Photosensitive dry film, laminated film, method for producing laminated film, and method for producing patterned resist film

Patent metadata

Field	Value
Publication number	US-2024053680-A1
Application number	US-202118258533-A
Country	US
Kind code	A1
Filing date	Nov 30, 2021
Priority date	Dec 28, 2020
Publication date	Feb 15, 2024
Grant date	—

Abstract

A photosensitive dry film including a chemically amplified positive type photosensitive composition, in which the photosensitive dry film can suppress white turbidity and separation caused by resin contained therein and can prevent bubbles generated while solvent is removed by heating from remaining. The photosensitive dry film including a chemically amplified positive type photosensitive composition includes an acid generating agent, resin having alkali solubility that increases under action of an acid, and organic solvent, the resin including an acrylic resin, the acrylic resin including a constituent unit derived from (meth)acrylate including an acid-non-dissociable alicyclic hydrocarbon group-comprising group, the organic solvent (S) including a high boiling point organic solvent that has a boiling point at atmospheric pressure of 150° C. or more, and a value of δh, a term of energy by hydrogen bonding relating to a Hansen solubility parameter, of 11 (MPa) 0.5 or less.

First claim

1 . A photosensitive dry film comprising a chemically amplified positive type photosensitive composition, comprising:
an acid generating agent (A) that generates an acid by irradiation with an actinic ray or radiation; a resin (B) having an alkali solubility that increases under action of an acid; and an organic solvent (S), the resin (B) comprising an acrylic resin (B3), the acrylic resin (B3) comprising a constituent unit (B3a) derived from a (meth)acrylate comprising an acid-non-dissociable alicyclic hydrocarbon group-comprising group, the organic solvent (S) comprising a high boiling point organic solvent (S1) that satisfies the following conditions I) and II): I) a boiling point at atmospheric pressure of 150° C. or more, and II) a value of δh, a term of energy by hydrogen bonding relating to a Hansen solubility parameter, of 11 (MPa) 0.5 or less.

2 . The photosensitive dry film according to claim 1 , wherein a ratio of a mass of the high boiling point organic solvent (S1) to a mass of the organic solvent (S) is 10% by mass or more.

3 . The photosensitive dry film according to claim 1 , wherein a ratio of a mass of the constituent unit (B3a) to a mass of the acrylic resin (B3) is 15% by mass or more and 50% by mass or less.

4 . The photosensitive dry film according to claim 1 , wherein the high boiling point organic solvent (S1) is at least one selected from the group consisting of anisole, methyl 3-ethoxypropionate, 3-methoxybutyl acetate, cyclohexanol acetate, dipropylene glycol dimethyl ether, 3-methoxy-3-methyl-1-butyl acetate, propylene glycol diacetate, gamma butyrolactone, dipropylene glycol methyl ether acetate, and propylene glycol monobutyl ether.

5 . The photosensitive dry film according to claim 1 , wherein the film has a thickness of 40 μm or more and 200 μm or less.

6 . A laminated film comprising a base film and the photosensitive dry film according to claim 1 , wherein the photosensitive dry film is laminated on the base film.

7 . A method of producing the laminated film according to claim 6 , the method comprising:
coating a base film with the chemically amplified positive type photosensitive composition to form a coating film; and drying the coating film by heating to remove some of the organic solvent (S) to form the photosensitive dry film.

8 . The method of producing a laminated film according to claim 7 , wherein the coating film is heated at a temperature in the range of 50° C. or more and 100° C. or less.

9 . A method of producing a patterned resist film, comprising:
laminating the laminated film according to claim 6 on a substrate so that the photosensitive dry film is in contact with a surface of the substrate; removing the base film from the laminated film; removing the organic solvent (S) by heating the photosensitive dry film at 100° C. or more and 180° C. or less; exposing the photosensitive dry film by irradiating the photosensitive dry film with an actinic ray or radiation in a position-selective manner after removing the solvent; and developing the photosensitive dry film after exposing the photosensitive dry film.

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Momozawa Aya
• Yamamoto Yuta

Classifications

• G03F7/0392 Primary

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/0048 Primary

  characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents · CPC title

• G03F7/168

  Finishing the coated layer, e.g. drying, baking, soaking · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title