Method for manufacturing semiconductor structure and semiconductor structure thereof
US-2024381776-A1 · Nov 14, 2024 · US
US2023371390A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023371390-A1 |
| Application number | US-202118029281-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 18, 2021 |
| Priority date | Sep 30, 2020 |
| Publication date | Nov 16, 2023 |
| Grant date | — |
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A piezoelectric actuator includes a piezoelectric element layered in a pillar shape, and electrode plates located on side surfaces of the piezoelectric element and electrically connected to internal electrode layers of the piezoelectric element. Each of the electrode plates includes a body portion extending in a layering direction of the piezoelectric element and a lead portion that extends in a direction intersecting the layering direction and is electrically connected to a lead terminal. The lead portion includes, in at least one side portion, a recessed portion recessed in a width direction of the lead portion.
Opening claim text (preview).
1 . A piezoelectric actuator comprising: a piezoelectric element layered in a pillar shape, the piezoelectric element including an internal electrode layer; and an electrode plate located on a side surface of the piezoelectric element and being electrically connected to the internal electrode layer of the piezoelectric element, the electrode plate comprising: a body portion extending in a layering direction of the piezoelectric element; and a lead portion extending in a direction intersecting the layering direction and being electrically connected to a lead terminal, the lead portion comprising, in at least one side portion thereof, a recessed portion recessed in a width direction of the lead portion. 2 . The piezoelectric actuator according to claim 1 , wherein the recessed portion is disposed closer to a base end portion of the lead portion than to a distal end portion of the lead portion. 3 . The piezoelectric actuator according to claim 1 , wherein the lead portion comprises the recessed portion in a pair of side portions. 4 . The piezoelectric actuator according to claim 3 , wherein the recessed portions located in the pair of side portions of the lead portion are located facing each other. 5 . The piezoelectric actuator according to claim 3 , wherein the recessed portion comprises a recessed portion located in a side portion of the piezoelectric element on a base end portion side and a recessed portion located in a side portion of the piezoelectric element on a distal end portion side, and the recessed portion on the base end portion side is deeper than the recessed portion on the distal end portion side. 6 . The piezoelectric actuator according to claim 1 , wherein the recessed portion is substantially V-shaped. 7 . The piezoelectric actuator according to claim 1 , wherein a bottom portion of the recessed portion has a round shape. 8 . The piezoelectric actuator according to claim 1 , wherein the lead portion comprises, in the at least one side portion thereof, a plurality of recessed portions, and the at least one side portion comprises a site where a plating film is not formed in a region between adjacent recessed portions of the plurality of recessed portions. 9 . The piezoelectric actuator according to claim 1 , wherein the lead portion comprises a plurality of bent portions and a hole portion through which the lead terminal is inserted, and among the plurality of bent portions, a bent portion located around the hole portion comprises a through hole.
adapted for alleviating internal stress, e.g. cracking control layers · CPC title
Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes · CPC title
Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices · CPC title
Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins · CPC title
using only longitudinal or thickness displacement, e.g. d33 or d31 type devices · CPC title
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