Cutting tool

US2023398607A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023398607-A1
Application numberUS-202118033564-A
CountryUS
Kind codeA1
Filing dateFeb 17, 2021
Priority dateFeb 17, 2021
Publication dateDec 14, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cutting tool includes a substrate and a hard layer, wherein the hard layer includes a first unit layer and a second unit layer being alternately layered in the hard layer, a thickness of the first unit layer is 2 to 100 nm, a thickness of the second unit layer is 2 to 100 nm, the first unit layer is composed of Ti a Al b B c N, the second unit layer is composed Ti d Al e B f N, an atomic ratio a satisfy 0.25≤a<0.45, an atomic ratio b satisfy 0.55≤b<0.75, an atomic ratio c satisfy 0<c≤0.1, a total of the atomic ratios a, b and c is 1, an atomic ratio d satisfy 0.35≤d<0.55, an atomic ratio e satisfy 0.45≤e<0.65, an atomic ratio f satisfy 0<f≤0.1, a total of the atomic ratios d, e and f is 1, the atomic ratios a and d satisfy 0.05≤d−a≤0.2, and the atomic ratios b and e satisfy 0.05≤b−e≤0.2.

First claim

Opening claim text (preview).

1 . A cutting tool comprising a substrate and a hard layer provided on the substrate, wherein the hard layer includes a first unit layer and a second unit layer, one or a plurality of the first unit layers and one or a plurality of the second unit layers are alternately layered in the hard layer, a thickness of each of the one or plurality of first unit layers is 2 nm or more and 100 nm or less, a thickness of each of the one or plurality of second unit layers is 2 nm or more and 100 nm or less, the first unit layer is composed of a compound represented by Ti a Al b B c N, the second unit layer is composed of a compound represented by Ti a Al e B f N, an atomic ratio a of a titanium element in the Ti a Al b B c N is 0.25 or more and less than 0.45, an atomic ratio b of an aluminum element in the Ti a Al b B c N is 0.55 or more and less than 0.75, an atomic ratio c of a boron element in the Ti a Al b B c N is more than 0 and 0.1 or less, a total of the atomic ratio a, the atomic ratio b, and the atomic ratio c is 1, an atomic ratio d of a titanium element in the Ti a Al e B f N is 0.35 or more and less than 0.55, an atomic ratio e of an aluminum element in the Ti a Al e B f N is 0.45 or more and less than 0.65, an atomic ratio f of a boron element in the Ti a Al e B f N is more than 0 and 0.1 or less, a total of the atomic ratio d, the atomic ratio e, and the atomic ratio f is 1, the atomic ratio a and the atomic ratio d satisfy 0.05≤d−a≤0.2, and the atomic ratio b and the atomic ratio e satisfy 0.05≤b−e≤0.2. 2 . The cutting tool according to claim 1 , wherein a ratio I (200) /I (002) of an intensity I (200) of an X-ray diffraction peak of a (200) plane to an intensity I (200) of an X-ray diffraction peak of a (002) plane in the hard layer is 2 or more, and a half-value width of the X-ray diffraction peak of the (002) plane is 2° or more. 3 . The cutting tool according to claim 1 , wherein a hardness H of the hard layer at a room temperature is 30 GPa or more. 4 . The cutting tool according to claim 3 , wherein a ratio H/E of the hardness H of the hard layer to a Young's modulus E of the hard layer at the room temperature is 0.07 or more. 5 . The cutting tool according to claim 1 , wherein a thickness of the hard layer is 1 μm or more and 20 μm or less. 6 . The cutting tool according to claim 2 , wherein the upper limit of ratio I (200) /I (002) is 10 or less, and the upper limit of the half-value width of the X-ray diffraction peak of the (002) plane is 4° or less. 7 . The cutting tool according to claim 4 , wherein a hardness H of the hard layer at a room temperature is 30 GPa or more and 50 GPa or less. 8 . The cutting tool according to claim 1 , wherein a Young's modulus E of the hard layer at a room temperature is 400 GPa or more and 700 GPa or less. 9 . The cutting tool according to claim 4 , wherein a ratio H/E of the hardness H of the hard layer to a Young's modulus E of the hard layer at the room temperature is 0.07 or more and 0.12 or less. 10 . The cutting tool according to claim 1 , wherein the atomic ratio a of a titanium element in the Ti a Al b B c N is 0.25 or more and 0.40 or less. 11 . The cutting tool according to claim 1 , wherein the atomic ratio b of an aluminum element in the Ti a Al b B c N is 0.60 or more and less than 0.75. 12 . The cutting tool according to claim 1 , wherein the atomic ratio c of a boron element in the Ti a Al b B c N is 0.01 or more and 0.09 or less. 13 . The cutting tool according to claim 1 , wherein the atomic ratio d of a titanium element in the Ti a Al e B f N is 0.35 or more and 0.50 or less. 14 . The cutting tool according to claim 1 , wherein the atomic ratio e of an aluminum element in the Ti a Al e B f N is 0.50 or more and less than 0.65. 15 . The cutting tool according to claim 1 , wherein the atomic ratio f of a boron element in the Ti a Al e B f N is 0.01 or more and 0.09 or less.

Assignees

Inventors

Classifications

  • Multiple coatings, comprising a coating layer of the same material as a previous coating layer · CPC title

  • Titanium nitride · CPC title

  • Aluminium nitride · CPC title

  • Titanium carbide nitride (TiCN) · CPC title

  • C23C30/005Primary

    on hard metal substrates · CPC title

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What does patent US2023398607A1 cover?
A cutting tool includes a substrate and a hard layer, wherein the hard layer includes a first unit layer and a second unit layer being alternately layered in the hard layer, a thickness of the first unit layer is 2 to 100 nm, a thickness of the second unit layer is 2 to 100 nm, the first unit layer is composed of Ti a Al b B c N, the second unit layer is composed Ti d Al e B f …
Who is the assignee on this patent?
Sumitomo Electric Hardmetal Corp
What technology area does this patent fall under?
Primary CPC classification C23C30/005. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Dec 14 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).