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US-2022050318-A1 · Feb 17, 2022 · US
Manufacturing method of an electronic device
US2024004244A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024004244-A1 |
| Application number | US-202318468751-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 18, 2023 |
| Priority date | Dec 22, 2020 |
| Publication date | Jan 4, 2024 |
| Grant date | — |
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- Title
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Abstract
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A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.
First claim
Opening claim text (preview).
What is claimed is: 1 . A manufacturing method of an electronic device, comprising: providing a substrate; providing an adjustable element, comprising a liquid crystal layer; and bonding the adjustable element onto the substrate. 2 . The manufacturing method of the electronic device according to claim 1 , wherein a manufacturing method of the adjustable element comprises: providing a first substrate; providing a second substrate; providing the liquid crystal layer; and sealing the liquid crystal layer between the first substrate and the second substrate. 3 . The manufacturing method of the electronic device according to claim 2 , wherein the manufacturing method of the adjustable element further comprises: forming a first pad on a sidewall of at least one of the first substrate and the second substrate. 4 . The manufacturing method of the electronic device according to claim 3 , further comprising disposing a second pad on the substrate, wherein the first pad is bonded onto the second pad. 5 . The manufacturing method of the electronic device according to claim 3 , wherein the manufacturing method of the adjustable element further comprises: before providing the liquid crystal layer, sequentially providing a first conductive layer and a first alignment layer on the first substrate; and before providing the liquid crystal layer, sequentially providing a second conductive layer and a second alignment layer on the second substrate. 6 . The manufacturing method of the electronic device according to claim 5 , wherein the manufacturing method of the adjustable element further comprises: before providing the liquid crystal layer, providing a sealing member on a surface of the second alignment layer away from the second substrate. 7 . The manufacturing method of the electronic device according to claim 3 , wherein the manufacturing method of the adjustable element further comprises: disposing a protective layer on another sidewall of the at least one of the first substrate and the second substrate. 8 . The manufacturing method of the electronic device according to claim 2 , wherein the manufacturing method of the adjustable element further comprises: providing an insulating layer on a side of the first substrate away from the second substrate; and providing another insulating layer on a side of the second substrate away from the first substrate. 9 . The manufacturing method of the electronic device according to claim 1 , wherein the adjustable element is used as a variable capacitor. 10 . The manufacturing method of the electronic device according to claim 1 , further comprising: after bonding the adjustable element onto the substrate, encapsulating the adjustable element with a protective layer.
Assignees
Inventors
Classifications
- G02F1/13458Primary
Terminal pads · CPC title
Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers · CPC title
Gaskets; Spacers; Sealing of cells · CPC title
- G02F1/133351Primary
Manufacturing of individual cells out of a plurality of cells, e.g. by dicing · CPC title
specially adapted for a particular application · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2024004244A1 cover?
- A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.
- Who is the assignee on this patent?
- Innolux Corp
- What technology area does this patent fall under?
- Primary CPC classification G02F1/13458. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Jan 04 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).