Power conversion device

Patent metadata

Field	Value
Publication number	US-2023309275-A1
Application number	US-202217877200-A
Country	US
Kind code	A1
Filing date	Jul 29, 2022
Priority date	Mar 24, 2022
Publication date	Sep 28, 2023
Grant date	—

Abstract

To obtain a power conversion device reduced in size and weight wherein heat generated from a capacity module is sufficiently dissipated, thus enabling prevention of a rise in the temperature of the capacity module. The power conversion device includes a first cooler which, having mounted thereon the capacity module, cools heat generated from the capacity module; a second cooler which, having mounted thereon a semiconductor module, cools heat generated from the semiconductor module; and a heat dissipation plate which, being thermally connected to the capacity module and to the second cooler, dissipates via the second cooler one portion of the heat generated from the capacity module, wherein the first and second coolers, being disposed so as to form a refrigerant flow path, both share a refrigerant.

First claim

What is claimed is:

1 . A power conversion device, comprising:
a first cooler which, having mounted thereon a capacity module, cools heat generated from the capacity module; a second cooler which, having mounted thereon a semiconductor module, cools heat generated from the semiconductor module; and a heat dissipation plate which, being thermally connected to the capacity module and to the second cooler, dissipates via the second cooler one portion of the heat generated from the capacity module, wherein the first and second coolers, being disposed so as to form a refrigerant flow path, both share a refrigerant.

2 . The power conversion device according to claim 1 , wherein
the heat dissipation plate, being a copper plate, is connected to the second cooler without via the first cooler.

3 . The power conversion device according to claim 1 , wherein
the heat dissipation plate is connected to the connecting portion of the second cooler connected to the first cooler.

4 . The power conversion device according to claim 1 , wherein
the heat dissipation plate is thermally connected to either or both the capacity module and the second cooler via an insulating member.

5 . The power conversion device according to claim 1 , wherein
the first thermal resistance of a first cooling pathway in which the heat, generated from the capacity module is dissipated from the second cooler to the refrigerant via the heat dissipation plate is lower than the second thermal resistance of a second cooling pathway in which the heat generated from the capacity module is dissipated from the first cooler to the refrigerant via the heat dissipation plate and the second cooler, or than the third thermal resistance of a third cooling pathway in which the heat generated from the capacity module is dissipated from the first cooler to the refrigerant via the heat dissipation plate.

6 . The power conversion device according to claim 1 , wherein
the second cooler is fixed to the first cooler together with the heat dissipation plate by a fixing member.

7 . The power conversion device according to claim 1 , wherein
the second cooler is provided on the first cooler via a seal member.

8 . The power conversion device according to claim 1 , wherein
the first cooler is a first casing having inside thereof the refrigerant or is a first heatsink which is of a metal, and the second cooler is a second heatsink having fins thereon.

9 . The power conversion device according to claim 8 , wherein
when the first cooler is the first casing, the first casing is formed of a metal alloy containing aluminum, and the second heatsink is formed of aluminum.

10 . The power conversion device according to claim 8 , wherein
when the first cooler is the first heatsink, a third cooler is further disposed which configures the refrigerant flow path together with the first and second coolers.

11 . The power conversion device according to claim 8 , wherein
when the first cooler is the first heatsink, the refrigerant flow path formed by the first and second coolers is in an open state, and the refrigerant is circulating air.

12 . The power conversion device according to claim 2 , wherein
the heat dissipation plate is connected to the connecting portion of the second cooler connected to the first cooler.

13 . The power conversion device according to claim 2 , wherein
the heat dissipation plate is thermally connected to either or both the capacity module and the second cooler via an insulating member.

14 . The power conversion device according to claim 2 , wherein
the first thermal resistance of a first cooling pathway in which the heat generated from the capacity module is dissipated from the second cooler to the refrigerant via the heat dissipation plate is lower than the second thermal resistance of a second cooling pathway in which the heat generated from the capacity module is dissipated from the first cooler to the refrigerant via the heat dissipation plate and the second cooler, or than the third thermal resistance of a third cooling pathway in which the heat generated from the capacity module is dissipated from the first cooler to the refrigerant via the heat dissipation plate.

15 . The power conversion device according to claim 2 , wherein
the second cooler is fixed to the first cooler together with the heat dissipation plate by fixing member.

16 . The power conversion device according to claim 2 , wherein
the second cooler is provided on the first cooler via a seal member.

17 . The power conversion device according to claim 2 , wherein
the first cooler is a first casing having inside thereof the refrigerant or is a first heatsink which is of a metal, and the second cooler is a second heatsink having fins thereon.

18 . The power conversion device according to claim 17 , wherein
when the first cooler is the first casing, the first casing is formed of a metal alloy containing aluminum, and the second heatsink is formed of aluminum.

19 . The power conversion device according to claim 17 , wherein
when the first cooler is the first heatsink, a third cooler is further disposed which configures the refrigerant flow path together with the first and second coolers.

20 . The power conversion device according to claim 17 , wherein
when the first cooler is the first heatsink, the refrigerant flow path formed by the first and second coolers is in an open state, and the refrigerant is circulating air.

Assignees

• Mitsubishi Electric Corp

Inventors

• Daigo Toru
• Iwakiri Taisuke
• Ochiai Katsuyuki

Classifications

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H05K7/20909

  Forced ventilation, e.g. on heat dissipaters coupled to components · CPC title

• H05K5/04

  Metal casings · CPC title

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H02M1/00 Primary

  Details of apparatus for conversion · CPC title