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Tungsten wire, and tungsten wire processing method and electrolytic wire using the same
US2024052461A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024052461-A1 |
| Application number | US-202318492929-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 24, 2023 |
| Priority date | Apr 27, 2021 |
| Publication date | Feb 15, 2024 |
| Grant date | — |
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Abstract
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According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. The tungsten wire includes a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter.
First claim
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What is claimed is: 1 . A tungsten wire comprising a tungsten alloy containing rhenium, and the tungsten wire comprising a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter. 2 . The tungsten wire according to claim 1 , wherein the Spd is 8000 or more and 9000 or less. 3 . The tungsten wire according to claim 1 , comprising a developed interfacial area ratio (Sdr) of 0.16 or less as a surface roughness parameter. 4 . The tungsten wire according to claim 2 , comprising a developed interfacial area ratio (Sdr) of 0.16 or less as a surface roughness parameter. 5 . The tungsten wire according to claim 1 , comprising an arithmetic mean curvature (Spc) of peak points of 300 or more and 500 or less as a surface roughness parameter. 6 . The tungsten wire according to claim 2 , comprising an arithmetic mean curvature (Spc) of peak points of 300 or more and 500 or less as a surface roughness parameter. 7 . The tungsten wire according to claim 1 , comprising a root mean square slope (Sdq) of 0.60 or less as a surface roughness parameter. 8 . The tungsten wire according to claim 2 , comprising a root mean square slope (Sdq) of 0.60 or less as a surface roughness parameter. 9 . The tungsten wire according to claim 1 , wherein the rhenium is contained in an amount of 1 wt % or more and less than 30 wt %. 10 . The tungsten wire according to claim 1 , wherein the rhenium is contained in an amount of 2 wt % or more and 28 wt % or less. 11 . The tungsten wire according to claim 1 , wherein the tungsten alloy contains potassium (K) in an amount of 30 wtppm or more and 90 wtppm or less. 12 . The tungsten wire according to claim 1 , having a diameter of 0.3 mm or more and 1.0 mm or less. 13 . A tungsten wire processing method comprising drawing the tungsten wire according to claim 1 . 14 . An electrolytic wire obtained using the tungsten wire drawn by the tungsten wire processing method according to claim 13 . 15 . The tungsten wire according to claim 1 for wire drawing.
Assignees
Inventors
Classifications
Material aspects · CPC title
- C22C27/04Primary
Alloys based on tungsten or molybdenum · CPC title
Manufacture of metal sheets, wire, rods, tubes or like semi-manufactured products by drawing · CPC title
- B22F5/12Primary
of wires {(of tubes B22F5/10)} · CPC title
Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte · CPC title
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Frequently asked questions
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- What does patent US2024052461A1 cover?
- According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. The tungsten wire includes a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter.
- Who is the assignee on this patent?
- Toshiba Kk, Toshiba Materials Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C22C27/04. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Feb 15 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).