Electrical contact for implantable medical device
US-2015375002-A1 · Dec 31, 2015 · US
Terminal material for connector
US2023299548A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2023299548-A1 |
| Application number | US-202118017207-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 24, 2021 |
| Priority date | Jul 22, 2020 |
| Publication date | Sep 21, 2023 |
| Grant date | — |
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- Title
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Abstract
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A base material at least a surface is made of copper or copper alloy and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material are provided; the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 μm or more and 20.0 μm or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass or more and 1.00% by mass or less; and an average crystal grain size of the silver-nickel-potassium alloy plating layer is preferably 10 nm or more and 150 nm or less.
First claim
Opening claim text (preview).
1 . A terminal material for a connector comprising a base material at least a surface is made of copper or copper alloy, and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material, wherein the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 μm or more and 20.0 μm or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass or more and 1.00% by mass or less. 2 . The terminal material for a connector according to claim 1 , wherein an average crystal grain size of the silver-nickel-potassium alloy plating layer is 10 nm or more and 150 nm or less. 3 . The terminal material for a connector according to claim 1 , further comprising a silver-plating layer having a purity of silver 99.0% by mass or more excepting C, H, S, O, and N which are gas components with a film thickness of 0.1 μm or more and 5.0 μm or less on at least a part of the silver-nickel-potassium alloy plating layer. 4 . The terminal material for a connector according to claim 1 , wherein a nickel-plating layer made of nickel or nickel alloy with a film thickness of 0.2 μm or more and 5.0 μm or less is formed between the base material and the silver-nickel-potassium alloy plating layer. 5 . The terminal material for a connector according to claim 2 , further comprising a silver-plating layer having a purity of silver 99.0% by mass or more excepting C, H, S, O, and N which are gas components with a film thickness of 0.1 μm or more and 5.0 μm or less on at least a part of the silver-nickel-potassium alloy plating layer. 6 . The terminal material for a connector according to claim 2 , wherein a nickel-plating layer made of nickel or nickel alloy with a film thickness of 0.2 μm or more and 5.0 μm or less is formed between the base material and the silver-nickel-potassium alloy plating layer. 7 . The terminal material for a connector according to claim 3 , wherein a nickel-plating layer made of nickel or nickel alloy with a film thickness of 0.2 μm or more and 5.0 μm or less is formed between the base material and the silver-nickel-potassium alloy plating layer.
Assignees
Inventors
Classifications
Electroplating characterised by the article coated · CPC title
- H01R43/16Primary
for manufacturing contact members, e.g. by punching and by bending · CPC title
- H01R13/03Primary
characterised by the material, e.g. plating, or coating materials · CPC title
- C25D5/12Primary
at least one layer being of nickel or chromium · CPC title
containing more than 50% by weight of silver · CPC title
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Frequently asked questions
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- What does patent US2023299548A1 cover?
- A base material at least a surface is made of copper or copper alloy and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material are provided; the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 μm or more and 20.0 μm or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass…
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification H01R43/16. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Sep 21 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).