Optical module and method of manufacturing optical module

US2024045166A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2024045166-A1
Application numberUS-202318221178-A
CountryUS
Kind codeA1
Filing dateJul 12, 2023
Priority dateAug 4, 2022
Publication dateFeb 8, 2024
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An optical module includes an optical component, a substrate including a main surface, a mount portion provided on the main surface of the substrate, and at least one measurement reference portion provided on the main surface of the substrate at a position apart from the mount portion. The substrate mounts the optical component thereon. The mount portion is configured to mount the optical component thereon. The measurement reference portion includes a reference point that becomes a height reference when measuring a mount height of the optical component.

First claim

Opening claim text (preview).

What is clamed is: 1 . An optical module comprising: an optical component; a substrate including a main surface, the substrate mounting the optical component thereon; a mount portion provided on the main surface of the substrate, the mount portion being configured to mount the optical component thereon; and at least one measurement reference portion provided on the main surface of the substrate at a position apart from the mount portion, the measurement reference portion including a reference point that becomes a height reference when measuring a mount height of the optical component. 2 . The optical module according to claim 1 , wherein the mount portion includes a mount surface that mounts the optical component thereon, and the measurement reference portion includes a reference surface including the reference point, and wherein the mount surface and the reference surface have a predetermined positional relationship in a thickness direction of the substrate. 3 . The optical module according to claim 2 , wherein the mount surface and the reference surface have a positional relationship in which the mount surface and the reference surface have a same height in the thickness direction of the substrate. 4 . The optical module according to claim 2 , wherein the mount portion includes a first metal foil layer formed on the main surface of the substrate, and a first metal plating layer formed on the first metal foil layer, wherein the measurement reference portion includes a second. metal foil layer formed on the main surface of the substrate, and a second metal plating layer formed on the second metal foil layer, wherein a surface of the first metal plating layer includes the mount surface, and a surface of the second metal plating layer includes the reference surface. 5 . The optical module according to claim 1 , wherein the measurement reference portion includes a surface made by a metal. 6 . The optical module according to claim 1 , wherein the at least one measurement reference portion includes a plurality of measurement reference portions, and wherein the plurality of measurement reference portions are disposed on the main surface of the substrate so as to surround the mount portion. 7 . The optical module according to claim 1 , wherein the at least one measurement reference portion includes a plurality of measurement reference portions, and wherein the plurality of measurement reference portions are not overlapped with the optical component. 8 . The optical module according to claim 1 , wherein the at least one measurement reference portion includes a plurality of measurement reference portions, and wherein the plurality of measurement reference portions are located adjacent to respective corners of the mount portion. 9 . The optical module according to claim 1 , further comprising: a solder resist layer formed on the main surface of the substrate so as to fill a space between the mount portion and the measurement reference portion, wherein a groove separating the mount portion and the measurement reference portion is formed in the solder resist layer. 10 . The optical module according to claim 9 , wherein the measurement reference portion has a circular shape when the measurement reference portion is viewed from a direction perpendicular to the main surface of the substrate, and the groove is formed so as to surround the measurement reference portion. 11 . The optical module according to claim 9 , wherein the groove has a linear shape. 12 . The optical module according to claim 9 , wherein the groove is formed so as to surround the mount portion. 13 . The optical module according to claim 1 further comprising: a solder resist layer formed on the main surface of the substrate, wherein the at least one measurement reference portion includes a plurality of measurement reference portions, and wherein a plurality of grooves respectively separating the mount portion and the plurality of measurement reference portions are formed in the solder resist layer. 14 . The optical module according to claim 1 , wherein the optical component includes a plurality of light incoming/outgoing portions each having an optical axis extending in a first direction on a plane parallel to the main surface, and the plurality of light incoming/outgoing portions are arranged along a second direction intersecting the first direction on the plane parallel to the main surface. 15 . A method of manufacturing an optical module, the method comprising: preparing an optical component and a substrate; forming a mount portion to mount the optical component thereon, on a main surface of the substrate; forming at least one measurement reference portion on the main surface of the substrate at a position apart from the mount portion, the at least one measurement reference portion including a reference point that becomes a height reference when measuring a mount height of the optical component; and mounting the optical component on the mount portion and adjusting a height of the optical component with a height of the measurement reference portion being the height reference. 16 . The method of manufacturing an optical module according to claim 15 , wherein, in the forming of the mount portion, a first metal foil layer is formed on the main surface of the substrate and a first metal plating layer is formed on the first metal foil layer, wherein, in the forming of the measurement reference portion, a second metal foil layer is formed on the main surface of the substrate and a second metal plating layer is formed on the second metal foil layer, wherein the first metal layer and the second metal foil layer are formed in a same process, and the first metal plating layer and the second metal plating layer are formed in a same process.

Assignees

Inventors

Classifications

  • one layer being formed of a noble metal or a noble metal alloy · CPC title

  • on metal layer · CPC title

  • Metallic coating · CPC title

  • of metal (B32B15/01 takes precedence) · CPC title

  • G02B7/003Primary

    Alignment of optical elements (G02B7/001, G02B7/002 take precedence; for mirrors G02B7/1822) · CPC title

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What does patent US2024045166A1 cover?
An optical module includes an optical component, a substrate including a main surface, a mount portion provided on the main surface of the substrate, and at least one measurement reference portion provided on the main surface of the substrate at a position apart from the mount portion. The substrate mounts the optical component thereon. The mount portion is configured to mount the optical compo…
Who is the assignee on this patent?
Sumitomo Electric Industries
What technology area does this patent fall under?
Primary CPC classification G02B7/003. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Feb 08 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).