Antenna assemblies with printed circuit parasitic antenna elements

US2023411829A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023411829-A1
Application numberUS-202217807777-A
CountryUS
Kind codeA1
Filing dateJun 20, 2022
Priority dateJun 20, 2022
Publication dateDec 21, 2023
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In some examples, an antenna assembly includes a driven antenna element to communicate a signal over an antenna feed line, and a printed circuit including an electrically conductive pattern that is placed adjacent the driven antenna element. The printed circuit including the electrically conductive pattern provides a parasitic antenna element for the driven antenna element.

First claim

Opening claim text (preview).

What is claimed is: 1 . An antenna assembly comprising: a driven antenna element to communicate a signal over an antenna feed line; and a printed circuit comprising an electrically conductive pattern that is placed adjacent the driven antenna element, the printed circuit comprising the electrically conductive pattern providing a parasitic antenna element for the driven antenna element. 2 . The antenna assembly of claim 1 , further comprising: an electrically conductive portion of a housing of an electronic device, the electrically conductive portion of the housing providing a further parasitic element for the driven antenna element. 3 . The antenna assembly of claim 2 , further comprising a non-conductive slot adjacent the electrically conductive portion of the housing. 4 . The antenna assembly of claim 3 , wherein the non-conductive slot contains a layer of a non-conductive material inserted into the housing. 5 . The antenna assembly of claim 4 , wherein the non-conductive material is insert molded into an opening in the housing to form the non-conductive slot. 6 . The antenna assembly of claim 4 , wherein the non-conductive material comprises plastic. 7 . The antenna assembly of claim 1 , wherein the printed circuit comprises a flexible printed circuit. 8 . The antenna assembly of claim 1 , wherein the printed circuit comprises a circuit board. 9 . The antenna assembly of claim 1 , wherein the electrically conductive pattern on the printed circuit comprises a metal trace with a plurality of turns. 10 . The antenna assembly of claim 9 , wherein the printed circuit with the electrically conductive pattern is to attach to an inner surface of a housing of an electronic device. 11 . The antenna assembly of claim 10 , further comprising a dielectric adhesive layer to attach the printed circuit with the electrically conductive pattern to the inner surface of the housing. 12 . An electronic device comprising: a housing defining an inner space; a signal transceiver in the inner space; and an antenna assembly in the inner space, the antenna assembly comprising: a driven antenna element electrically connected to the signal transceiver, and a printed circuit comprising an electrically conductive pattern that is placed adjacent the driven antenna element, the printed circuit comprising the electrically conductive pattern providing a parasitic antenna element for the driven antenna element. 13 . The electronic device of claim 12 , wherein the housing comprises an electrically conductive portion next to the antenna assembly, the electrically conductive portion of the housing providing a further parasitic antenna element for the driven antenna element. 14 . The electronic device of claim 13 , wherein the electrically conductive portion of the housing that provides the further parasitic antenna element is defined by a slot inserted with a non-conductive material in the housing, and wherein the slot comprises a turn. 15 . A method of forming an antenna assembly in an electronic device, comprising: arranging, in an inner space of the electronic device, a driven antenna element to communicate a signal over an antenna feed line; and placing a printed circuit comprising an electrically conductive pattern adjacent the driven antenna element, the printed circuit comprising the electrically conductive pattern providing a parasitic antenna element for the driven antenna element.

Assignees

Inventors

Classifications

  • H01Q1/24Primary

    with receiving set · CPC title

  • formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

  • H01Q5/378Primary

    Combination of fed elements with parasitic elements · CPC title

  • with built-in antennas · CPC title

  • Resonant slot antennas · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2023411829A1 cover?
In some examples, an antenna assembly includes a driven antenna element to communicate a signal over an antenna feed line, and a printed circuit including an electrically conductive pattern that is placed adjacent the driven antenna element. The printed circuit including the electrically conductive pattern provides a parasitic antenna element for the driven antenna element.
Who is the assignee on this patent?
Hewlett Packard Development Co
What technology area does this patent fall under?
Primary CPC classification H01Q1/24. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Dec 21 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).