Sensor and sensor manufacturing method

US2023349777A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023349777-A1
Application numberUS-202318137889-A
CountryUS
Kind codeA1
Filing dateApr 21, 2023
Priority dateApr 28, 2022
Publication dateNov 2, 2023
Grant date

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A sensor includes: a sensor section including a conductive structure made up of a three-dimensionally continuous unit lattices, each including a plurality of columnar beams; and output connectors that output a resistance value of the sensor section, the resistance value changing at least when the conductive structure is compressed by an external force. A method for manufacturing a sensor includes forming the sensor section by stacking using a 3D printer. The sensor and method for manufacturing the sensor enable the adjustment of the repulsive force against compression to an input member and thus appropriately setting the change in resistance value against external force according to the device, in which the sensor is to be incorporated and the mode of use.

First claim

Opening claim text (preview).

What is claimed is: 1 . A sensor comprising: a sensor section including a conductive structure made up of a three-dimensionally continuous unit lattices, each including a plurality of columnar beams; and output connectors that output a resistance value of the sensor section, the resistance value changing at least when the conductive structure is compressed by an external force. 2 . The sensor according to claim 1 , wherein the conductive structure is adjacent to a non-conductive structure, in which the unit lattices are three-dimensionally continuous. 3 . The sensor according to claim 2 , wherein the non-conductive structure intervenes between two of the output connectors from an edge of the conductive structure toward interior so that a distance of a conductive path between the two output connectors is longer than a distance of a conductive path without the non-conductive structure intervening. 4 . The sensor according to claim 3 , wherein the two output connectors are adjacent to each other on one face of the conductive structure with the non-conductive structure interposed therebetween. 5 . The sensor according to claim 1 , wherein each unit lattice includes the plurality of columnar beams, each radially extending from one point in the lattice toward a lattice point. 6 . The sensor according to claim 1 , wherein each unit lattice includes the plurality of columnar beams connecting adjacent lattice points to form a frame. 7 . A method for manufacturing the sensor according to claim 1 , comprising forming the sensor section by stacking using a 3D printer.

Assignees

Inventors

Classifications

  • G01L1/20Primary

    by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids (of piezo-resistive materials G01L1/18); by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress · CPC title

  • Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes · CPC title

  • using variations in ohmic resistance · CPC title

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Frequently asked questions

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What does patent US2023349777A1 cover?
A sensor includes: a sensor section including a conductive structure made up of a three-dimensionally continuous unit lattices, each including a plurality of columnar beams; and output connectors that output a resistance value of the sensor section, the resistance value changing at least when the conductive structure is compressed by an external force. A method for manufacturing a sensor includ…
Who is the assignee on this patent?
Mercari Inc, Univ Tokyo
What technology area does this patent fall under?
Primary CPC classification G01L1/20. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Nov 02 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).