outgas generated in the panel is 110 ppm or less. 2 . The method of claim 1 , wherein the developing step is performed at a temperature range of 21° C. to 25° C. 3 . The method of claim 1 , wherein the developing step is performed at a time range of 40 to 80 seconds. 4 . The method of claim 1 , wherein the developing step is performed at a temperature of 19° C. to 27° C. for 40 to 80 seconds. 5 . The method of claim 1 , wherein the post-baking step is performed in an oven at a temperature of 210° C. to 300° C. for 30 to 120 minutes; the amount of fume generated in the post-baking step is 86 ppm or more; and the amount of outgas generated after the post-baking step is 15 ppm or less. 6 . The method of claim 5 , wherein the oven temperature in the post-baking step is 250° C. to 270° C. 7 . The method of claim 5 , wherein the post-baking step is performed for 60 to 120 minutes. 8 . The method of claim 5 , wherein the post-baking step is performed in an oven at a temperature of 250° C. to 270° C. for 60 to 120 minutes. 9 . The method of claim 1 , wherein the photosensitive composition comprises a colorant. 10 . The method of claim 9 , wherein the colorant comprises at least one among inorganic dyes, organic dyes, inorganic pigments, and organic pigments. 11 . The method of claim 9 , wherein the colorant is included in an amount of 1 wt % to 40 wt % based on the total amount of the photosensitive composition. 12 . The method of claim 9 , wherein the colorant is pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent. 13 . The method of claim 9 , wherein the average particle diameter of the colorant is 20 nm to 110 nm. 14 . The method of claim 1 , wherein the photosensitive composition comprises a patterning resin which comprises an acryl-based binder resin, a cardo-based binder resin, or a combination thereof. 15 . The method of claim 14 , wherein the weight average molecular weight of the acryl-based binder resin is 3,000 g/mol to 150,000 g/mol. 16 . The method of claim 14 , wherein the cardo-based binder resin comprises a repeat structure of Formula 1 below: wherein in Formula 1 above, 1) R 1 and R 2 are each independently hydrogen; deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 2) R 1 and R 2 are able to form a ring between neighboring groups, 3) m and n are each independently an integer of 0 to 4, 4) A 1 and A 2 are each independently Formula 2 or Formula 3 below: in Formula 2 and Formula 3 above, 4-1) * represents a binding part, 4-2) R 3 to R 6 are each independently hydrogen; deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 4-3) R 3 to R 6 are able to form a ring between neighboring groups, 4-4) Y 1 and Y 2 are each independently Formula 6 or Formula 7 below: in Formula 6 and Formula 7 above, 4-4-1) * represents a binding position, 4-4-2) R 9 is hydrogen or methyl, 4-4-3) R10 to R 13 are each independently hydrogen; deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 4-4-4) L 1 to L 3 are each independently a single bond, a fluorenylene group; C 2-30 alkylene; C 6-30 arylene; a C 2-30 heterocyclic ring; C 1-30 alkoxylene, C 2-30 alkyleneoxy; C 6-30 aryloxy; or C 2-30 polyethyleneoxy, 4-4-5) q and r are each independently an integer from 0 to 3; with the proviso that q+r=3, and 5) the ratio of A 1 and A 2 in the polymer chain of the resin including a repeating unit represented by Formula 1 above is 9:1 to 1:9, 6) X 1 is a single bond; 0; CO; SO2; CR′R″; SiR′R″; Formula 4 below; or Formula 5 below, 6-1) R′ and R″ are each independently hydrogen; deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 6-2) R′and R″ are able to form a ring between neighboring groups, in Formula 4 and Formula 5 above, 6-3) * represents a binding position, 6-4) R 7 and Rs are each independently hydrogen; deuterium; a halogen; a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 6-5) o and p are each independently an integer from 0 to 4, 7) X 2 is a C 6-30 aryl group; a C 2-30 heterocyclic group comprising at least one heteroatom among O, N, S, Si, and P; a fused ring group of a C 6-30 aliphatic ring and a C 6-30 aromatic ring; a C 1-20 alkyl group; a C 2-20 alkenyl group; a C 2-20 alkynyl group; a C 1-20 alkoxy group; a C 6-30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C 1-20 alkoxycarbonyl group, 8) the R′, R″, X 2 , L 1 to L 3 , R 1 to R 8 , and R 10 to R 13 may each be further substituted with one or more substituents selected from the group consisting of deuterium; a halogen; a silane group substituted or unsubstituted with a C 1-30 alkyl group or C 6-30 aryl group; a siloxane group; a boron group; a germanium group; a cyano group
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