Dust core and magnetic component

US2023317334A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2023317334-A1
Application numberUS-202318128273-A
CountryUS
Kind codeA1
Filing dateMar 30, 2023
Priority dateMar 31, 2022
Publication dateOct 5, 2023
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A dust core including soft magnetic metal particles and a grain boundary phase, wherein the grain boundary phase includes Si and Ti.

First claim

Opening claim text (preview).

1 . A dust core comprising soft magnetic metal particles and a grain boundary phase, wherein the grain boundary phase includes Si and Ti. 2 . The dust core according to claim 1 , wherein an amount ratio of Ti in the grain boundary phase is within a range of 100 ppm or more and 3000 ppm or less by mass with respect to the dust core. 3 . The dust core according to claim 1 , wherein at least one soft magnetic metal particle of the soft magnetic metal particles includes Fe. 4 . The dust core according to claim 1 , wherein at least one soft magnetic metal particle of the soft magnetic metal particles comprises a core particle and an insulation layer formed on a surface of the core particle. 5 . The dust core according to claim 4 , wherein the insulation layer includes an oxide of Si. 6 . The dust core according to claim 4 , wherein the insulation layer includes Ti and an oxide of Si. 7 . The dust core according to claim 4 , wherein the core particle includes Fe. 8 . A magnetic component including the dust core according to claim 1 . 9 . The dust core according to claim 1 , wherein the grain boundary phase further includes a resin including Si, and Ti is mixed with the resin including Si. 10 . The dust core according to claim 9 , wherein the resin including Si is a methyl-based silicone resin. 11 . The dust core according to claim 9 , wherein the grain boundary phase further includes an epoxy resin, an imide resin, Si—O-based oxides, Ca—O-based oxides, Ba—O-based oxides, and/or Bi—O-based oxides. 12 . The dust core according to claim 1 , wherein an amount of the soft magnetic metal particles in the dust core is within a range of 90 wt % to 99.9 wt %. 13 . The dust core according to claim 4 , wherein a thickness of the insulation layer is in a range of 5 nm or more and 500 nm or less. 14 . The dust core according to claim 4 , wherein a layer other than the insulation layer exists between the insulation layer and the surface of the core particle. 15 . The dust core according to claim 14 , wherein the layer other than the insulation layer has a thickness of 20 nm or less. 16 . The dust core according to claim 6 , wherein the insulation layer further includes at least one element selected from the group consisting of Ba, Ca, Mg, Al, Zr, Ni, Mn, and Zn, and a total amount ratio of the at least one element is 1 mol % or less with respect to an amount of Ti. 17 . The dust core according to claim 6 , wherein the oxide of Si is SiO 2 or a composite oxide which includes Si. 18 . The dust core according to claim 7 , wherein the core particle further includes Si, Ni, or Co.

Assignees

Inventors

Classifications

  • H01F1/24Primary

    the particles being insulated · CPC title

  • made from particles (H01F27/26 takes precedence) · CPC title

  • atomising using a fluid (using centrifugal force B22F9/10) · CPC title

  • Chemical treatment, e.g. passivation or decarburisation · CPC title

  • Thermal or thermo-mechanical treatment · CPC title

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Frequently asked questions

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What does patent US2023317334A1 cover?
A dust core including soft magnetic metal particles and a grain boundary phase, wherein the grain boundary phase includes Si and Ti.
Who is the assignee on this patent?
Tdk Corp
What technology area does this patent fall under?
Primary CPC classification H01F1/24. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Oct 05 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).