Fluid-cooled electrical component

Patent metadata

Field	Value
Publication number	US-2023403817-A1
Application number	US-202217746759-A
Country	US
Kind code	A1
Filing date	May 17, 2022
Priority date	May 17, 2022
Publication date	Dec 14, 2023
Grant date	—

Abstract

A fluid-cooled electrical component includes a housing having a bottom wall, an outer wall extending from a first surface of the bottom wall, an inner wall extending from the first surface of the bottom wall, the outer and inner walls forming a first cavity therebetween, and the inner wall forming a second cavity therewithin, and one or more fluid channels formed in the inner wall of the housing, adapted and configured to pass a cooling fluid therethrough. The fluid-cooled electrical component also includes a first electrical component disposed in the first cavity, and a second electrical component disposed in the second cavity, both the first and second electrical components being adapted and configured to expel heat through the housing, into the cooling fluid.

First claim

What is claimed is:

1 . A fluid-cooled electrical component comprising:
a housing having:
a bottom wall;
an outer wall extending from a first surface of the bottom wall;
an inner wall extending from the first surface of the bottom wall, the outer and inner walls forming a first cavity therebetween, and the inner wall forming a second cavity therewithin; and
one or more fluid channels formed in the inner wall of the housing, adapted and configured to pass a cooling fluid therethrough;
a first electrical component disposed in the first cavity; and a second electrical component disposed in the second cavity, both the first and second electrical components adapted and configured to expel heat through the housing, into the cooling fluid.

2 . The fluid-cooled electrical component of claim 1 , wherein the one or more fluid channels extend through the bottom wall and into the inner wall.

3 . The fluid-cooled electrical component of claim 1 , further comprising a transfer plate in thermal and fluid communication with a second surface of the bottom wall of the housing, adapted and configured to provide cooling fluid to the housing and remove heat from the housing.

4 . The fluid-cooled electrical component of claim 1 , wherein the first electrical component is an inductor.

5 . The fluid-cooled electrical component of claim 4 , wherein the inductor is substantially toroidal in shape.

6 . The fluid-cooled electrical component of claim 1 , wherein the second electrical component is a capacitor.

7 . The fluid-cooled electrical component of claim 6 , wherein the capacitor is a film wound capacitor.

8 . The fluid-cooled electrical component of claim 1 , wherein the inner wall is substantially annular.

9 . The fluid-cooled electrical component of claim 1 , wherein the fluid channels formed in the inner wall are disposed between the first cavity and the second cavity.

10 . The fluid-cooled electrical component of claim 1 , wherein the first cavity is substantially annular in shape.

11 . The fluid-cooled electrical component of claim 1 , wherein the second cavity is substantially cylindrical.

12 . A fluid-cooled housing for electrical components having:
a bottom wall; an outer wall extending from a first surface of the bottom wall; an inner wall extending from the first surface of bottom wall, the outer and inner walls forming a first cavity therebetween adapted and configured to receive a first electrical component, and the inner wall forming a second cavity therewithin adapted and configured to receive a second electrical component; and one or more fluid channels formed in the housing, extending through the inner wall, adapted and configured to pass a cooling fluid therethrough.

13 . The fluid-cooled housing of claim 12 , wherein the one or more fluid channels extend through the bottom wall and into the inner wall.

14 . The fluid-cooled housing of claim 12 , further comprising a transfer plate in thermal and fluid communication with a second surface of the bottom wall of the housing, adapted and configured to provide cooling fluid to the housing and remove heat from the housing.

15 . A method of cooling electrical components, comprising:
providing a housing having:
a bottom wall;
an outer wall extending from a first surface of the bottom wall;
an inner wall extending from the first surface of the bottom wall, the outer and inner walls forming a first cavity therebetween, and the inner wall forming a second cavity therewithin; and
one or more fluid channels formed in the housing, extending through the bottom wall and into the inner wall, adapted and configured to pass a cooling fluid therethrough;
providing a first electrical component disposed in the first cavity; and providing a second electrical component disposed in the second cavity, both the first and second electrical components adapted and configured to expel heat through the housing, into the cooling fluid; providing a coolant supply for providing coolant; and passing cooling fluid through the one or more fluid channels, transferring heat from the first and second electrical components to the cooling fluid.

Assignees

• Hamilton Sundstrand Corp

Inventors

• Shepard Charles

Classifications

• H05K7/20263 Primary

  Heat dissipaters releasing heat from coolant · CPC title

• H01G4/32

  Wound capacitors · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H01F27/10

  Liquid cooling · CPC title

• H01G4/33

  Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title