Electronic device comprising shielding member comprising recess for containing adhesive material
US-2024414255-A1 · Dec 12, 2024 · US
Electroconductive adhesive
US2023365842A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023365842-A1 |
| Application number | US-202118043226-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 26, 2021 |
| Priority date | Aug 31, 2020 |
| Publication date | Nov 16, 2023 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Provided is an electroconductive adhesive with which, when made into an electroconductive adhesive and sintered suitably at low temperature even without pressurization during sintering of the electroconductive adhesive, a sintered body having high denseness and mechanical strength (shear strength) is formed. An electroconductive adhesive containing silver particles A having an average particle size of less than 40 nm, silver particles B having an average particle size in the range of 40 nm to less than 500 nm, silver particles C having an average particle size in the range of 0.5 to less than 5.5 μm, and a solvent, wherein the mass ratio of silver particles A:silver particles B:silver particles C is 1-20:30-60:40-70.
First claim
Opening claim text (preview).
1 . An electroconductive adhesive comprising: silver particles A having an average particle size of less than 40 nm; silver particles B having an average particle size in a range of 40 nm or more to less than 500 nm; silver particles C having an average particle size in a range of 0.5 μm or more to less than 5.5 μm; and a solvent, wherein a mass ratio of the silver particles A:the silver particles B:the silver particles C is 1 to 20:30 to 60:40 to 70. 2 . The electroconductive adhesive according to claim 1 , wherein an amine compound is attached to surfaces of the silver particles A and/or the silver particles B. 3 . A sintered body of the electroconductive adhesive according to claim 1 . 4 . An electronic component formed by joining members by the sintered body according to claim 3 . 5 . A method for producing a sintered body, the method comprising a step of sintering the electroconductive adhesive according to claim 1 at a temperature of 200° C. or higher and 250° C. or lower. 6 . A method for manufacturing an electronic component formed by joining members by a sintered body, the method comprising: a step of disposing the electroconductive adhesive according to claim 1 between the members; and a step of sintering the electroconductive adhesive at a temperature of 200° C. or higher and 250° C. or lower.
Assignees
Inventors
Classifications
Die-attach connectors · CPC title
comprising metals or metalloids, e.g. solders · CPC title
Materials of die-attach connectors · CPC title
Die-attach connectors having a filler embedded in a matrix · CPC title
mainly consisting of metals or alloys · CPC title
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- What does patent US2023365842A1 cover?
- Provided is an electroconductive adhesive with which, when made into an electroconductive adhesive and sintered suitably at low temperature even without pressurization during sintering of the electroconductive adhesive, a sintered body having high denseness and mechanical strength (shear strength) is formed. An electroconductive adhesive containing silver particles A having an average particle …
- Who is the assignee on this patent?
- Osaka Soda Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C09J9/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Nov 16 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).