Manufacturing method of multilayer ceramic electronic device

US2023326680A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023326680-A1
Application numberUS-202318327805-A
CountryUS
Kind codeA1
Filing dateJun 1, 2023
Priority dateOct 30, 2020
Publication dateOct 12, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A manufacturing method of a multilayer ceramic electronic device includes: forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au; forming a multilayer structure by stacking the each of stack units; and firing the multilayer structure, whereby each internal electrode layer is formed from the each of internal electrode patterns and each dielectric layer is formed from the each of the dielectric green sheets wherein, in the each internal electrode layer, an Au concentration near each interface between the each internal electrode layer and the each dielectric layer is larger than an Au concentration in each center portion in a thickness direction.

First claim

Opening claim text (preview).

1 . A manufacturing method of a multilayer ceramic electronic device, comprising: forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au; forming a multilayer structure by stacking the each of stack units; and firing the multilayer structure, whereby each internal electrode layer is formed from the each of internal electrode patterns and each dielectric layer is formed from the each of the dielectric green sheets wherein, in the each internal electrode layer, an Au concentration near each interface between the each internal electrode layer and the each dielectric layer is larger than an Au concentration in each center portion in a thickness direction. 2 . The manufacturing method as claimed in claim 1 , wherein, in the forming of the each of stack units, the each of internal electrode patterns is formed on the each of dielectric green sheet by a vacuum deposition process. 3 . The manufacturing method as claimed in claim 1 , wherein a total content of Sn and Au relative to Ni in the each internal electrode layer is 0.01 at % or more and 95 at % or less. 4 . The manufacturing method as claimed in claim 1 , wherein a total content of Sn and Au relative to Ni in the each internal electrode layer is 0.2 at % or more and 10 at % or less. 5 . The manufacturing method as claimed in claim 1 , wherein a content of Au is smaller than a content of Sn in the each internal electrode layer. 6 . The manufacturing method as claimed in claim 1 , wherein, in the each internal electrode layer, a Sn concentration near the each interface is larger than a Sn concentration in the each center portion.

Assignees

Inventors

Classifications

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • H01G4/008Primary

    Selection of materials · CPC title

  • based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

  • based on BaTiO3 perovskite phase · CPC title

  • Form of non-self-supporting electrodes · CPC title

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What does patent US2023326680A1 cover?
A manufacturing method of a multilayer ceramic electronic device includes: forming each of stack units by forming each of internal electrode patterns on each of dielectric green sheets, the each of internal electrode patterns including Ni, Sn and Au; forming a multilayer structure by stacking the each of stack units; and firing the multilayer structure, whereby each internal electrode layer is …
Who is the assignee on this patent?
Taiyo Yuden Kk
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Oct 12 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).