Sound Damping Gypsum Board and Method of Constructing a Sound Damping Gypsum Board

US2023391064A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023391064-A1
Application numberUS-202318452645-A
CountryUS
Kind codeA1
Filing dateAug 21, 2023
Priority dateJun 5, 2020
Publication dateDec 7, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is directed to an improved gypsum board, such as an improved sound damping gypsum board, and a method of making such gypsum board. For instance, the method comprises: providing a first encasing layer and a first sound damping layer on the first encasing layer wherein the sound damping layer includes at least 50 wt. % of a first sound damping polymer; depositing a gypsum slurry comprising stucco and water on the sound damping layer to form a gypsum core; providing a second encasing layer on the gypsum slurry; and allowing the stucco to convert to calcium sulfate dihydrate.

First claim

Opening claim text (preview).

1 - 21 . (canceled) 22 . A method of forming a gypsum board, the method comprising: providing a first encasing layer, depositing a gypsum slurry comprising stucco and water on the first encasing layer to form a gypsum core, providing a second encasing layer having a first sound damping layer thereon on the gypsum slurry, wherein the first sound damping layer is between the gypsum slurry and the second encasing layer and wherein the first sound damping layer includes at least 50 wt. % of a first sound damping polymer, and allowing the stucco to convert to calcium sulfate dihydrate. 23 . The method of claim 22 , further comprising providing a second sound damping layer on the first encasing layer wherein the second sound damping layer includes a second sound damping polymer. 24 . The method of claim 23 , wherein the second sound damping layer is directly between and contacts the first encasing layer and the gypsum slurry. 25 . The method of claim 22 , wherein the first sound damping layer is directly between and contacts the second encasing layer and the gypsum slurry. 26 . The method of claim 22 , wherein the gypsum slurry comprises a first gypsum slurry for providing a first gypsum layer of the gypsum core and a second gypsum layer for providing a second gypsum layer of the gypsum core, wherein the first gypsum layer has a density greater than the second gypsum layer. 27 . The method of claim 22 , wherein the first sound damping polymer comprises a viscoelastic polymer. 28 . The method of claim 22 , wherein the first sound damping layer includes rubber, cork, or a mixture thereof. 29 . The method of claim 22 , wherein the first sound damping layer includes a cellulosic material, glycerin, or a mixture thereof. 30 . The method of claim 22 , wherein the first sound damping layer includes an additive also included in the gypsum slurry. 31 . The method of claim 22 , wherein the first sound damping polymer comprises an acrylic polymer or copolymer. 32 . The method of claim 22 , wherein the first sound damping layer includes at least 90 wt. % of the first sound damping polymer. 33 . The method of claim 22 , wherein the first sound damping polymer is present in an amount of from 0.001 lbs/MSF to 150 lbs/MSF based on the weight of the gypsum board. 34 . The method of claim 22 , wherein the gypsum slurry further includes a third sound damping polymer. 35 . The method of claim 22 , wherein the first sound damping layer comprises gypsum. 36 . The method of claim 22 , wherein the first sound damping layer comprises a pigment. 37 . The method of claim 22 , wherein the first sound damping layer comprises calcium carbonate, magnesium carbonate, or a mixture thereof. 38 . The method of claim 22 , wherein the first sound damping layer comprises an inorganic particle. 39 . The method of claim 22 , wherein the gypsum board exhibits a sound transmission loss of 20% or more in comparison to a board without the first sound damping layer. 40 . The method of claim 22 , wherein the first sound damping polymer is provided in a formulation having a viscosity of from 500 cps to 15000 cps. 41 . A gypsum board formed from the method of claim 22 .

Assignees

Inventors

Classifications

  • B32B37/15Primary

    with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00) · CPC title

  • G10K11/168Primary

    Plural layers of different materials, e.g. sandwiches · CPC title

  • Buildings or parts thereof · CPC title

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What does patent US2023391064A1 cover?
The present invention is directed to an improved gypsum board, such as an improved sound damping gypsum board, and a method of making such gypsum board. For instance, the method comprises: providing a first encasing layer and a first sound damping layer on the first encasing layer wherein the sound damping layer includes at least 50 wt. % of a first sound damping polymer; depositing a gypsum sl…
Who is the assignee on this patent?
Gold Bond Building Products Llc
What technology area does this patent fall under?
Primary CPC classification B32B37/15. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Dec 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).