Integrated vapor chamber and heat sink

Patent metadata

Field	Value
Publication number	US-2023337397-A1
Application number	US-202016995679-A
Country	US
Kind code	A1
Filing date	Aug 17, 2020
Priority date	Aug 17, 2020
Publication date	Oct 19, 2023
Grant date	—

Abstract

In an embodiment, an integrated vapor chamber and heatsink includes a heatsink portion and a vapor chamber portion. The vapor chamber portion is configured to interface with a heat source to be cooled, where the vapor chamber portion includes, on an internal surface of the vapor chamber portion, a wicking structure configured to transfer a working fluid within the vapor chamber portion. The heatsink portion, the vapor chamber portion, and the wicking structure are portions of a same single printed monobody structure.

First claim

What is claimed is:

1 . A device comprising:
a heatsink portion including a plurality of horizontal fins and a plurality of vertical fins forming a grid structure, wherein at least one fin of the plurality of horizontal fins and the plurality of vertical fins has a thickness of between 0.15 mm and 0.2 mm; and a vapor chamber portion configured to interface with a heat source to be cooled, wherein the vapor chamber portion includes, on a plurality of internal surfaces of the vapor chamber portion, a wicking structure configured to transfer a working fluid within the vapor chamber portion; wherein the heatsink portion, the vapor chamber portion, and the wicking structure are portions of a same single printed monobody structure.

2 . The device of claim 1 , wherein the single printed monobody structure was printed using Direct Metal Laser Sintering.

3 . The device of claim 1 , wherein a first side of the vapor chamber portion is configured to interface the heat source and a second side of the vapor chamber portion opposite the first side is configured to interface with the heatsink portion.

4 . (canceled)

5 . The device of claim 1 , wherein a top portion of the heatsink portion at least in part encloses the grid structure.

6 . The device of claim 1 , wherein the vapor chamber portion includes at least one slot to evacuate metal powder.

7 . The device of claim 1 , wherein the vapor chamber portion includes a charging port by which the vapor chamber portion is vacuum charged.

8 . The device of claim 1 , wherein the vapor chamber portion includes a plurality of support structures.

9 . The device of claim 1 , wherein the wicking structure includes grooved channels adapted to transport the working fluid.

10 . The device of claim 1 , wherein the wicking structure includes a mesh.

11 . The device of claim 1 , wherein at least one of the heatsink portion and the vapor chamber portion is copper.

12 . The device of claim 1 , wherein at least one of the heatsink portion and the vapor chamber portion is aluminum.

13 . The device of claim 1 , wherein at least a portion of the heatsink portion is made of a different material from at least a portion of a body of the vapor chamber portion.

14 . The device of claim 1 , wherein the heatsink portion includes a fin gap between 0.6 mm and 1.1 mm.

15 . The device of claim 1 , wherein the wicking structure is made by sintering metal powder particles.

16 . A method, comprising:
applying metal powder; sintering the applied metal powder to form a layer in a monobody integrated heatsink and vapor chamber structure, wherein a vapor chamber portion of the monobody structure includes on an internal surface of the vapor chamber portion a wicking structure configured to transfer a working fluid within the vapor chamber portion; performing a stress relief cycle; removing excess parts; and machining to create a flat surface on a bottom of the monobody integrated heatsink and vapor chamber structure.

17 . The method of claim 16 , wherein performing the stress relief cycle includes:
removing the monobody integrated heatsink and vapor chamber structure from a fabrication piston; and heating the monobody integrated heatsink and vapor chamber structure.

18 . The method of claim 16 , wherein removing excess parts includes evacuating trapped metal powder from the vapor chamber portion via a slot in the vapor chamber.

19 . The method of claim 16 , further comprising charging and sealing the vapor chamber portion.

20 . A device, comprising:
a plurality of vertical fins arranged adjacent to each other with less than a 1.1 mm gap between adjacent fins; a plurality of horizontal fins in thermal communication with the plurality of vertical fins and interleaved with the plurality of vertical fins to form a grid structure; and a wicking structure provided on a plurality of internal surfaces of a vapor chamber portion, the vapor chamber portion configured to interface with the plurality of vertical fins and the plurality of horizontal fins; wherein:
at least one fin of the plurality of horizontal fins and the plurality of vertical fins has a thickness of between 0.15 mm and 0.2 mm, and
the device has been manufactured using three-dimensional printing.

Assignees

• Meta Platforms Inc

Inventors

• Athavale Jayati
• Nikoukar Mohammad
• Kabbani Hussameddine
• Termehyousefi Amin
• De Los Santos Riocard
• Udo-Akang Jones

Classifications

• H05K7/20309 Primary

  Evaporators · CPC title

• H05K7/205

  Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title

• F28D15/0233

  the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title

• F28D15/0283

  Means for filling or sealing heat pipes · CPC title

• F28D15/046 Primary

  characterised by the material or the construction of the capillary structure · CPC title